KR102128752B1 - 증착 마스크, 증착 마스크 준비체, 증착 마스크의 제조 방법 및 유기 반도체 소자의 제조 방법 - Google Patents

증착 마스크, 증착 마스크 준비체, 증착 마스크의 제조 방법 및 유기 반도체 소자의 제조 방법 Download PDF

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KR102128752B1
KR102128752B1 KR1020187037203A KR20187037203A KR102128752B1 KR 102128752 B1 KR102128752 B1 KR 102128752B1 KR 1020187037203 A KR1020187037203 A KR 1020187037203A KR 20187037203 A KR20187037203 A KR 20187037203A KR 102128752 B1 KR102128752 B1 KR 102128752B1
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mask
metal
deposition mask
resin
deposition
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KR20190000905A (ko
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가츠나리 오바타
도시히코 다케다
히로시 가와사키
히로유키 니시무라
아츠시 마키
히로미츠 오치아이
요시노리 히로베
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다이니폰 인사츠 가부시키가이샤
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    • H01L51/56—
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C21/00—Accessories or implements for use in connection with applying liquids or other fluent materials to surfaces, not provided for in groups B05C1/00 - B05C19/00
    • B05C21/005—Masking devices
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/048—Coating on selected surface areas, e.g. using masks using irradiation by energy or particles
    • H01L21/203—
    • H01L51/0002—
    • H01L51/0011—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/20—Changing the shape of the active layer in the devices, e.g. patterning
    • H10K71/231—Changing the shape of the active layer in the devices, e.g. patterning by etching of existing layers
    • H01L2251/56—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)
KR1020187037203A 2013-03-26 2014-03-24 증착 마스크, 증착 마스크 준비체, 증착 마스크의 제조 방법 및 유기 반도체 소자의 제조 방법 Active KR102128752B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2013063295 2013-03-26
JPJP-P-2013-063295 2013-03-26
JP2014059432A JP5812139B2 (ja) 2013-03-26 2014-03-24 蒸着マスク、蒸着マスク準備体、蒸着マスクの製造方法、及び有機半導体素子の製造方法
JPJP-P-2014-059432 2014-03-24
PCT/JP2014/058045 WO2014157068A1 (ja) 2013-03-26 2014-03-24 蒸着マスク、蒸着マスク準備体、蒸着マスクの製造方法、及び有機半導体素子の製造方法

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KR1020187026571A Division KR101934244B1 (ko) 2013-03-26 2014-03-24 증착 마스크, 증착 마스크 준비체, 증착 마스크의 제조 방법 및 유기 반도체 소자의 제조 방법

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KR1020207018239A Division KR102218952B1 (ko) 2013-03-26 2014-03-24 증착 마스크, 증착 마스크 준비체, 증착 마스크의 제조 방법 및 유기 반도체 소자의 제조 방법

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KR20190000905A KR20190000905A (ko) 2019-01-03
KR102128752B1 true KR102128752B1 (ko) 2020-07-02

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KR1020187037203A Active KR102128752B1 (ko) 2013-03-26 2014-03-24 증착 마스크, 증착 마스크 준비체, 증착 마스크의 제조 방법 및 유기 반도체 소자의 제조 방법
KR1020157019139A Active KR101901004B1 (ko) 2013-03-26 2014-03-24 증착 마스크, 증착 마스크 준비체, 증착 마스크의 제조 방법 및 유기 반도체 소자의 제조 방법
KR1020187026571A Active KR101934244B1 (ko) 2013-03-26 2014-03-24 증착 마스크, 증착 마스크 준비체, 증착 마스크의 제조 방법 및 유기 반도체 소자의 제조 방법
KR1020207018239A Active KR102218952B1 (ko) 2013-03-26 2014-03-24 증착 마스크, 증착 마스크 준비체, 증착 마스크의 제조 방법 및 유기 반도체 소자의 제조 방법

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KR1020157019139A Active KR101901004B1 (ko) 2013-03-26 2014-03-24 증착 마스크, 증착 마스크 준비체, 증착 마스크의 제조 방법 및 유기 반도체 소자의 제조 방법
KR1020187026571A Active KR101934244B1 (ko) 2013-03-26 2014-03-24 증착 마스크, 증착 마스크 준비체, 증착 마스크의 제조 방법 및 유기 반도체 소자의 제조 방법
KR1020207018239A Active KR102218952B1 (ko) 2013-03-26 2014-03-24 증착 마스크, 증착 마스크 준비체, 증착 마스크의 제조 방법 및 유기 반도체 소자의 제조 방법

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US (4) US10597766B2 (enExample)
JP (1) JP5812139B2 (enExample)
KR (4) KR102128752B1 (enExample)
CN (1) CN105102668B (enExample)
TW (4) TWI671414B (enExample)
WO (1) WO2014157068A1 (enExample)

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CN109913802B (zh) * 2013-03-26 2021-12-21 大日本印刷株式会社 蒸镀掩模、带框架的蒸镀掩模、及它们的制造方法
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JP5780350B2 (ja) 2013-11-14 2015-09-16 大日本印刷株式会社 蒸着マスク、フレーム付き蒸着マスク、及び有機半導体素子の製造方法
JP6511908B2 (ja) * 2014-03-31 2019-05-15 大日本印刷株式会社 蒸着マスクの引張方法、フレーム付き蒸着マスクの製造方法、有機半導体素子の製造方法、及び引張装置
CN106795618B (zh) * 2014-10-15 2019-08-27 夏普株式会社 蒸镀掩模、蒸镀装置、蒸镀方法以及蒸镀掩模的制造方法
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CN210916231U (zh) * 2019-10-18 2020-07-03 昆山国显光电有限公司 一种掩膜版
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KR20220027353A (ko) * 2020-08-26 2022-03-08 삼성디스플레이 주식회사 마스크 및 마스크 제조방법
JP2022050818A (ja) * 2020-09-18 2022-03-31 凸版印刷株式会社 蒸着マスク、蒸着マスクの製造方法、および、表示装置の製造方法
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TWI757041B (zh) * 2021-01-08 2022-03-01 達運精密工業股份有限公司 遮罩
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