CN108351371B - 探针卡和接触检查装置 - Google Patents

探针卡和接触检查装置 Download PDF

Info

Publication number
CN108351371B
CN108351371B CN201680061723.XA CN201680061723A CN108351371B CN 108351371 B CN108351371 B CN 108351371B CN 201680061723 A CN201680061723 A CN 201680061723A CN 108351371 B CN108351371 B CN 108351371B
Authority
CN
China
Prior art keywords
probe
guide
guide portion
inspected
spring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201680061723.XA
Other languages
English (en)
Chinese (zh)
Other versions
CN108351371A (zh
Inventor
吉冈哲也
河野贵志
牧瀬茂喜
那须美佳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Micronics Japan Co Ltd
Original Assignee
Micronics Japan Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Micronics Japan Co Ltd filed Critical Micronics Japan Co Ltd
Publication of CN108351371A publication Critical patent/CN108351371A/zh
Application granted granted Critical
Publication of CN108351371B publication Critical patent/CN108351371B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06705—Apparatus for holding or moving single probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G01R1/07328—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support for testing printed circuit boards
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06722—Spring-loaded
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06777—High voltage probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Geometry (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
CN201680061723.XA 2015-10-21 2016-10-13 探针卡和接触检查装置 Active CN108351371B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015-207263 2015-10-21
JP2015207263A JP6890921B2 (ja) 2015-10-21 2015-10-21 プローブカード及び接触検査装置
PCT/JP2016/080301 WO2017069028A1 (ja) 2015-10-21 2016-10-13 プローブカード及び接触検査装置

Publications (2)

Publication Number Publication Date
CN108351371A CN108351371A (zh) 2018-07-31
CN108351371B true CN108351371B (zh) 2021-04-27

Family

ID=58557432

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201680061723.XA Active CN108351371B (zh) 2015-10-21 2016-10-13 探针卡和接触检查装置

Country Status (6)

Country Link
US (1) US10775411B2 (enExample)
JP (1) JP6890921B2 (enExample)
KR (1) KR102015741B1 (enExample)
CN (1) CN108351371B (enExample)
TW (1) TWI627413B (enExample)
WO (1) WO2017069028A1 (enExample)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6892277B2 (ja) * 2017-02-10 2021-06-23 株式会社日本マイクロニクス プローブ及び電気的接続装置
JP6980410B2 (ja) * 2017-05-23 2021-12-15 株式会社日本マイクロニクス プローブ
JP7075725B2 (ja) * 2017-05-30 2022-05-26 株式会社日本マイクロニクス 電気的接続装置
US10566256B2 (en) * 2018-01-04 2020-02-18 Winway Technology Co., Ltd. Testing method for testing wafer level chip scale packages
US11467186B2 (en) * 2018-08-23 2022-10-11 Nidec-Read Corporation Inspection jig, inspection device, and contact terminal
KR102037657B1 (ko) 2018-09-05 2019-10-29 주식회사 아이에스시 전기적 검사용 프로브 카드 및 프로브 카드의 프로브 헤드
TWI857011B (zh) * 2019-02-22 2024-10-01 日商日本電產理德股份有限公司 檢查治具
KR102037198B1 (ko) 2019-06-16 2019-10-28 심민섭 프로브 카드 검사 장치
CN112240945A (zh) * 2019-07-17 2021-01-19 中华精测科技股份有限公司 晶圆探针卡改良结构
JP7148472B2 (ja) * 2019-09-27 2022-10-05 株式会社フェローテックマテリアルテクノロジーズ セラミックス部品およびセラミックス部品の製造方法
KR102865650B1 (ko) * 2020-01-31 2025-09-29 (주)포인트엔지니어링 프로브 헤드 및 이를 포함하는 프로브 카드
WO2021172061A1 (ja) * 2020-02-26 2021-09-02 日本電産リード株式会社 筒状体、接触端子、検査治具、および検査装置
JP7175518B2 (ja) * 2020-06-02 2022-11-21 東理システム株式会社 電力変換回路装置の電気特性検査ユニット装置
JP2022116470A (ja) * 2021-01-29 2022-08-10 株式会社村田製作所 プローブ装置
US12038458B2 (en) 2021-03-24 2024-07-16 Samsung Electronics Co., Ltd. Probe for testing a semiconductor device and a probe card including the same
KR102673349B1 (ko) * 2022-02-25 2024-06-07 (주)티에스이 저마찰형 프로브 헤드
TWI831293B (zh) * 2022-07-14 2024-02-01 中華精測科技股份有限公司 晶片測試插座
JP2024011702A (ja) * 2022-07-15 2024-01-25 日本発條株式会社 プローブホルダおよびプローブユニット
IT202200026178A1 (it) * 2022-12-21 2024-06-21 Technoprobe Spa Testa di misura per un’apparecchiatura di test di dispositivi elettronici
US20240125815A1 (en) * 2023-07-19 2024-04-18 Translarity, Inc. Socketed Probes

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2556245B2 (ja) * 1992-11-27 1996-11-20 日本電気株式会社 プローブカード
JP3530518B2 (ja) * 2002-01-24 2004-05-24 日本電子材料株式会社 プローブカード
JP4455940B2 (ja) 2004-06-17 2010-04-21 株式会社日本マイクロニクス 電気的接続装置
JP4598614B2 (ja) * 2005-06-30 2010-12-15 富士通株式会社 ソケット及び電子機器
JP2007059727A (ja) * 2005-08-25 2007-03-08 Nidec-Read Corp 基板検査装置及び基板検査方法
US7601009B2 (en) 2006-05-18 2009-10-13 Centipede Systems, Inc. Socket for an electronic device
JP2008243861A (ja) * 2007-03-23 2008-10-09 Tokyo Electron Ltd 検査装置及び検査方法
JP2009162483A (ja) 2007-12-28 2009-07-23 Micronics Japan Co Ltd 電気的接続装置
JP5056518B2 (ja) * 2008-03-19 2012-10-24 富士通株式会社 電子ユニット
JP2009276215A (ja) * 2008-05-15 2009-11-26 Tokyo Electron Ltd プローブ装置及びコンタクト位置の補正方法
JP5222038B2 (ja) * 2008-06-20 2013-06-26 東京エレクトロン株式会社 プローブ装置
CN201293798Y (zh) * 2008-10-31 2009-08-19 中茂电子(深圳)有限公司 太阳能电池检测机台用探针卡
WO2011115082A1 (ja) * 2010-03-15 2011-09-22 日本電産リード株式会社 接続端子及び接続治具
JP5826466B2 (ja) 2010-06-25 2015-12-02 東京エレクトロン株式会社 プローブカードの平行調整機構及び検査装置
JP5824290B2 (ja) * 2010-09-21 2015-11-25 秀雄 西川 検査治具及び接触子
WO2013051099A1 (ja) * 2011-10-04 2013-04-11 富士通株式会社 試験用治具及び半導体装置の試験方法
KR101582432B1 (ko) 2011-10-07 2016-01-04 닛폰 하츠죠 가부시키가이샤 프로브 유닛
JP6092509B2 (ja) * 2011-10-17 2017-03-08 東京エレクトロン株式会社 接触端子の支持体及びプローブカード
JP2014025737A (ja) * 2012-07-25 2014-02-06 Nidec-Read Corp 検査用治具及び接触子
JP5847663B2 (ja) 2012-08-01 2016-01-27 日本電子材料株式会社 プローブカード用ガイド板の製造方法
JP6017228B2 (ja) 2012-08-27 2016-10-26 株式会社日本マイクロニクス 電気的接続装置
JP2014048266A (ja) * 2012-09-04 2014-03-17 Toshiba Corp プローブカード、これを用いた撮像素子の試験方法および試験装置
JP6235785B2 (ja) * 2013-03-18 2017-11-22 日本電子材料株式会社 プローブカード用ガイド板およびプローブカード用ガイド板の製造方法
TWI548879B (zh) * 2014-01-28 2016-09-11 Spring sleeve probe
JP6546719B2 (ja) 2014-02-07 2019-07-17 株式会社日本マイクロニクス 接触検査装置
TW201533449A (zh) * 2014-02-24 2015-09-01 Mpi Corp 具有彈簧套筒式探針之探針裝置
TWI570415B (zh) * 2015-10-02 2017-02-11 A spring probe having an outer sleeve and a probe device having the spring probe

Also Published As

Publication number Publication date
US10775411B2 (en) 2020-09-15
JP6890921B2 (ja) 2021-06-18
JP2017078660A (ja) 2017-04-27
KR102015741B1 (ko) 2019-08-28
EP3367108A1 (en) 2018-08-29
US20180299489A1 (en) 2018-10-18
CN108351371A (zh) 2018-07-31
KR20180059867A (ko) 2018-06-05
WO2017069028A1 (ja) 2017-04-27
TW201728908A (zh) 2017-08-16
EP3367108A4 (en) 2019-06-19
TWI627413B (zh) 2018-06-21

Similar Documents

Publication Publication Date Title
CN108351371B (zh) 探针卡和接触检查装置
KR101381564B1 (ko) 반도체 디바이스의 검사장치와 이를 이용한 척 스테이지
US10571488B2 (en) Probe for a contact inspection device
US6967492B2 (en) Spring contact probe device for electrical testing
JP2017078660A5 (enExample)
US7262613B2 (en) Inspection method and inspection apparatus for inspecting electrical characteristics of inspection object
KR20150053232A (ko) 검사 지그
JP7381209B2 (ja) 電気的接続装置
CN106291302A (zh) 接触探针型温度检测器、半导体装置的评价装置以及半导体装置的评价方法
EP3757559B1 (en) Substrate evaluation chip and substrate evaluation device
JP6365953B1 (ja) プローバ
CN114496838B (zh) 载置台、检查装置和检查方法
JP2004150999A (ja) プローブカード
JP2007309648A (ja) 基板検査用治具及びこの治具における接続電極部の電極構造
JPWO2016043327A1 (ja) プローブユニット
JP2014512016A (ja) 半導体パワースイッチをテストするシステムおよび方法
EP3367108B1 (en) Probe card and contact inspection device
CN103472270A (zh) 探针板
CN100432679C (zh) 垂直式探针卡
TWI646333B (zh) 探針及電性連接裝置
JP2002040049A (ja) コンタクトプローブ
JP4919050B2 (ja) フローティング機構
JP5290820B2 (ja) 電子部品の測定装置と測定方法
JP4653685B2 (ja) 半導体デバイス評価装置及び評価方法
JP2005114547A (ja) コンタクトプローブとこれを用いたコンタクト機器

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant