KR102012323B1 - 다중 소재 접합 기판의 전기적 성능 테스트 방법 - Google Patents

다중 소재 접합 기판의 전기적 성능 테스트 방법 Download PDF

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Publication number
KR102012323B1
KR102012323B1 KR1020187008121A KR20187008121A KR102012323B1 KR 102012323 B1 KR102012323 B1 KR 102012323B1 KR 1020187008121 A KR1020187008121 A KR 1020187008121A KR 20187008121 A KR20187008121 A KR 20187008121A KR 102012323 B1 KR102012323 B1 KR 102012323B1
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KR
South Korea
Prior art keywords
board
electrical performance
single material
circuit unit
material number
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KR1020187008121A
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English (en)
Korean (ko)
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KR20180050672A (ko
Inventor
리에창 우
위첸 바이
밍 랴오
Original Assignee
광저우 패스트프린트 서킷 테크 컴퍼니 리미티드
센젠 패스트프린트 서킷 테크 컴퍼니 리미티드
이싱 실리콘 벨리 일레트로닉스 테크놀로지 컴퍼니 리미티드
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Application filed by 광저우 패스트프린트 서킷 테크 컴퍼니 리미티드, 센젠 패스트프린트 서킷 테크 컴퍼니 리미티드, 이싱 실리콘 벨리 일레트로닉스 테크놀로지 컴퍼니 리미티드 filed Critical 광저우 패스트프린트 서킷 테크 컴퍼니 리미티드
Publication of KR20180050672A publication Critical patent/KR20180050672A/ko
Application granted granted Critical
Publication of KR102012323B1 publication Critical patent/KR102012323B1/ko

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
    • G01R31/2812—Checking for open circuits or shorts, e.g. solder bridges; Testing conductivity, resistivity or impedance
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
    • G01R31/2813—Checking the presence, location, orientation or value, e.g. resistance, of components or conductors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2818—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP] using test structures on, or modifications of, the card under test, made for the purpose of testing, e.g. additional components or connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
KR1020187008121A 2015-08-21 2016-08-19 다중 소재 접합 기판의 전기적 성능 테스트 방법 KR102012323B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CN201510520206.1 2015-08-21
CN201510520206.1A CN105137263B (zh) 2015-08-21 2015-08-21 一种多料号合拼板电性能测试方法
PCT/CN2016/096069 WO2017032278A1 (fr) 2015-08-21 2016-08-19 Procédé de test des performances électriques d'une carte segmentée numérotée à plusieurs matériaux

Publications (2)

Publication Number Publication Date
KR20180050672A KR20180050672A (ko) 2018-05-15
KR102012323B1 true KR102012323B1 (ko) 2019-08-20

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020187008121A KR102012323B1 (ko) 2015-08-21 2016-08-19 다중 소재 접합 기판의 전기적 성능 테스트 방법

Country Status (3)

Country Link
KR (1) KR102012323B1 (fr)
CN (1) CN105137263B (fr)
WO (1) WO2017032278A1 (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105137263B (zh) * 2015-08-21 2018-04-20 广州兴森快捷电路科技有限公司 一种多料号合拼板电性能测试方法
CN105629152B (zh) * 2015-12-22 2018-10-02 深圳崇达多层线路板有限公司 提高无定位孔pcb单元板测试速度的方法及其装置
CN107567188A (zh) * 2017-08-10 2018-01-09 勤基电路板（深圳）有限公司 印制电路板的加工方法、设备及印制电路板
CN108541146A (zh) * 2018-04-24 2018-09-14 珠海元盛电子科技股份有限公司 一种全印制单层fpc的全加成法技术
CN109738789B (zh) * 2019-01-02 2021-09-21 深圳市大族数控科技股份有限公司 飞针测试机测试方法、装置、飞针测试机及存储介质
CN110196389A (zh) * 2019-06-28 2019-09-03 飞毛腿电池有限公司 一种整拼板装pcb板测试方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000017662A1 (fr) 1998-09-24 2000-03-30 Mci Computer Gmbh Dispositif d'essai pour modules
US20020125879A1 (en) 2001-03-10 2002-09-12 Samsung Electronics Co., Ltd. Parallel test board used in testing semiconductor memory devices

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5633596A (en) * 1994-01-11 1997-05-27 Key Solutions Ltd. Fixtureless automatic test equipment and a method for registration for use therewith
JPH10170584A (ja) * 1996-12-12 1998-06-26 Mitsubishi Electric Corp 可動プローブ式プリント配線板導通検査用データ作成装置
DE20005123U1 (de) * 2000-03-20 2001-08-02 Atg Test Systems Gmbh Vorrichtung zum Prüfen von Leiterplatten
KR100389804B1 (ko) * 2001-05-25 2003-07-02 삼성전자주식회사 반도체 메모리 소자용 병렬 실장 검사 기판
US6664778B2 (en) * 2001-05-22 2003-12-16 Agilent Technologies, Inc. Circuit board coupon tester
CN101071156B (zh) * 2006-05-11 2010-04-07 鸿骐昶驎科技股份有限公司 多联板的次品检测装置及方法
CN201986253U (zh) * 2010-10-31 2011-09-21 中山市兴达电路板有限公司 一种电路板新型定位结构
CN102856214A (zh) * 2011-06-27 2013-01-02 鸿骐新技股份有限公司 电路板置件方法
CN203457418U (zh) * 2013-09-29 2014-02-26 胜宏科技（惠州）股份有限公司 一种可测试背钻孔的线路板
CN204129075U (zh) * 2014-09-18 2015-01-28 中山市智牛电子有限公司 一种检测cv59h-a42-11tv板卡的工装检测装置
CN204129159U (zh) * 2014-09-18 2015-01-28 上海美维电子有限公司 新型高密度互连线路板
CN104281745B (zh) * 2014-09-28 2018-01-05 深圳市兴森快捷电路科技股份有限公司 一种利用指定格式文件的钻孔方法
CN204188769U (zh) * 2014-11-27 2015-03-04 广东欧珀移动通信有限公司 一种pcb拼板测试装置
CN104797092B (zh) * 2015-04-08 2018-01-16 广州杰赛科技股份有限公司 Pcb板的拼板方法和系统
CN105137263B (zh) * 2015-08-21 2018-04-20 广州兴森快捷电路科技有限公司 一种多料号合拼板电性能测试方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000017662A1 (fr) 1998-09-24 2000-03-30 Mci Computer Gmbh Dispositif d'essai pour modules
US20020125879A1 (en) 2001-03-10 2002-09-12 Samsung Electronics Co., Ltd. Parallel test board used in testing semiconductor memory devices

Also Published As

Publication number Publication date
KR20180050672A (ko) 2018-05-15
WO2017032278A1 (fr) 2017-03-02
CN105137263A (zh) 2015-12-09
CN105137263B (zh) 2018-04-20

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