KR102055031B1 - 도전성 접착제 조성물, 도전성 접착필름, 접착방법 및 회로기판 - Google Patents
도전성 접착제 조성물, 도전성 접착필름, 접착방법 및 회로기판 Download PDFInfo
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- KR102055031B1 KR102055031B1 KR1020147034441A KR20147034441A KR102055031B1 KR 102055031 B1 KR102055031 B1 KR 102055031B1 KR 1020147034441 A KR1020147034441 A KR 1020147034441A KR 20147034441 A KR20147034441 A KR 20147034441A KR 102055031 B1 KR102055031 B1 KR 102055031B1
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- Prior art keywords
- conductive adhesive
- resin
- epoxy resin
- carboxyl group
- adhesive composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000853 adhesive Substances 0.000 title claims abstract description 66
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 66
- 239000000203 mixture Substances 0.000 title claims abstract description 58
- 239000002313 adhesive film Substances 0.000 title claims abstract description 41
- 238000000034 method Methods 0.000 title claims description 50
- 239000003822 epoxy resin Substances 0.000 claims abstract description 63
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 63
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims abstract description 55
- 229920005989 resin Polymers 0.000 claims abstract description 35
- 239000011347 resin Substances 0.000 claims abstract description 35
- 239000004925 Acrylic resin Substances 0.000 claims abstract description 26
- 229920005749 polyurethane resin Polymers 0.000 claims abstract description 26
- 239000007787 solid Substances 0.000 claims abstract description 19
- 239000012790 adhesive layer Substances 0.000 claims abstract description 17
- 125000003700 epoxy group Chemical group 0.000 claims abstract description 16
- 239000000945 filler Substances 0.000 claims abstract description 12
- 230000003014 reinforcing effect Effects 0.000 claims description 36
- 239000000758 substrate Substances 0.000 claims description 27
- 239000004593 Epoxy Substances 0.000 claims description 22
- 239000000463 material Substances 0.000 claims description 17
- 230000002787 reinforcement Effects 0.000 claims description 17
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 16
- 230000008569 process Effects 0.000 claims description 15
- 239000011231 conductive filler Substances 0.000 claims description 14
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 12
- 239000003795 chemical substances by application Substances 0.000 claims description 11
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- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 9
- 229910052709 silver Inorganic materials 0.000 claims description 7
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- 238000006243 chemical reaction Methods 0.000 description 35
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- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 6
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- DKGAVHZHDRPRBM-UHFFFAOYSA-N Tert-Butanol Chemical compound CC(C)(C)O DKGAVHZHDRPRBM-UHFFFAOYSA-N 0.000 description 6
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- RNLHGQLZWXBQNY-UHFFFAOYSA-N 3-(aminomethyl)-3,5,5-trimethylcyclohexan-1-amine Chemical compound CC1(C)CC(N)CC(C)(CN)C1 RNLHGQLZWXBQNY-UHFFFAOYSA-N 0.000 description 5
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 5
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- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 5
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 5
- 239000001257 hydrogen Substances 0.000 description 5
- 229910052739 hydrogen Inorganic materials 0.000 description 5
- 230000006872 improvement Effects 0.000 description 5
- 150000002513 isocyanates Chemical class 0.000 description 5
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 5
- 239000003505 polymerization initiator Substances 0.000 description 5
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- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 4
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- 239000010949 copper Substances 0.000 description 4
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 4
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- WYGWHHGCAGTUCH-UHFFFAOYSA-N 2-[(2-cyano-4-methylpentan-2-yl)diazenyl]-2,4-dimethylpentanenitrile Chemical compound CC(C)CC(C)(C#N)N=NC(C)(C#N)CC(C)C WYGWHHGCAGTUCH-UHFFFAOYSA-N 0.000 description 3
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
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KR102294673B1 (ko) | 2021-01-26 | 2021-08-27 | 88테크 주식회사 | 측쇄에 수산기와 카르복실기를 갖는 수지의 합성 방법과 그 수지를 포함하는 잉크 조성물의 제조방법 및 적용방법 |
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- 2013-06-28 JP JP2014522699A patent/JP5886957B2/ja active Active
- 2013-06-28 TW TW102123328A patent/TWI583769B/zh not_active IP Right Cessation
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- 2013-06-28 CN CN201380033353.5A patent/CN104379696B/zh not_active Expired - Fee Related
- 2013-06-28 WO PCT/JP2013/067776 patent/WO2014003159A1/ja active Application Filing
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Cited By (4)
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KR102210681B1 (ko) | 2019-12-30 | 2021-02-02 | 88테크 주식회사 | 접착성과 차폐기능을 가지는 전도성 접착 페이스트와 이를 이용한 fpcb의 전자파 차폐층 및 보강층 형성방법 |
KR102348525B1 (ko) | 2020-07-17 | 2022-01-07 | 88테크 주식회사 | 전도성 페이스트와 그 제조방법 및 이를 이용한 fpcb의 보강판 적층구조와 전자파 차폐층을 동시에 형성하는 방법 |
KR102294673B1 (ko) | 2021-01-26 | 2021-08-27 | 88테크 주식회사 | 측쇄에 수산기와 카르복실기를 갖는 수지의 합성 방법과 그 수지를 포함하는 잉크 조성물의 제조방법 및 적용방법 |
KR102348512B1 (ko) | 2021-01-26 | 2022-01-07 | 88테크 주식회사 | 측쇄에 수산기와 카르복실기를 갖는 수지의 합성 방법과 그 수지를 포함하는 잉크 조성물의 제조방법 및 적용방법 |
Also Published As
Publication number | Publication date |
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CN104379696A (zh) | 2015-02-25 |
JP5886957B2 (ja) | 2016-03-16 |
TW201708482A (en) | 2017-03-01 |
CN104379696B (zh) | 2016-10-12 |
TWI583769B (zh) | 2017-05-21 |
JP2016040370A (ja) | 2016-03-24 |
CN106947409B (zh) | 2018-12-11 |
WO2014003159A1 (ja) | 2014-01-03 |
JPWO2014003159A1 (ja) | 2016-06-02 |
CN106947409A (zh) | 2017-07-14 |
KR20150032527A (ko) | 2015-03-26 |
TW201406920A (zh) | 2014-02-16 |
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