KR102015741B1 - 프로브 카드 및 접촉 검사 장치 - Google Patents

프로브 카드 및 접촉 검사 장치 Download PDF

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Publication number
KR102015741B1
KR102015741B1 KR1020187011736A KR20187011736A KR102015741B1 KR 102015741 B1 KR102015741 B1 KR 102015741B1 KR 1020187011736 A KR1020187011736 A KR 1020187011736A KR 20187011736 A KR20187011736 A KR 20187011736A KR 102015741 B1 KR102015741 B1 KR 102015741B1
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South Korea
Prior art keywords
probe
guide
cylinder
guide portion
probe card
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KR1020187011736A
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English (en)
Korean (ko)
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KR20180059867A (ko
Inventor
테츠야 요시오카
타카시 카와노
시게키 마키세
미카 나스
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가부시키가이샤 니혼 마이크로닉스
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Publication of KR20180059867A publication Critical patent/KR20180059867A/ko
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Publication of KR102015741B1 publication Critical patent/KR102015741B1/ko
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06705—Apparatus for holding or moving single probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G01R1/07328—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support for testing printed circuit boards
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06722—Spring-loaded
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06777—High voltage probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Geometry (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
KR1020187011736A 2015-10-21 2016-10-13 프로브 카드 및 접촉 검사 장치 Active KR102015741B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015207263A JP6890921B2 (ja) 2015-10-21 2015-10-21 プローブカード及び接触検査装置
JPJP-P-2015-207263 2015-10-21
PCT/JP2016/080301 WO2017069028A1 (ja) 2015-10-21 2016-10-13 プローブカード及び接触検査装置

Publications (2)

Publication Number Publication Date
KR20180059867A KR20180059867A (ko) 2018-06-05
KR102015741B1 true KR102015741B1 (ko) 2019-08-28

Family

ID=58557432

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020187011736A Active KR102015741B1 (ko) 2015-10-21 2016-10-13 프로브 카드 및 접촉 검사 장치

Country Status (6)

Country Link
US (1) US10775411B2 (enExample)
JP (1) JP6890921B2 (enExample)
KR (1) KR102015741B1 (enExample)
CN (1) CN108351371B (enExample)
TW (1) TWI627413B (enExample)
WO (1) WO2017069028A1 (enExample)

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JP6892277B2 (ja) * 2017-02-10 2021-06-23 株式会社日本マイクロニクス プローブ及び電気的接続装置
JP6980410B2 (ja) * 2017-05-23 2021-12-15 株式会社日本マイクロニクス プローブ
JP7075725B2 (ja) * 2017-05-30 2022-05-26 株式会社日本マイクロニクス 電気的接続装置
US10566256B2 (en) * 2018-01-04 2020-02-18 Winway Technology Co., Ltd. Testing method for testing wafer level chip scale packages
US11467186B2 (en) * 2018-08-23 2022-10-11 Nidec-Read Corporation Inspection jig, inspection device, and contact terminal
KR102037657B1 (ko) 2018-09-05 2019-10-29 주식회사 아이에스시 전기적 검사용 프로브 카드 및 프로브 카드의 프로브 헤드
TWI857011B (zh) * 2019-02-22 2024-10-01 日商日本電產理德股份有限公司 檢查治具
KR102037198B1 (ko) 2019-06-16 2019-10-28 심민섭 프로브 카드 검사 장치
CN112240945A (zh) * 2019-07-17 2021-01-19 中华精测科技股份有限公司 晶圆探针卡改良结构
JP7148472B2 (ja) * 2019-09-27 2022-10-05 株式会社フェローテックマテリアルテクノロジーズ セラミックス部品およびセラミックス部品の製造方法
KR102865650B1 (ko) * 2020-01-31 2025-09-29 (주)포인트엔지니어링 프로브 헤드 및 이를 포함하는 프로브 카드
WO2021172061A1 (ja) * 2020-02-26 2021-09-02 日本電産リード株式会社 筒状体、接触端子、検査治具、および検査装置
JP7175518B2 (ja) * 2020-06-02 2022-11-21 東理システム株式会社 電力変換回路装置の電気特性検査ユニット装置
JP2022116470A (ja) * 2021-01-29 2022-08-10 株式会社村田製作所 プローブ装置
US12038458B2 (en) 2021-03-24 2024-07-16 Samsung Electronics Co., Ltd. Probe for testing a semiconductor device and a probe card including the same
KR102673349B1 (ko) * 2022-02-25 2024-06-07 (주)티에스이 저마찰형 프로브 헤드
TWI831293B (zh) * 2022-07-14 2024-02-01 中華精測科技股份有限公司 晶片測試插座
JP2024011702A (ja) * 2022-07-15 2024-01-25 日本発條株式会社 プローブホルダおよびプローブユニット
IT202200026178A1 (it) * 2022-12-21 2024-06-21 Technoprobe Spa Testa di misura per un’apparecchiatura di test di dispositivi elettronici
US20240125815A1 (en) * 2023-07-19 2024-04-18 Translarity, Inc. Socketed Probes

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JP2009230897A (ja) * 2008-03-19 2009-10-08 Fujitsu Ltd 電子部品接合装置、電子ユニット、および電子装置

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JP4455940B2 (ja) 2004-06-17 2010-04-21 株式会社日本マイクロニクス 電気的接続装置
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TWI548879B (zh) * 2014-01-28 2016-09-11 Spring sleeve probe
JP6546719B2 (ja) 2014-02-07 2019-07-17 株式会社日本マイクロニクス 接触検査装置
TW201533449A (zh) * 2014-02-24 2015-09-01 Mpi Corp 具有彈簧套筒式探針之探針裝置
TWI570415B (zh) * 2015-10-02 2017-02-11 A spring probe having an outer sleeve and a probe device having the spring probe

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US20070001692A1 (en) * 2005-06-30 2007-01-04 Hiroshi Yamada Socket and electronic appliances using socket
JP2009230897A (ja) * 2008-03-19 2009-10-08 Fujitsu Ltd 電子部品接合装置、電子ユニット、および電子装置

Also Published As

Publication number Publication date
US10775411B2 (en) 2020-09-15
JP6890921B2 (ja) 2021-06-18
JP2017078660A (ja) 2017-04-27
EP3367108A1 (en) 2018-08-29
US20180299489A1 (en) 2018-10-18
CN108351371A (zh) 2018-07-31
KR20180059867A (ko) 2018-06-05
WO2017069028A1 (ja) 2017-04-27
TW201728908A (zh) 2017-08-16
EP3367108A4 (en) 2019-06-19
TWI627413B (zh) 2018-06-21
CN108351371B (zh) 2021-04-27

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