KR102055031B1 - 도전성 접착제 조성물, 도전성 접착필름, 접착방법 및 회로기판 - Google Patents

도전성 접착제 조성물, 도전성 접착필름, 접착방법 및 회로기판 Download PDF

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KR102055031B1
KR102055031B1 KR1020147034441A KR20147034441A KR102055031B1 KR 102055031 B1 KR102055031 B1 KR 102055031B1 KR 1020147034441 A KR1020147034441 A KR 1020147034441A KR 20147034441 A KR20147034441 A KR 20147034441A KR 102055031 B1 KR102055031 B1 KR 102055031B1
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conductive adhesive
resin
epoxy resin
carboxyl group
adhesive composition
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KR20150032527A (ko
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기요시 이와이
츠네히코 데라다
요시하루 야나기
요시히사 야마모토
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타츠타 전선 주식회사
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    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02Electrically-conducting adhesives
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    • C09J133/00Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04Homopolymers or copolymers of esters
    • C09J133/06Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/062Copolymers with monomers not covered by C09J133/06
    • C09J133/064Copolymers with monomers not covered by C09J133/06 containing anhydride, COOH or COOM groups, with M being metal or onium-cation
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    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
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    • C09J133/00Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
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    • C09J133/00Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04Homopolymers or copolymers of esters
    • C09J133/06Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
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    • C09J5/00Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
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    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
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    • C08K2003/0806Silver
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    • C08L2203/20Applications use in electrical or conductive gadgets
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    • C09J2203/00Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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    • C09J2301/30Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
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  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Manufacturing & Machinery (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Structure Of Printed Boards (AREA)
  • Adhesive Tapes (AREA)
  • Conductive Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Combinations Of Printed Boards (AREA)
KR1020147034441A 2012-06-29 2013-06-28 도전성 접착제 조성물, 도전성 접착필름, 접착방법 및 회로기판 Active KR102055031B1 (ko)

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JP2012147632 2012-06-29
JPJP-P-2012-147632 2012-06-29
PCT/JP2013/067776 WO2014003159A1 (ja) 2012-06-29 2013-06-28 導電性接着剤組成物、導電性接着フィルム、接着方法及び回路基板

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KR20150032527A KR20150032527A (ko) 2015-03-26
KR102055031B1 true KR102055031B1 (ko) 2019-12-11

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JP (2) JP5886957B2 (enrdf_load_stackoverflow)
KR (1) KR102055031B1 (enrdf_load_stackoverflow)
CN (2) CN104379696B (enrdf_load_stackoverflow)
TW (2) TWI583769B (enrdf_load_stackoverflow)
WO (1) WO2014003159A1 (enrdf_load_stackoverflow)

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KR102210681B1 (ko) 2019-12-30 2021-02-02 88테크 주식회사 접착성과 차폐기능을 가지는 전도성 접착 페이스트와 이를 이용한 fpcb의 전자파 차폐층 및 보강층 형성방법
KR102294673B1 (ko) 2021-01-26 2021-08-27 88테크 주식회사 측쇄에 수산기와 카르복실기를 갖는 수지의 합성 방법과 그 수지를 포함하는 잉크 조성물의 제조방법 및 적용방법
KR102348525B1 (ko) 2020-07-17 2022-01-07 88테크 주식회사 전도성 페이스트와 그 제조방법 및 이를 이용한 fpcb의 보강판 적층구조와 전자파 차폐층을 동시에 형성하는 방법

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JP5976112B2 (ja) * 2012-07-11 2016-08-23 タツタ電線株式会社 硬化性導電性接着剤組成物、電磁波シールドフィルム、導電性接着フィルム、接着方法及び回路基板
WO2015068611A1 (ja) * 2013-11-07 2015-05-14 東洋インキScホールディングス株式会社 導電性接着剤、導電性接着シート、配線デバイス、および配線デバイスの製造方法
KR101941386B1 (ko) * 2014-11-12 2019-01-22 데쿠세리아루즈 가부시키가이샤 열경화성 접착 조성물
JP6091019B2 (ja) * 2015-02-02 2017-03-08 田中貴金属工業株式会社 熱伝導性導電性接着剤組成物
JP6608147B2 (ja) * 2015-02-23 2019-11-20 デクセリアルズ株式会社 多層接着フィルム、および接続構造体
CN104789176A (zh) * 2015-03-31 2015-07-22 苏州市鼎立包装有限公司 一种封口胶及其制备方法
JP6320660B1 (ja) * 2016-05-23 2018-05-09 タツタ電線株式会社 導電性接着剤組成物
JP6889902B2 (ja) * 2016-12-27 2021-06-18 ナミックス株式会社 樹脂組成物、硬化物、導電性膜、導電性パターン及び衣服
WO2019026799A1 (ja) * 2017-07-31 2019-02-07 バンドー化学株式会社 金属接合用組成物、金属接合積層体及び電気制御機器
JP7067056B2 (ja) * 2017-12-25 2022-05-16 Dic株式会社 補強板接着固定用接着シート
JP6542920B2 (ja) * 2018-01-18 2019-07-10 藤森工業株式会社 Fpc用導電性接着シート及びそれを用いたfpc
JP6541283B2 (ja) * 2018-01-18 2019-07-10 藤森工業株式会社 Fpc用導電性接着シート及びそれを用いたfpc
JP6448160B2 (ja) * 2018-01-18 2019-01-09 藤森工業株式会社 接着性組成物及びfpc用導電性接着シート
JP7331840B2 (ja) * 2018-04-12 2023-08-23 東洋紡エムシー株式会社 導電性ペースト
CN109943252B (zh) * 2019-02-28 2020-10-02 苏州金枪新材料股份有限公司 一种银包铜导电胶及其制备方法
CN109897567B (zh) * 2019-03-13 2021-01-01 松裕印刷包装有限公司 一种适用于高速合掌机的petg热收缩膜合掌胶水
JP7414066B2 (ja) * 2019-04-26 2024-01-16 東亞合成株式会社 樹脂組成物、ボンディングフィルム、樹脂組成物層付き積層体、積層体、及び、電磁波シールドフィルム
JP6761884B2 (ja) * 2019-06-12 2020-09-30 藤森工業株式会社 Fpc用導電性接着シート及びそれを用いたfpc
KR20230046292A (ko) * 2020-07-29 2023-04-05 쓰리엠 이노베이티브 프로퍼티즈 컴파니 전기 전도성 접착 필름
KR20230113757A (ko) * 2020-12-10 2023-08-01 아지노모토 가부시키가이샤 도전성 접착 필름
CN114716777B (zh) * 2020-12-22 2023-07-11 广东生益科技股份有限公司 一种透明树脂组合物、包含其的挠性覆铜板及其应用
JP2021052016A (ja) * 2020-12-23 2021-04-01 第一工業製薬株式会社 導電性ペースト、および該導電性ペーストを用いた導電材料ならびに導電部材
KR102553367B1 (ko) * 2021-08-17 2023-07-10 ㈜ 엘프스 자가융착형 도전접속필름용 수지조성물, 이를 포함하는 자가융착형 도전접속필름 및 이의 제조방법
CN115074052A (zh) * 2022-05-20 2022-09-20 长春艾德斯新材料有限公司 一种室温快速固化的导电银胶及制备方法和导电膜

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