WO2000017662A1 - Dispositif d'essai pour modules - Google Patents

Dispositif d'essai pour modules Download PDF

Info

Publication number
WO2000017662A1
WO2000017662A1 PCT/EP1999/007082 EP9907082W WO0017662A1 WO 2000017662 A1 WO2000017662 A1 WO 2000017662A1 EP 9907082 W EP9907082 W EP 9907082W WO 0017662 A1 WO0017662 A1 WO 0017662A1
Authority
WO
WIPO (PCT)
Prior art keywords
contact
test
tray
elements
modules
Prior art date
Application number
PCT/EP1999/007082
Other languages
German (de)
English (en)
Inventor
Harro MÖWES
Original Assignee
Mci Computer Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mci Computer Gmbh filed Critical Mci Computer Gmbh
Publication of WO2000017662A1 publication Critical patent/WO2000017662A1/fr

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards

Definitions

  • the invention relates to a test device for electronic modules arranged in receiving recesses of a tray with a circuit board with electrical contact fields on an upper and a lower side and with electronic components on the circuit board.
  • test contact elements of a test device.
  • the structure of the test device is simplified if all test contact elements can be moved against the module to be tested from one side, namely either from the top or from the bottom. This in turn presupposes that the contact fields on the sides facing away from the test contact elements are electrically “displaced” by means of a contact deflection element such that they can now be contacted from the same side as the contact fields on the side facing the test contact elements.
  • a contact redirection device is out DE-A-196 54 404. However, this device is not for testing devices placed on a tray
  • the invention has for its object to provide a test device for electronic modules that allows testing a variety of these modules on a tray.
  • the invention proposes a test device for electronic modules arranged in receiving recesses of a tray with a circuit board with electrical contact fields on an upper and a lower side and with electronic components on the circuit board, the Receiving recesses have through openings extending from the top to the underside of the tray with support edges for the modules and the modules leaving areas of the through openings on the
  • this test device is provided with: a test head with first test contact elements for contacting the
  • Test contact elements the test head being arranged facing the top of the tray, and a plurality of contact deflection elements arranged on the underside of the tray facing away from the test head, the test contact elements for
  • each contact deflection element being one within one
  • test contact elements carrying the first part and a second part, which is arranged next to a module within the exposed area of a through opening of the tray and has an upper side facing the test head, which is in contact with the contact fields of the
  • the contact deflection elements are designed in such a way that a part of them is located within an uncovered area of the through-openings of the tray that is not covered by the modules when testing.
  • the tray can be moved in the direction of the contact deflection elements, or alternatively or additionally, the contact deflection elements can be moved in the direction of the tray.
  • the contact deflection elements are part of the test head or are integrated in the tray.
  • that part of the test head which carries the test contact elements is expediently moved from one side and that part of the test head which has the contact deflection elements from the other side to the tray and thus to the modules arranged in its receiving recesses.
  • a multiplicity of memory modules 14 are arranged on a tray 10 with a plurality of N-depressions 12.
  • Each memory module 14 has a circuit board 16 with one or more memory modules 18.
  • the memory modules 14 each lie on three edges of their boards 16 on the edges 20 of through openings 22 of the depressions 12 of the tray 10.
  • the electrical contact fields 24 and 26 are located in the area of the free fourth edges 23 of the memory modules 14.
  • the electrical contact fields 24 are located on the top sides 28 of the modules 14, while the electrical contact fields 26 are located directly below the contact fields 24 on the undersides 30 of the Modules 14 are arranged.
  • Above the tray 10 is the test head 32 of a test device 34, which can be moved downward, that is to say in the direction of the tray 10, for testing the modules 14.
  • the test head 32 has a multiplicity of first contact elements 36 and a multiplicity of second contact elements 38.
  • the test head 32 is shown in solid lines in the state in which the first test contact elements 36 contact the contact fields 24;
  • the situation in which the test head 32 has moved away from the tray 10 is shown in dashed lines.
  • a carrier element 40 is shown, on which a number of contact deflection elements 42 corresponding to the number of depressions 12 and through openings 22 of the tray are arranged.
  • Each of these contact deflection elements 42 is essentially L-shaped and has a first part 44 with test contact elements 46 and a second part 48 with contact fields 50 projecting upward from the first part 44 in the direction of the tray 10.
  • the test contact elements 46 of the contact deflection elements 42 contact the contact fields 26 on the undersides 30 of the modules 14.
  • the projecting second parts 48 of the contact deflection elements 42 are located within the exposed areas 52 of the through openings 22 of the depressions adjoining the edges 23 of the modules 14 12 of the tray 10 and extend through them, their contact fields 50 being arranged at substantially the same height as the contact fields 24 on the upper sides 28 of the modules 14.
  • the second test contact elements 38 can contact the contact fields 50 of the contact deflection elements by moving the test head 32 up. As indicated in the drawing at 54, the contact fields 50 are electrically connected to the test contact elements 46, so that the second test contact elements 38 of the test head 32 are thus electrically connected to the contact fields 26 located on the undersides 30 of the modules 14. This also allows the modules on the undersides 30 Contact 14 located contact fields 26, so to speak, from the top 28 of the modules 14.

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

Dispositif d'essai (34) servant à tester des modules électroniques (14) placés dans les évidements récepteurs (12) d'un plateau (10). Lesdits modules comportent une platine (16) dotée de plages de contact (24, 26) électriques sur une face supérieure (28) et sur une face inférieure (30) de ladite platine (16), ainsi que des composants électroniques (18) sur au moins une face de la platine (16). Les évidements récepteurs (12) du plateau (10) présentent des ouvertures traversantes (22) qui vont de la face supérieure à la face inférieure du plateau (10) et qui possèdent des bords d'appui (20) pour les modules (14), et les modules (14) reposent sur les bords d'appui (20) de manière telle que des zones (52) des trous traversants (22) sont laissées libres. Le dispositif d'essai (34) est équipé d'une tête (32) d'essai portant des premiers éléments de contact (36) d'essai destinés à venir en contact avec les plages de contact (24) situées sur la face supérieure (28) des modules (14), ainsi que des seconds éléments de contact (38), la tête (32) d'essai étant orientée vers la face supérieure du plateau (10). Ledit dispositif possède en outre plusieurs éléments de déviation (42) de contact placés sur la face inférieure du plateau (10) opposée à la tête (32) d'essai. Lesdits éléments de déviation comportent des éléments de contact (46) d'essai destinés à venir en contact avec les plages (26) de contact situées sur les faces inférieures (30) des modules (14) et des plages (50) de contact reliées électriquement aux éléments de contact (46) d'essai pour la mise en contact avec les seconds éléments de contact (38) d'essai de la tête (32) d'essai. Chaque élément de déviation (42) de contact comporte une première partie (44) située à l'intérieur d'une ouverture traversante (22) du plateau (10) sous le module (14), qui porte les éléments de contact (46) d'essai et une seconde partie (48) qui est placée près d'un module (14) à l'intérieur de la zone libre (52) d'une ouverture traversante (22) du plateau (10) et qui possède une face supérieure faisant face à la tête (32) d'essai et équipée des plages (50) de contact de l'élément de déviation (46) de contact.
PCT/EP1999/007082 1998-09-24 1999-09-23 Dispositif d'essai pour modules WO2000017662A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19843775.7 1998-09-24
DE19843775 1998-09-24

Publications (1)

Publication Number Publication Date
WO2000017662A1 true WO2000017662A1 (fr) 2000-03-30

Family

ID=7882068

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP1999/007082 WO2000017662A1 (fr) 1998-09-24 1999-09-23 Dispositif d'essai pour modules

Country Status (1)

Country Link
WO (1) WO2000017662A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001071371A1 (fr) * 2000-03-20 2001-09-27 Atg Test Systems Gmbh & Co Kg Dispositif pour le test de cartes imprimees
WO2005078460A1 (fr) * 2004-02-16 2005-08-25 Infineon Technologies Ag Procede et dispositif pour controler un element semi-conducteur dote de surfaces de contact sur les deux faces
KR20180050672A (ko) * 2015-08-21 2018-05-15 광저우 패스트프린트 서킷 테크 컴퍼니 리미티드 다 재료 수의 접속 판의 전기적 성능을 시험하는 방법

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19654404A1 (de) * 1996-12-24 1998-06-25 Hewlett Packard Co Adaptationsvorrichtung zum elektrischen Test von Leiterplatten

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19654404A1 (de) * 1996-12-24 1998-06-25 Hewlett Packard Co Adaptationsvorrichtung zum elektrischen Test von Leiterplatten

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001071371A1 (fr) * 2000-03-20 2001-09-27 Atg Test Systems Gmbh & Co Kg Dispositif pour le test de cartes imprimees
US6677773B2 (en) 2000-03-20 2004-01-13 Atg Test Systems Gmbh & Co. Kg Testing device for printed circuit boards
WO2005078460A1 (fr) * 2004-02-16 2005-08-25 Infineon Technologies Ag Procede et dispositif pour controler un element semi-conducteur dote de surfaces de contact sur les deux faces
US7768284B2 (en) 2004-02-16 2010-08-03 Infineon Technologies Ag Test apparatus for testing a semiconductor device, and method for testing the semiconductor device
KR20180050672A (ko) * 2015-08-21 2018-05-15 광저우 패스트프린트 서킷 테크 컴퍼니 리미티드 다 재료 수의 접속 판의 전기적 성능을 시험하는 방법
KR102012323B1 (ko) 2015-08-21 2019-08-20 광저우 패스트프린트 서킷 테크 컴퍼니 리미티드 다중 소재 접합 기판의 전기적 성능 테스트 방법

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