KR102055031B1 - 도전성 접착제 조성물, 도전성 접착필름, 접착방법 및 회로기판 - Google Patents

도전성 접착제 조성물, 도전성 접착필름, 접착방법 및 회로기판 Download PDF

Info

Publication number
KR102055031B1
KR102055031B1 KR1020147034441A KR20147034441A KR102055031B1 KR 102055031 B1 KR102055031 B1 KR 102055031B1 KR 1020147034441 A KR1020147034441 A KR 1020147034441A KR 20147034441 A KR20147034441 A KR 20147034441A KR 102055031 B1 KR102055031 B1 KR 102055031B1
Authority
KR
South Korea
Prior art keywords
conductive adhesive
resin
epoxy resin
carboxyl group
adhesive composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020147034441A
Other languages
English (en)
Korean (ko)
Other versions
KR20150032527A (ko
Inventor
기요시 이와이
츠네히코 데라다
요시하루 야나기
요시히사 야마모토
Original Assignee
타츠타 전선 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 타츠타 전선 주식회사 filed Critical 타츠타 전선 주식회사
Publication of KR20150032527A publication Critical patent/KR20150032527A/ko
Application granted granted Critical
Publication of KR102055031B1 publication Critical patent/KR102055031B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/062—Copolymers with monomers not covered by C09J133/06
    • C09J133/064—Copolymers with monomers not covered by C09J133/06 containing anhydride, COOH or COOM groups, with M being metal or onium-cation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/04—Epoxynovolacs
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/02—Homopolymers or copolymers of acids; Metal or ammonium salts thereof
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/10—Homopolymers or copolymers of methacrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C09J163/04—Epoxynovolacs
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0806—Silver
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/085—Copper
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/02—Ingredients treated with inorganic substances
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Structure Of Printed Boards (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Conductive Materials (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Combinations Of Printed Boards (AREA)
KR1020147034441A 2012-06-29 2013-06-28 도전성 접착제 조성물, 도전성 접착필름, 접착방법 및 회로기판 Active KR102055031B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012147632 2012-06-29
JPJP-P-2012-147632 2012-06-29
PCT/JP2013/067776 WO2014003159A1 (ja) 2012-06-29 2013-06-28 導電性接着剤組成物、導電性接着フィルム、接着方法及び回路基板

Publications (2)

Publication Number Publication Date
KR20150032527A KR20150032527A (ko) 2015-03-26
KR102055031B1 true KR102055031B1 (ko) 2019-12-11

Family

ID=49783293

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020147034441A Active KR102055031B1 (ko) 2012-06-29 2013-06-28 도전성 접착제 조성물, 도전성 접착필름, 접착방법 및 회로기판

Country Status (5)

Country Link
JP (2) JP5886957B2 (enrdf_load_stackoverflow)
KR (1) KR102055031B1 (enrdf_load_stackoverflow)
CN (2) CN104379696B (enrdf_load_stackoverflow)
TW (2) TWI583769B (enrdf_load_stackoverflow)
WO (1) WO2014003159A1 (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102210681B1 (ko) 2019-12-30 2021-02-02 88테크 주식회사 접착성과 차폐기능을 가지는 전도성 접착 페이스트와 이를 이용한 fpcb의 전자파 차폐층 및 보강층 형성방법
KR102294673B1 (ko) 2021-01-26 2021-08-27 88테크 주식회사 측쇄에 수산기와 카르복실기를 갖는 수지의 합성 방법과 그 수지를 포함하는 잉크 조성물의 제조방법 및 적용방법
KR102348525B1 (ko) 2020-07-17 2022-01-07 88테크 주식회사 전도성 페이스트와 그 제조방법 및 이를 이용한 fpcb의 보강판 적층구조와 전자파 차폐층을 동시에 형성하는 방법

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5976112B2 (ja) * 2012-07-11 2016-08-23 タツタ電線株式会社 硬化性導電性接着剤組成物、電磁波シールドフィルム、導電性接着フィルム、接着方法及び回路基板
WO2015068611A1 (ja) * 2013-11-07 2015-05-14 東洋インキＳｃホールディングス株式会社 導電性接着剤、導電性接着シート、配線デバイス、および配線デバイスの製造方法
KR101941386B1 (ko) * 2014-11-12 2019-01-22 데쿠세리아루즈 가부시키가이샤 열경화성 접착 조성물
JP6091019B2 (ja) * 2015-02-02 2017-03-08 田中貴金属工業株式会社 熱伝導性導電性接着剤組成物
JP6608147B2 (ja) * 2015-02-23 2019-11-20 デクセリアルズ株式会社 多層接着フィルム、および接続構造体
CN104789176A (zh) * 2015-03-31 2015-07-22 苏州市鼎立包装有限公司 一种封口胶及其制备方法
JP6320660B1 (ja) * 2016-05-23 2018-05-09 タツタ電線株式会社 導電性接着剤組成物
JP6889902B2 (ja) * 2016-12-27 2021-06-18 ナミックス株式会社 樹脂組成物、硬化物、導電性膜、導電性パターン及び衣服
WO2019026799A1 (ja) * 2017-07-31 2019-02-07 バンドー化学株式会社 金属接合用組成物、金属接合積層体及び電気制御機器
JP7067056B2 (ja) * 2017-12-25 2022-05-16 Dic株式会社 補強板接着固定用接着シート
JP6542920B2 (ja) * 2018-01-18 2019-07-10 藤森工業株式会社 Ｆｐｃ用導電性接着シート及びそれを用いたｆｐｃ
JP6541283B2 (ja) * 2018-01-18 2019-07-10 藤森工業株式会社 Ｆｐｃ用導電性接着シート及びそれを用いたｆｐｃ
JP6448160B2 (ja) * 2018-01-18 2019-01-09 藤森工業株式会社 接着性組成物及びｆｐｃ用導電性接着シート
JP7331840B2 (ja) * 2018-04-12 2023-08-23 東洋紡エムシー株式会社 導電性ペースト
CN109943252B (zh) * 2019-02-28 2020-10-02 苏州金枪新材料股份有限公司 一种银包铜导电胶及其制备方法
CN109897567B (zh) * 2019-03-13 2021-01-01 松裕印刷包装有限公司 一种适用于高速合掌机的petg热收缩膜合掌胶水
JP7414066B2 (ja) * 2019-04-26 2024-01-16 東亞合成株式会社 樹脂組成物、ボンディングフィルム、樹脂組成物層付き積層体、積層体、及び、電磁波シールドフィルム
JP6761884B2 (ja) * 2019-06-12 2020-09-30 藤森工業株式会社 Ｆｐｃ用導電性接着シート及びそれを用いたｆｐｃ
KR20230046292A (ko) * 2020-07-29 2023-04-05 쓰리엠 이노베이티브 프로퍼티즈 컴파니 전기 전도성 접착 필름
KR20230113757A (ko) * 2020-12-10 2023-08-01 아지노모토 가부시키가이샤 도전성 접착 필름
CN114716777B (zh) * 2020-12-22 2023-07-11 广东生益科技股份有限公司 一种透明树脂组合物、包含其的挠性覆铜板及其应用
JP2021052016A (ja) * 2020-12-23 2021-04-01 第一工業製薬株式会社 導電性ペースト、および該導電性ペーストを用いた導電材料ならびに導電部材
KR102553367B1 (ko) * 2021-08-17 2023-07-10 ㈜ 엘프스 자가융착형 도전접속필름용 수지조성물, 이를 포함하는 자가융착형 도전접속필름 및 이의 제조방법
CN115074052A (zh) * 2022-05-20 2022-09-20 长春艾德斯新材料有限公司 一种室温快速固化的导电银胶及制备方法和导电膜

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000086981A (ja) * 1998-09-17 2000-03-28 Nitto Denko Corp シート状接着剤組成物およびその製法
JP2001115127A (ja) 1999-10-19 2001-04-24 Hitachi Chem Co Ltd 導電性接着剤とそれを用いた配線板

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09263683A (ja) * 1996-03-29 1997-10-07 Sumitomo Kinzoku Electro Device:Kk 導電性エポキシ樹脂組成物
JP4275221B2 (ja) * 1998-07-06 2009-06-10 リンテック株式会社 粘接着剤組成物および粘接着シート
JP2000129216A (ja) * 1998-10-26 2000-05-09 Nitto Denko Corp シート状接着剤組成物およびそれを用いた電子部品装置ならびにそのリペアー方法
JP2000129217A (ja) * 1998-10-26 2000-05-09 Nitto Denko Corp シート状接着剤組成物およびそれを用いた電子部品装置ならびにそのリペアー方法
JP3904798B2 (ja) * 1999-04-01 2007-04-11 三井化学株式会社 異方導電性ペースト
JP2001332124A (ja) * 2000-05-22 2001-11-30 Toshiba Chem Corp 導電性ペーストおよび光半導体装置
JP2005184022A (ja) * 2000-12-14 2005-07-07 Hitachi Chem Co Ltd 接続用熱・電気伝導性フィルム及びその用途
JP2003082318A (ja) * 2001-09-13 2003-03-19 Three M Innovative Properties Co カチオン重合性接着剤組成物及び異方導電性接着剤組成物
JP2005264095A (ja) * 2004-03-22 2005-09-29 Kyoto Elex Kk 導電性樹脂組成物及び導電性ペースト
JP4843979B2 (ja) 2004-03-30 2011-12-21 住友ベークライト株式会社 回路基板
WO2006088127A1 (ja) * 2005-02-18 2006-08-24 Toyo Ink Manufacturing Co., Ltd. 電磁波シールド性接着フィルム及びその製造方法、並びに被着体の電磁波遮蔽方法
TWI388584B (zh) * 2005-03-04 2013-03-11 Showa Denko Kk The film is formed with a paste
JP4828151B2 (ja) * 2005-04-15 2011-11-30 タツタ電線株式会社 導電性接着シート及び回路基板
KR101307138B1 (ko) 2005-09-16 2013-09-10 토요잉크Sc홀딩스주식회사 접착제 조성물, 이것을 사용한 접착제 시트, 및 이들의이용
KR20080109895A (ko) * 2006-04-27 2008-12-17 스미토모 베이클리트 컴퍼니 리미티드 접착 테이프, 반도체 패키지 및 전자기기
JP4933217B2 (ja) * 2006-10-26 2012-05-16 タツタ電線株式会社 導電性接着剤
KR100787727B1 (ko) * 2006-10-31 2007-12-24 제일모직주식회사 스티렌-아크릴로니트릴 공중합체를 이용한 고신뢰성 이방전도성 필름용 조성물
JP5348867B2 (ja) * 2007-09-28 2013-11-20 株式会社きもと 粘接着剤および粘接着シート
JP5487419B2 (ja) * 2008-02-12 2014-05-07 タツタ電線株式会社 導電性接着シート及びそれを備えた配線板、導電性接着シートの製造方法
JP2009290195A (ja) * 2008-04-30 2009-12-10 Toyo Ink Mfg Co Ltd 硬化性電磁波シールド性接着性フィルムおよびその製造方法
JP2010143981A (ja) 2008-12-17 2010-07-01 Toyo Ink Mfg Co Ltd 硬化性導電性ポリウレタンポリウレア接着剤組成物、硬化性電磁波シールド性接着性フィルムおよびその製造方法
JP5257125B2 (ja) * 2009-02-20 2013-08-07 東洋インキＳｃホールディングス株式会社 硬化性難燃性電磁波シールド接着フィルム
JP2010229282A (ja) * 2009-03-27 2010-10-14 Toyo Ink Mfg Co Ltd ポリウレタンポリウレア樹脂組成物、それを用いた硬化性電磁波シールド性接着性フィルム及びその製造方法
JP5742112B2 (ja) * 2010-01-18 2015-07-01 東洋インキＳｃホールディングス株式会社 硬化性電磁波シールド性接着性フィルムおよびその製造方法
JP5528857B2 (ja) * 2010-03-11 2014-06-25 タツタ電線株式会社 電磁波シールドフィルム、これを用いたフレキシブル基板及びその製造方法
CN102906211B (zh) * 2010-07-23 2014-11-05 大自达电线股份有限公司 导电性粘合剂组合物及导电性粘合膜
CN103098561B (zh) * 2010-09-13 2015-11-25 株式会社钟化 加强板一体式挠性印刷基板、及加强板一体式挠性印刷基板的制造方法
CN102443370A (zh) * 2010-10-15 2012-05-09 深圳市道尔科技有限公司 一种低卤高导电性单组份银导电胶
JP5662104B2 (ja) * 2010-10-26 2015-01-28 京セラケミカル株式会社 導電性樹脂組成物およびそれを用いた半導体装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000086981A (ja) * 1998-09-17 2000-03-28 Nitto Denko Corp シート状接着剤組成物およびその製法
JP2001115127A (ja) 1999-10-19 2001-04-24 Hitachi Chem Co Ltd 導電性接着剤とそれを用いた配線板

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102210681B1 (ko) 2019-12-30 2021-02-02 88테크 주식회사 접착성과 차폐기능을 가지는 전도성 접착 페이스트와 이를 이용한 fpcb의 전자파 차폐층 및 보강층 형성방법
KR102348525B1 (ko) 2020-07-17 2022-01-07 88테크 주식회사 전도성 페이스트와 그 제조방법 및 이를 이용한 fpcb의 보강판 적층구조와 전자파 차폐층을 동시에 형성하는 방법
KR102294673B1 (ko) 2021-01-26 2021-08-27 88테크 주식회사 측쇄에 수산기와 카르복실기를 갖는 수지의 합성 방법과 그 수지를 포함하는 잉크 조성물의 제조방법 및 적용방법
KR102348512B1 (ko) 2021-01-26 2022-01-07 88테크 주식회사 측쇄에 수산기와 카르복실기를 갖는 수지의 합성 방법과 그 수지를 포함하는 잉크 조성물의 제조방법 및 적용방법

Also Published As

Publication number Publication date
CN104379696A (zh) 2015-02-25
JP5886957B2 (ja) 2016-03-16
TW201708482A (en) 2017-03-01
CN104379696B (zh) 2016-10-12
TWI583769B (zh) 2017-05-21
JP2016040370A (ja) 2016-03-24
CN106947409B (zh) 2018-12-11
WO2014003159A1 (ja) 2014-01-03
JPWO2014003159A1 (ja) 2016-06-02
CN106947409A (zh) 2017-07-14
KR20150032527A (ko) 2015-03-26
TW201406920A (zh) 2014-02-16

Similar Documents

Publication Publication Date Title
KR102055031B1 (ko) 도전성 접착제 조성물, 도전성 접착필름, 접착방법 및 회로기판
KR101795127B1 (ko) 경화성 도전성 접착제 조성물, 전자파 쉴드필름, 도전성 접착필름, 접착방법 및 회로기판
KR102072195B1 (ko) 도전성 접착제 조성물
TWI544055B (zh) 各向異性導電膜組成物、各向異性導電膜以及半導體裝置
JP7099580B2 (ja) プリント配線板
KR19990023528A (ko) 가요성 회로 오버 코팅용 경화성 수지 조성물
KR100730985B1 (ko) 커버레이필름용 접착제 조성물
JP5713619B2 (ja) 異方性導電材料及びその製造方法
KR102611197B1 (ko) 도전성 조성물, 도전성 시트, 금속 보강판, 금속 보강판을 포함하는 배선판, 및 전자기기
KR20130073192A (ko) 이방성 도전 필름 및 반도체 장치
KR102760180B1 (ko) 롤상 도전성 접합 시트, 금속 보강판 부착 배선판, 및 전자 기기
KR20130037841A (ko) 연성회로 기판용 접착제 조성물, 이를 이용한 접착시트 및 그의 제조방법
TW202325546A (zh) 透明彈性複合膜及其封裝結構與封裝製程
CN118202001A (zh) 导电性组合物
JP2012129106A (ja) 異方性導電材料及び接続構造体

Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20141208

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
A201 Request for examination
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20180419

Comment text: Request for Examination of Application

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20190527

Patent event code: PE09021S01D

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

Patent event code: PE07011S01D

Comment text: Decision to Grant Registration

Patent event date: 20191127

GRNT Written decision to grant
PR0701 Registration of establishment

Comment text: Registration of Establishment

Patent event date: 20191205

Patent event code: PR07011E01D

PR1002 Payment of registration fee

Payment date: 20191205

End annual number: 3

Start annual number: 1

PG1601 Publication of registration
PR1001 Payment of annual fee

Payment date: 20221125

Start annual number: 4

End annual number: 4