KR102162539B1 - 표시 장치 및 전자 기기 - Google Patents

표시 장치 및 전자 기기 Download PDF

Info

Publication number
KR102162539B1
KR102162539B1 KR1020157024427A KR20157024427A KR102162539B1 KR 102162539 B1 KR102162539 B1 KR 102162539B1 KR 1020157024427 A KR1020157024427 A KR 1020157024427A KR 20157024427 A KR20157024427 A KR 20157024427A KR 102162539 B1 KR102162539 B1 KR 102162539B1
Authority
KR
South Korea
Prior art keywords
wiring
layer
conductive layer
transistor
region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020157024427A
Other languages
English (en)
Korean (ko)
Other versions
KR20150122166A (ko
Inventor
히데아키 시시도
히로유키 미야케
세이코 이노우에
코헤이 도요타카
코지 구스노키
Original Assignee
가부시키가이샤 한도오따이 에네루기 켄큐쇼
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 한도오따이 에네루기 켄큐쇼 filed Critical 가부시키가이샤 한도오따이 에네루기 켄큐쇼
Publication of KR20150122166A publication Critical patent/KR20150122166A/ko
Application granted granted Critical
Publication of KR102162539B1 publication Critical patent/KR102162539B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362Active matrix addressed cells
    • G02F1/136286Wiring, e.g. gate line, drain line
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362Active matrix addressed cells
    • G02F1/136204Arrangements to prevent high voltage or static electricity failures
    • H01L27/1225
    • H01L27/124
    • H01L29/66
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D48/00Individual devices not covered by groups H10D1/00 - H10D44/00
    • H10D48/30Devices controlled by electric currents or voltages
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/421Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer
    • H10D86/423Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer comprising semiconductor materials not belonging to the Group IV, e.g. InGaZnO
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/441Interconnections, e.g. scanning lines
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/60Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices

Landscapes

  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Thin Film Transistor (AREA)
  • Liquid Crystal (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Electroluminescent Light Sources (AREA)
KR1020157024427A 2013-02-25 2014-02-20 표시 장치 및 전자 기기 Active KR102162539B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JPJP-P-2013-034877 2013-02-25
JP2013034877 2013-02-25
JPJP-P-2013-154400 2013-07-25
JP2013154400 2013-07-25
PCT/JP2014/054785 WO2014129669A1 (en) 2013-02-25 2014-02-20 Display device and electronic device

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020207018551A Division KR102208600B1 (ko) 2013-02-25 2014-02-20 표시 장치 및 전자 기기

Publications (2)

Publication Number Publication Date
KR20150122166A KR20150122166A (ko) 2015-10-30
KR102162539B1 true KR102162539B1 (ko) 2020-10-08

Family

ID=51387794

Family Applications (3)

Application Number Title Priority Date Filing Date
KR1020157024427A Active KR102162539B1 (ko) 2013-02-25 2014-02-20 표시 장치 및 전자 기기
KR1020207018551A Active KR102208600B1 (ko) 2013-02-25 2014-02-20 표시 장치 및 전자 기기
KR1020217002098A Active KR102295133B1 (ko) 2013-02-25 2014-02-20 반도체 장치

Family Applications After (2)

Application Number Title Priority Date Filing Date
KR1020207018551A Active KR102208600B1 (ko) 2013-02-25 2014-02-20 표시 장치 및 전자 기기
KR1020217002098A Active KR102295133B1 (ko) 2013-02-25 2014-02-20 반도체 장치

Country Status (5)

Country Link
US (1) US9482919B2 (enExample)
JP (7) JP6334950B2 (enExample)
KR (3) KR102162539B1 (enExample)
TW (1) TWI611566B (enExample)
WO (1) WO2014129669A1 (enExample)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8829528B2 (en) * 2011-11-25 2014-09-09 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device including groove portion extending beyond pixel electrode
US12150755B1 (en) * 2012-09-25 2024-11-26 Micro Mobio Corporation Integrated display with antenna system and method
US8981374B2 (en) * 2013-01-30 2015-03-17 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
CN103149764A (zh) * 2013-03-13 2013-06-12 京东方科技集团股份有限公司 一种薄膜晶体管阵列基板、显示装置及方法
KR101520433B1 (ko) * 2013-07-08 2015-05-14 주식회사 레이언스 이미지센서 및 이의 제조방법
JP6426402B2 (ja) * 2013-08-30 2018-11-21 株式会社半導体エネルギー研究所 表示装置
JP6360718B2 (ja) * 2014-05-16 2018-07-18 株式会社ジャパンディスプレイ 表示装置
TWI567950B (zh) * 2015-01-08 2017-01-21 群創光電股份有限公司 顯示面板
DE112016000030T5 (de) * 2015-04-13 2016-12-22 Semiconductor Energy Laboratory Co., Ltd. Anzeigefeld, Datenprozessor und Herstellungsverfahren für ein Anzeigefeld
CN105226071B (zh) * 2015-10-30 2018-06-05 京东方科技集团股份有限公司 一种显示基板及其制作方法、显示装置
US10714633B2 (en) * 2015-12-15 2020-07-14 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and display device
CN105390118A (zh) * 2015-12-28 2016-03-09 武汉华星光电技术有限公司 显示面板与阵列栅极驱动电路以及显示面板的布局方法
US10032917B1 (en) * 2016-07-08 2018-07-24 Boe Technology Group Co., Ltd. Thin film transistor, gate drive on array and display apparatus having the same, and fabricating method thereof
KR102458660B1 (ko) 2016-08-03 2022-10-26 가부시키가이샤 한도오따이 에네루기 켄큐쇼 표시 장치 및 전자 기기
TWI880886B (zh) 2016-10-07 2025-04-21 日商半導體能源研究所股份有限公司 顯示裝置及電子裝置
US10147718B2 (en) * 2016-11-04 2018-12-04 Dpix, Llc Electrostatic discharge (ESD) protection for the metal oxide medical device products
CN110073207A (zh) * 2016-11-14 2019-07-30 博洛尼亚大学阿尔玛母校研究室 敏感场效应器件及其制造方法
JP6949557B2 (ja) * 2017-05-25 2021-10-13 キヤノン株式会社 撮像装置、撮像システム、移動体
KR102385105B1 (ko) * 2018-02-27 2022-04-08 삼성전자주식회사 크랙 검출용 칩 및 이를 이용한 크랙 검출 방법
DE102018105927B4 (de) * 2018-03-14 2024-05-08 Bcs Automotive Interface Solutions Gmbh Berührungsempfindliches Bedienelement mit einer Lichtquelle, einem Dekorteil und dazwischen einer Lage aus mehreren Leitern, die zwei Bereiche unterschiedlicher Lichtdurchlässigkeit besitzt
US12463322B1 (en) 2019-04-03 2025-11-04 Micro Mobio Corporation Antenna in display
JPWO2020229917A1 (enExample) 2019-05-10 2020-11-19
JP7263120B2 (ja) * 2019-05-23 2023-04-24 株式会社ジャパンディスプレイ 表示装置及び表示パネル
KR102887191B1 (ko) * 2020-04-16 2025-11-17 삼성디스플레이 주식회사 표시 장치
CN112505961B (zh) * 2020-12-18 2023-07-25 深圳市华星光电半导体显示技术有限公司 显示装置及偏光片
WO2024147178A1 (ja) * 2023-01-05 2024-07-11 シャープディスプレイテクノロジー株式会社 表示装置

Family Cites Families (159)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60198861A (ja) 1984-03-23 1985-10-08 Fujitsu Ltd 薄膜トランジスタ
JPH0244256B2 (ja) 1987-01-28 1990-10-03 Kagaku Gijutsucho Mukizaishitsu Kenkyushocho Ingazn2o5deshimesarerurotsuhoshokeinosojokozoojusurukagobutsuoyobisonoseizoho
JPS63210023A (ja) 1987-02-24 1988-08-31 Natl Inst For Res In Inorg Mater InGaZn↓4O↓7で示される六方晶系の層状構造を有する化合物およびその製造法
JPH0244260B2 (ja) 1987-02-24 1990-10-03 Kagaku Gijutsucho Mukizaishitsu Kenkyushocho Ingazn5o8deshimesarerurotsuhoshokeinosojokozoojusurukagobutsuoyobisonoseizoho
JPH0244258B2 (ja) 1987-02-24 1990-10-03 Kagaku Gijutsucho Mukizaishitsu Kenkyushocho Ingazn3o6deshimesarerurotsuhoshokeinosojokozoojusurukagobutsuoyobisonoseizoho
JPH0244262B2 (ja) 1987-02-27 1990-10-03 Kagaku Gijutsucho Mukizaishitsu Kenkyushocho Ingazn6o9deshimesarerurotsuhoshokeinosojokozoojusurukagobutsuoyobisonoseizoho
JPH0244263B2 (ja) 1987-04-22 1990-10-03 Kagaku Gijutsucho Mukizaishitsu Kenkyushocho Ingazn7o10deshimesarerurotsuhoshokeinosojokozoojusurukagobutsuoyobisonoseizoho
JP2682997B2 (ja) * 1987-11-14 1997-11-26 株式会社日立製作所 補助容量付液晶表示装置及び補助容量付液晶表示装置の製造方法
JPH083592B2 (ja) * 1990-08-24 1996-01-17 松下電器産業株式会社 液晶表示装置
JPH04237025A (ja) * 1991-01-22 1992-08-25 Fujitsu Ltd 液晶表示装置の製造工程における静電気破壊防止方法
JP3357699B2 (ja) * 1992-02-21 2002-12-16 株式会社東芝 液晶表示装置
DE69319760T2 (de) * 1992-02-21 1999-02-11 International Business Machines Corp., Armonk, N.Y. Flüssigkristallanzeigevorrichtung
JPH05251705A (ja) 1992-03-04 1993-09-28 Fuji Xerox Co Ltd 薄膜トランジスタ
JPH06258665A (ja) * 1993-03-04 1994-09-16 Hitachi Ltd 液晶パネルの製造方法
JP3224064B2 (ja) * 1994-03-03 2001-10-29 三菱電機株式会社 薄膜トランジスタ基板とその製造方法及び液晶表示装置の製造方法
JP3479375B2 (ja) 1995-03-27 2003-12-15 科学技術振興事業団 亜酸化銅等の金属酸化物半導体による薄膜トランジスタとpn接合を形成した金属酸化物半導体装置およびそれらの製造方法
DE69635107D1 (de) 1995-08-03 2005-09-29 Koninkl Philips Electronics Nv Halbleiteranordnung mit einem transparenten schaltungselement
JP3625598B2 (ja) 1995-12-30 2005-03-02 三星電子株式会社 液晶表示装置の製造方法
JPH09197376A (ja) * 1996-01-11 1997-07-31 Casio Comput Co Ltd 半導体素子静電対策構造
KR0180829B1 (ko) * 1996-10-17 1999-04-01 이채우 포토에칭용 에칭저항제 조성물
JP3656076B2 (ja) * 1997-04-18 2005-06-02 シャープ株式会社 表示装置
JP4170454B2 (ja) 1998-07-24 2008-10-22 Hoya株式会社 透明導電性酸化物薄膜を有する物品及びその製造方法
JP2000150861A (ja) 1998-11-16 2000-05-30 Tdk Corp 酸化物薄膜
JP3276930B2 (ja) 1998-11-17 2002-04-22 科学技術振興事業団 トランジスタ及び半導体装置
US6576926B1 (en) * 1999-02-23 2003-06-10 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and fabrication method thereof
JP3800868B2 (ja) * 1999-06-22 2006-07-26 カシオ計算機株式会社 液晶表示装置
TW460731B (en) 1999-09-03 2001-10-21 Ind Tech Res Inst Electrode structure and production method of wide viewing angle LCD
JP4089858B2 (ja) 2000-09-01 2008-05-28 国立大学法人東北大学 半導体デバイス
KR20020038482A (ko) 2000-11-15 2002-05-23 모리시타 요이찌 박막 트랜지스터 어레이, 그 제조방법 및 그것을 이용한표시패널
JP4718677B2 (ja) 2000-12-06 2011-07-06 株式会社半導体エネルギー研究所 半導体装置及びその作製方法
JP3997731B2 (ja) 2001-03-19 2007-10-24 富士ゼロックス株式会社 基材上に結晶性半導体薄膜を形成する方法
JP2002289859A (ja) 2001-03-23 2002-10-04 Minolta Co Ltd 薄膜トランジスタ
JP3925839B2 (ja) 2001-09-10 2007-06-06 シャープ株式会社 半導体記憶装置およびその試験方法
JP4090716B2 (ja) * 2001-09-10 2008-05-28 雅司 川崎 薄膜トランジスタおよびマトリクス表示装置
JP4164562B2 (ja) 2002-09-11 2008-10-15 独立行政法人科学技術振興機構 ホモロガス薄膜を活性層として用いる透明薄膜電界効果型トランジスタ
WO2003040441A1 (fr) 2001-11-05 2003-05-15 Japan Science And Technology Agency Film mince monocristallin homologue a super-reseau naturel, procede de preparation et dispositif dans lequel est utilise ledit film mince monocristallin
JP4083486B2 (ja) 2002-02-21 2008-04-30 独立行政法人科学技術振興機構 LnCuO(S,Se,Te)単結晶薄膜の製造方法
JP3616603B2 (ja) * 2002-02-22 2005-02-02 Necライティング株式会社 放電灯及びその製造方法
CN1445821A (zh) 2002-03-15 2003-10-01 三洋电机株式会社 ZnO膜和ZnO半导体层的形成方法、半导体元件及其制造方法
JP3933591B2 (ja) 2002-03-26 2007-06-20 淳二 城戸 有機エレクトロルミネッセント素子
US7339187B2 (en) 2002-05-21 2008-03-04 State Of Oregon Acting By And Through The Oregon State Board Of Higher Education On Behalf Of Oregon State University Transistor structures
JP2004022625A (ja) 2002-06-13 2004-01-22 Murata Mfg Co Ltd 半導体デバイス及び該半導体デバイスの製造方法
US7105868B2 (en) 2002-06-24 2006-09-12 Cermet, Inc. High-electron mobility transistor with zinc oxide
US7067843B2 (en) 2002-10-11 2006-06-27 E. I. Du Pont De Nemours And Company Transparent oxide semiconductor thin film transistors
JP4166105B2 (ja) 2003-03-06 2008-10-15 シャープ株式会社 半導体装置およびその製造方法
JP2004273732A (ja) 2003-03-07 2004-09-30 Sharp Corp アクティブマトリクス基板およびその製造方法
JP4108633B2 (ja) 2003-06-20 2008-06-25 シャープ株式会社 薄膜トランジスタおよびその製造方法ならびに電子デバイス
US7262463B2 (en) 2003-07-25 2007-08-28 Hewlett-Packard Development Company, L.P. Transistor including a deposited channel region having a doped portion
US7145174B2 (en) 2004-03-12 2006-12-05 Hewlett-Packard Development Company, Lp. Semiconductor device
US7282782B2 (en) 2004-03-12 2007-10-16 Hewlett-Packard Development Company, L.P. Combined binary oxide semiconductor device
CN102867855B (zh) 2004-03-12 2015-07-15 独立行政法人科学技术振兴机构 薄膜晶体管及其制造方法
US7297977B2 (en) 2004-03-12 2007-11-20 Hewlett-Packard Development Company, L.P. Semiconductor device
US7211825B2 (en) 2004-06-14 2007-05-01 Yi-Chi Shih Indium oxide-based thin film transistors and circuits
JP2006100760A (ja) 2004-09-02 2006-04-13 Casio Comput Co Ltd 薄膜トランジスタおよびその製造方法
US7285501B2 (en) 2004-09-17 2007-10-23 Hewlett-Packard Development Company, L.P. Method of forming a solution processed device
US7298084B2 (en) 2004-11-02 2007-11-20 3M Innovative Properties Company Methods and displays utilizing integrated zinc oxide row and column drivers in conjunction with organic light emitting diodes
US7863611B2 (en) 2004-11-10 2011-01-04 Canon Kabushiki Kaisha Integrated circuits utilizing amorphous oxides
KR100889796B1 (ko) 2004-11-10 2009-03-20 캐논 가부시끼가이샤 비정질 산화물을 사용한 전계 효과 트랜지스터
WO2006051994A2 (en) 2004-11-10 2006-05-18 Canon Kabushiki Kaisha Light-emitting device
US7453065B2 (en) 2004-11-10 2008-11-18 Canon Kabushiki Kaisha Sensor and image pickup device
US7829444B2 (en) 2004-11-10 2010-11-09 Canon Kabushiki Kaisha Field effect transistor manufacturing method
CA2708335A1 (en) 2004-11-10 2006-05-18 Canon Kabushiki Kaisha Amorphous oxide and field effect transistor
US7791072B2 (en) 2004-11-10 2010-09-07 Canon Kabushiki Kaisha Display
US7579224B2 (en) 2005-01-21 2009-08-25 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing a thin film semiconductor device
TWI445178B (zh) 2005-01-28 2014-07-11 半導體能源研究所股份有限公司 半導體裝置,電子裝置,和半導體裝置的製造方法
TWI562380B (en) 2005-01-28 2016-12-11 Semiconductor Energy Lab Co Ltd Semiconductor device, electronic device, and method of manufacturing semiconductor device
US7858451B2 (en) 2005-02-03 2010-12-28 Semiconductor Energy Laboratory Co., Ltd. Electronic device, semiconductor device and manufacturing method thereof
US7948171B2 (en) 2005-02-18 2011-05-24 Semiconductor Energy Laboratory Co., Ltd. Light emitting device
US20060197092A1 (en) 2005-03-03 2006-09-07 Randy Hoffman System and method for forming conductive material on a substrate
US8681077B2 (en) 2005-03-18 2014-03-25 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, and display device, driving method and electronic apparatus thereof
WO2006105077A2 (en) 2005-03-28 2006-10-05 Massachusetts Institute Of Technology Low voltage thin film transistor with high-k dielectric material
US7645478B2 (en) 2005-03-31 2010-01-12 3M Innovative Properties Company Methods of making displays
US8300031B2 (en) 2005-04-20 2012-10-30 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device comprising transistor having gate and drain connected through a current-voltage conversion element
JP2006344849A (ja) 2005-06-10 2006-12-21 Casio Comput Co Ltd 薄膜トランジスタ
US7691666B2 (en) 2005-06-16 2010-04-06 Eastman Kodak Company Methods of making thin film transistors comprising zinc-oxide-based semiconductor materials and transistors made thereby
US7402506B2 (en) 2005-06-16 2008-07-22 Eastman Kodak Company Methods of making thin film transistors comprising zinc-oxide-based semiconductor materials and transistors made thereby
US7507618B2 (en) 2005-06-27 2009-03-24 3M Innovative Properties Company Method for making electronic devices using metal oxide nanoparticles
KR100711890B1 (ko) 2005-07-28 2007-04-25 삼성에스디아이 주식회사 유기 발광표시장치 및 그의 제조방법
KR100822524B1 (ko) * 2005-08-02 2008-04-15 엡슨 이미징 디바이스 가부시키가이샤 전기 광학 장치 및 전자기기
JP4039446B2 (ja) 2005-08-02 2008-01-30 エプソンイメージングデバイス株式会社 電気光学装置及び電子機器
JP2007059128A (ja) 2005-08-23 2007-03-08 Canon Inc 有機el表示装置およびその製造方法
JP4280736B2 (ja) 2005-09-06 2009-06-17 キヤノン株式会社 半導体素子
JP5116225B2 (ja) 2005-09-06 2013-01-09 キヤノン株式会社 酸化物半導体デバイスの製造方法
JP4850457B2 (ja) 2005-09-06 2012-01-11 キヤノン株式会社 薄膜トランジスタ及び薄膜ダイオード
JP2007073705A (ja) 2005-09-06 2007-03-22 Canon Inc 酸化物半導体チャネル薄膜トランジスタおよびその製造方法
EP3614442A3 (en) 2005-09-29 2020-03-25 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device having oxide semiconductor layer and manufactoring method thereof
JP5037808B2 (ja) 2005-10-20 2012-10-03 キヤノン株式会社 アモルファス酸化物を用いた電界効果型トランジスタ、及び該トランジスタを用いた表示装置
KR101112655B1 (ko) 2005-11-15 2012-02-16 가부시키가이샤 한도오따이 에네루기 켄큐쇼 액티브 매트릭스 디스플레이 장치 및 텔레비전 수신기
TWI292281B (en) 2005-12-29 2008-01-01 Ind Tech Res Inst Pixel structure of active organic light emitting diode and method of fabricating the same
US7867636B2 (en) 2006-01-11 2011-01-11 Murata Manufacturing Co., Ltd. Transparent conductive film and method for manufacturing the same
JP4977478B2 (ja) 2006-01-21 2012-07-18 三星電子株式会社 ZnOフィルム及びこれを用いたTFTの製造方法
US7576394B2 (en) 2006-02-02 2009-08-18 Kochi Industrial Promotion Center Thin film transistor including low resistance conductive thin films and manufacturing method thereof
US7977169B2 (en) 2006-02-15 2011-07-12 Kochi Industrial Promotion Center Semiconductor device including active layer made of zinc oxide with controlled orientations and manufacturing method thereof
KR20070101595A (ko) 2006-04-11 2007-10-17 삼성전자주식회사 ZnO TFT
US20070252928A1 (en) 2006-04-28 2007-11-01 Toppan Printing Co., Ltd. Structure, transmission type liquid crystal display, reflection type display and manufacturing method thereof
JP5028033B2 (ja) 2006-06-13 2012-09-19 キヤノン株式会社 酸化物半導体膜のドライエッチング方法
JP4999400B2 (ja) 2006-08-09 2012-08-15 キヤノン株式会社 酸化物半導体膜のドライエッチング方法
JP4609797B2 (ja) 2006-08-09 2011-01-12 Nec液晶テクノロジー株式会社 薄膜デバイス及びその製造方法
JP4332545B2 (ja) 2006-09-15 2009-09-16 キヤノン株式会社 電界効果型トランジスタ及びその製造方法
JP5164357B2 (ja) 2006-09-27 2013-03-21 キヤノン株式会社 半導体装置及び半導体装置の製造方法
JP4274219B2 (ja) 2006-09-27 2009-06-03 セイコーエプソン株式会社 電子デバイス、有機エレクトロルミネッセンス装置、有機薄膜半導体装置
US7622371B2 (en) 2006-10-10 2009-11-24 Hewlett-Packard Development Company, L.P. Fused nanocrystal thin film semiconductor and method
US7772021B2 (en) 2006-11-29 2010-08-10 Samsung Electronics Co., Ltd. Flat panel displays comprising a thin-film transistor having a semiconductive oxide in its channel and methods of fabricating the same for use in flat panel displays
JP2008140684A (ja) 2006-12-04 2008-06-19 Toppan Printing Co Ltd カラーelディスプレイおよびその製造方法
KR101303578B1 (ko) 2007-01-05 2013-09-09 삼성전자주식회사 박막 식각 방법
US8207063B2 (en) 2007-01-26 2012-06-26 Eastman Kodak Company Process for atomic layer deposition
JP5521270B2 (ja) * 2007-02-21 2014-06-11 凸版印刷株式会社 薄膜トランジスタアレイ、薄膜トランジスタアレイの製造方法、および薄膜トランジスタアレイを用いたアクティブマトリクス型ディスプレイ
KR100851215B1 (ko) 2007-03-14 2008-08-07 삼성에스디아이 주식회사 박막 트랜지스터 및 이를 이용한 유기 전계 발광표시장치
US7795613B2 (en) 2007-04-17 2010-09-14 Toppan Printing Co., Ltd. Structure with transistor
KR101325053B1 (ko) 2007-04-18 2013-11-05 삼성디스플레이 주식회사 박막 트랜지스터 기판 및 이의 제조 방법
KR20080094300A (ko) 2007-04-19 2008-10-23 삼성전자주식회사 박막 트랜지스터 및 그 제조 방법과 박막 트랜지스터를포함하는 평판 디스플레이
KR101334181B1 (ko) 2007-04-20 2013-11-28 삼성전자주식회사 선택적으로 결정화된 채널층을 갖는 박막 트랜지스터 및 그제조 방법
US8274078B2 (en) 2007-04-25 2012-09-25 Canon Kabushiki Kaisha Metal oxynitride semiconductor containing zinc
KR101345376B1 (ko) 2007-05-29 2013-12-24 삼성전자주식회사 ZnO 계 박막 트랜지스터 및 그 제조방법
KR101375831B1 (ko) * 2007-12-03 2014-04-02 삼성전자주식회사 산화물 반도체 박막 트랜지스터를 이용한 디스플레이 장치
US8202365B2 (en) 2007-12-17 2012-06-19 Fujifilm Corporation Process for producing oriented inorganic crystalline film, and semiconductor device using the oriented inorganic crystalline film
JP5156542B2 (ja) * 2008-08-25 2013-03-06 三菱電機株式会社 Tft基板及びその製造方法
KR101644406B1 (ko) 2008-09-12 2016-08-01 가부시키가이샤 한도오따이 에네루기 켄큐쇼 표시 장치
EP2327069A4 (en) 2008-09-12 2013-03-20 Semiconductor Energy Lab DISPLAY DEVICE
JP4623179B2 (ja) 2008-09-18 2011-02-02 ソニー株式会社 薄膜トランジスタおよびその製造方法
KR101507324B1 (ko) 2008-09-19 2015-03-31 가부시키가이샤 한도오따이 에네루기 켄큐쇼 표시 장치
WO2010032638A1 (en) 2008-09-19 2010-03-25 Semiconductor Energy Laboratory Co., Ltd. Display device
EP2172804B1 (en) 2008-10-03 2016-05-11 Semiconductor Energy Laboratory Co, Ltd. Display device
KR101803720B1 (ko) 2008-10-03 2017-12-01 가부시키가이샤 한도오따이 에네루기 켄큐쇼 표시 장치
CN101719493B (zh) 2008-10-08 2014-05-14 株式会社半导体能源研究所 显示装置
JP5451280B2 (ja) 2008-10-09 2014-03-26 キヤノン株式会社 ウルツ鉱型結晶成長用基板およびその製造方法ならびに半導体装置
JP2010177223A (ja) * 2009-01-27 2010-08-12 Videocon Global Ltd 液晶表示装置及びその製造方法
CN101847648B (zh) * 2009-03-23 2012-11-21 北京京东方光电科技有限公司 有源矩阵有机发光二极管像素结构及其制造方法
KR101739154B1 (ko) * 2009-07-17 2017-05-23 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 그 제조 방법
TWI604594B (zh) * 2009-08-07 2017-11-01 半導體能源研究所股份有限公司 半導體裝置及包括該半導體裝置之電話、錶、和顯示裝置
EP2477171A4 (en) 2009-09-11 2013-10-23 Sharp Kk ACTIVE MATRIX SUBSTRATE AND DISPLAY DEVICE
KR101301461B1 (ko) * 2009-09-16 2013-08-29 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 산화물 반도체층
KR102321565B1 (ko) * 2009-09-24 2021-11-05 가부시키가이샤 한도오따이 에네루기 켄큐쇼 산화물 반도체막 및 반도체 장치
WO2011037008A1 (en) 2009-09-24 2011-03-31 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing oxide semiconductor film and method for manufacturing semiconductor device
KR102145488B1 (ko) 2009-10-09 2020-08-18 가부시키가이샤 한도오따이 에네루기 켄큐쇼 표시 장치
WO2011046048A1 (en) 2009-10-16 2011-04-21 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
KR101837102B1 (ko) 2009-10-30 2018-03-09 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
KR102008769B1 (ko) * 2009-11-27 2019-08-09 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 반도체 장치의 제작방법
JP5504866B2 (ja) * 2009-12-10 2014-05-28 セイコーエプソン株式会社 電気泳動表示装置、電子機器および電気光学装置の製造方法
KR101768433B1 (ko) * 2009-12-18 2017-08-16 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 제작 방법
JP2011138934A (ja) 2009-12-28 2011-07-14 Sony Corp 薄膜トランジスタ、表示装置および電子機器
JP5370189B2 (ja) * 2010-02-04 2013-12-18 セイコーエプソン株式会社 電気光学装置用基板、電気光学装置及び電子機器
JP2011186216A (ja) * 2010-03-09 2011-09-22 Hitachi Displays Ltd 液晶表示装置及びその製造方法
TWI431384B (zh) * 2010-03-10 2014-03-21 Prime View Int Co Ltd 一種畫素的結構及其製程方法
KR102292523B1 (ko) 2010-04-02 2021-08-20 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
KR101276483B1 (ko) * 2010-05-13 2013-06-18 샤프 가부시키가이샤 회로 기판 및 표시 장치
WO2011148537A1 (ja) * 2010-05-24 2011-12-01 シャープ株式会社 薄膜トランジスタ基板及びその製造方法
WO2011155295A1 (en) * 2010-06-10 2011-12-15 Semiconductor Energy Laboratory Co., Ltd. Dc/dc converter, power supply circuit, and semiconductor device
KR101783352B1 (ko) * 2010-06-17 2017-10-10 삼성디스플레이 주식회사 평판 표시 장치 및 그 제조 방법
US8871565B2 (en) 2010-09-13 2014-10-28 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
US20120064665A1 (en) 2010-09-13 2012-03-15 Semiconductor Energy Laboratory Co., Ltd. Deposition apparatus, apparatus for successive deposition, and method for manufacturing semiconductor device
KR101932576B1 (ko) 2010-09-13 2018-12-26 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 그 제작 방법
US9230994B2 (en) * 2010-09-15 2016-01-05 Semiconductor Energy Laboratory Co., Ltd. Liquid crystal display device
TWI562379B (en) 2010-11-30 2016-12-11 Semiconductor Energy Lab Co Ltd Semiconductor device and method for manufacturing semiconductor device
US8536571B2 (en) 2011-01-12 2013-09-17 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method of semiconductor device
JP2012160679A (ja) * 2011-02-03 2012-08-23 Sony Corp 薄膜トランジスタ、表示装置および電子機器
JP5766481B2 (ja) * 2011-03-29 2015-08-19 株式会社Joled 表示装置および電子機器
DE112013002407B4 (de) 2012-05-10 2024-05-08 Semiconductor Energy Laboratory Co., Ltd. Halbleitervorrichtung
CN103208506A (zh) * 2013-03-28 2013-07-17 京东方科技集团股份有限公司 阵列基板、显示装置及制作方法

Also Published As

Publication number Publication date
KR102208600B1 (ko) 2021-01-28
US9482919B2 (en) 2016-11-01
US20140240631A1 (en) 2014-08-28
JP2023065489A (ja) 2023-05-12
JP2019207417A (ja) 2019-12-05
JP6556289B2 (ja) 2019-08-07
JP6960014B2 (ja) 2021-11-05
JP2015043064A (ja) 2015-03-05
WO2014129669A1 (en) 2014-08-28
JP2022020648A (ja) 2022-02-01
KR20150122166A (ko) 2015-10-30
JP2018151649A (ja) 2018-09-27
JP2020170168A (ja) 2020-10-15
JP6334950B2 (ja) 2018-05-30
KR102295133B1 (ko) 2021-08-31
KR20200080335A (ko) 2020-07-06
TW201436177A (zh) 2014-09-16
TWI611566B (zh) 2018-01-11
JP2025029175A (ja) 2025-03-05
KR20210011074A (ko) 2021-01-29
JP6707699B2 (ja) 2020-06-10
JP7232880B2 (ja) 2023-03-03

Similar Documents

Publication Publication Date Title
KR102162539B1 (ko) 표시 장치 및 전자 기기
JP7709574B2 (ja) 表示装置
JP7079308B2 (ja) 半導体装置
US12536970B2 (en) Display device
TWI602249B (zh) 半導體裝置的製造方法
JP2024180432A (ja) 液晶表示装置
KR20190100230A (ko) 표시 장치 및 그 제작 방법

Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20150908

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20190220

Comment text: Request for Examination of Application

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20200428

Patent event code: PE09021S01D

PA0104 Divisional application for international application

Comment text: Divisional Application for International Patent

Patent event code: PA01041R01D

Patent event date: 20200626

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

Patent event code: PE07011S01D

Comment text: Decision to Grant Registration

Patent event date: 20200709

PR0701 Registration of establishment

Comment text: Registration of Establishment

Patent event date: 20200928

Patent event code: PR07011E01D

PR1002 Payment of registration fee

Payment date: 20200929

End annual number: 3

Start annual number: 1

PG1601 Publication of registration
PR1001 Payment of annual fee

Payment date: 20230822

Start annual number: 4

End annual number: 4

PR1001 Payment of annual fee

Payment date: 20240823

Start annual number: 5

End annual number: 5