WO2017032278A1 - Procédé de test des performances électriques d'une carte segmentée numérotée à plusieurs matériaux - Google Patents

Procédé de test des performances électriques d'une carte segmentée numérotée à plusieurs matériaux Download PDF

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Publication number
WO2017032278A1
WO2017032278A1 PCT/CN2016/096069 CN2016096069W WO2017032278A1 WO 2017032278 A1 WO2017032278 A1 WO 2017032278A1 CN 2016096069 W CN2016096069 W CN 2016096069W WO 2017032278 A1 WO2017032278 A1 WO 2017032278A1
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WO
WIPO (PCT)
Prior art keywords
plate
network unit
board
test
material number
Prior art date
Application number
PCT/CN2016/096069
Other languages
English (en)
Chinese (zh)
Inventor
吴列强
白瑜琛
廖明
Original Assignee
广州兴森快捷电路科技有限公司
深圳市兴森快捷电路科技股份有限公司
宜兴硅谷电子科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 广州兴森快捷电路科技有限公司, 深圳市兴森快捷电路科技股份有限公司, 宜兴硅谷电子科技有限公司 filed Critical 广州兴森快捷电路科技有限公司
Priority to KR1020187008121A priority Critical patent/KR102012323B1/ko
Publication of WO2017032278A1 publication Critical patent/WO2017032278A1/fr

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
    • G01R31/2812—Checking for open circuits or shorts, e.g. solder bridges; Testing conductivity, resistivity or impedance
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
    • G01R31/2813—Checking the presence, location, orientation or value, e.g. resistance, of components or conductors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2818—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP] using test structures on, or modifications of, the card under test, made for the purpose of testing, e.g. additional components or connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor

Abstract

L'invention concerne un procédé de test des performances électriques d'une carte segmentée numérotée à plusieurs matériaux, ledit procédé comprenant les étapes consistant à : segmenter plusieurs cartes numérotées à matériau unique (12, 13, 14, 15) d'une carte de production (10), les cartes numérotées à matériau unique (12, 13, 14, 15) comportant plusieurs unités de réseau ; obtenir des informations de position des unités de réseau concernant chacune des cartes numérotées à matériau unique (12, 13, 14, 15) ; utiliser un appareil de test à sondes mobiles pour procéder au test des performances électriques des unités de réseau en séquence en fonction des informations de position des unités de réseau, le test des performances électriques consistant à déterminer si les unités de réseau sont des unités en circuit ouvert et/ou en court-circuit. De cette manière, la totalité de la carte de production (10) peut être mise dans l'appareil de test pour être testée une seule fois, de sorte qu'il n'est pas nécessaire de diviser la carte de production (10) en plusieurs morceaux, ni de placer les différents morceaux dans l'appareil de test à sondes mobiles, un par un, pour procéder au test des performances électriques, ce qui réduit considérablement les étapes d'une carte supérieure et d'une carte inférieure dans l'appareil de test à sondes mobiles, ce qui améliore considérablement le rendement du travail et diminue considérablement les coûts de main-d'œuvre.
PCT/CN2016/096069 2015-08-21 2016-08-19 Procédé de test des performances électriques d'une carte segmentée numérotée à plusieurs matériaux WO2017032278A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020187008121A KR102012323B1 (ko) 2015-08-21 2016-08-19 다중 소재 접합 기판의 전기적 성능 테스트 방법

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201510520206.1 2015-08-21
CN201510520206.1A CN105137263B (zh) 2015-08-21 2015-08-21 一种多料号合拼板电性能测试方法

Publications (1)

Publication Number Publication Date
WO2017032278A1 true WO2017032278A1 (fr) 2017-03-02

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2016/096069 WO2017032278A1 (fr) 2015-08-21 2016-08-19 Procédé de test des performances électriques d'une carte segmentée numérotée à plusieurs matériaux

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Country Link
KR (1) KR102012323B1 (fr)
CN (1) CN105137263B (fr)
WO (1) WO2017032278A1 (fr)

Cited By (1)

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CN110196389A (zh) * 2019-06-28 2019-09-03 飞毛腿电池有限公司 一种整拼板装pcb板测试方法

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CN105137263B (zh) * 2015-08-21 2018-04-20 广州兴森快捷电路科技有限公司 一种多料号合拼板电性能测试方法
CN105629152B (zh) * 2015-12-22 2018-10-02 深圳崇达多层线路板有限公司 提高无定位孔pcb单元板测试速度的方法及其装置
CN107567188A (zh) * 2017-08-10 2018-01-09 勤基电路板（深圳）有限公司 印制电路板的加工方法、设备及印制电路板
CN108541146A (zh) * 2018-04-24 2018-09-14 珠海元盛电子科技股份有限公司 一种全印制单层fpc的全加成法技术
CN109738789B (zh) * 2019-01-02 2021-09-21 深圳市大族数控科技股份有限公司 飞针测试机测试方法、装置、飞针测试机及存储介质

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CN110196389A (zh) * 2019-06-28 2019-09-03 飞毛腿电池有限公司 一种整拼板装pcb板测试方法

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Publication number Publication date
KR20180050672A (ko) 2018-05-15
CN105137263A (zh) 2015-12-09
CN105137263B (zh) 2018-04-20
KR102012323B1 (ko) 2019-08-20

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