WO2000017662A1 - Testing device for modules - Google Patents
Testing device for modules Download PDFInfo
- Publication number
- WO2000017662A1 WO2000017662A1 PCT/EP1999/007082 EP9907082W WO0017662A1 WO 2000017662 A1 WO2000017662 A1 WO 2000017662A1 EP 9907082 W EP9907082 W EP 9907082W WO 0017662 A1 WO0017662 A1 WO 0017662A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- contact
- test
- tray
- elements
- modules
- Prior art date
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
- G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
Definitions
- the invention relates to a test device for electronic modules arranged in receiving recesses of a tray with a circuit board with electrical contact fields on an upper and a lower side and with electronic components on the circuit board.
- test contact elements of a test device.
- the structure of the test device is simplified if all test contact elements can be moved against the module to be tested from one side, namely either from the top or from the bottom. This in turn presupposes that the contact fields on the sides facing away from the test contact elements are electrically “displaced” by means of a contact deflection element such that they can now be contacted from the same side as the contact fields on the side facing the test contact elements.
- a contact redirection device is out DE-A-196 54 404. However, this device is not for testing devices placed on a tray
- the invention has for its object to provide a test device for electronic modules that allows testing a variety of these modules on a tray.
- the invention proposes a test device for electronic modules arranged in receiving recesses of a tray with a circuit board with electrical contact fields on an upper and a lower side and with electronic components on the circuit board, the Receiving recesses have through openings extending from the top to the underside of the tray with support edges for the modules and the modules leaving areas of the through openings on the
- this test device is provided with: a test head with first test contact elements for contacting the
- Test contact elements the test head being arranged facing the top of the tray, and a plurality of contact deflection elements arranged on the underside of the tray facing away from the test head, the test contact elements for
- each contact deflection element being one within one
- test contact elements carrying the first part and a second part, which is arranged next to a module within the exposed area of a through opening of the tray and has an upper side facing the test head, which is in contact with the contact fields of the
- the contact deflection elements are designed in such a way that a part of them is located within an uncovered area of the through-openings of the tray that is not covered by the modules when testing.
- the tray can be moved in the direction of the contact deflection elements, or alternatively or additionally, the contact deflection elements can be moved in the direction of the tray.
- the contact deflection elements are part of the test head or are integrated in the tray.
- that part of the test head which carries the test contact elements is expediently moved from one side and that part of the test head which has the contact deflection elements from the other side to the tray and thus to the modules arranged in its receiving recesses.
- a multiplicity of memory modules 14 are arranged on a tray 10 with a plurality of N-depressions 12.
- Each memory module 14 has a circuit board 16 with one or more memory modules 18.
- the memory modules 14 each lie on three edges of their boards 16 on the edges 20 of through openings 22 of the depressions 12 of the tray 10.
- the electrical contact fields 24 and 26 are located in the area of the free fourth edges 23 of the memory modules 14.
- the electrical contact fields 24 are located on the top sides 28 of the modules 14, while the electrical contact fields 26 are located directly below the contact fields 24 on the undersides 30 of the Modules 14 are arranged.
- Above the tray 10 is the test head 32 of a test device 34, which can be moved downward, that is to say in the direction of the tray 10, for testing the modules 14.
- the test head 32 has a multiplicity of first contact elements 36 and a multiplicity of second contact elements 38.
- the test head 32 is shown in solid lines in the state in which the first test contact elements 36 contact the contact fields 24;
- the situation in which the test head 32 has moved away from the tray 10 is shown in dashed lines.
- a carrier element 40 is shown, on which a number of contact deflection elements 42 corresponding to the number of depressions 12 and through openings 22 of the tray are arranged.
- Each of these contact deflection elements 42 is essentially L-shaped and has a first part 44 with test contact elements 46 and a second part 48 with contact fields 50 projecting upward from the first part 44 in the direction of the tray 10.
- the test contact elements 46 of the contact deflection elements 42 contact the contact fields 26 on the undersides 30 of the modules 14.
- the projecting second parts 48 of the contact deflection elements 42 are located within the exposed areas 52 of the through openings 22 of the depressions adjoining the edges 23 of the modules 14 12 of the tray 10 and extend through them, their contact fields 50 being arranged at substantially the same height as the contact fields 24 on the upper sides 28 of the modules 14.
- the second test contact elements 38 can contact the contact fields 50 of the contact deflection elements by moving the test head 32 up. As indicated in the drawing at 54, the contact fields 50 are electrically connected to the test contact elements 46, so that the second test contact elements 38 of the test head 32 are thus electrically connected to the contact fields 26 located on the undersides 30 of the modules 14. This also allows the modules on the undersides 30 Contact 14 located contact fields 26, so to speak, from the top 28 of the modules 14.
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The invention relates to a testing device (34) for testing electronic modules (14) positioned in the cavities (12) of a tray (10). Said modules comprise a board (16) with electric contact fields (24, 26) on an upper side (28) and a lower side (30) of said board (16), as well as electronic components (18) on at least one side of the board (16). The cavities (12) of the tray (10) present through holes (22) which extend from the upper to the lower side of the tray (10) and have locating edges (20) for the modules (14). The modules (14) rest on the locating edges (20) such that they leave areas (52) of the through holes (22) uncovered. The testing device (34) is provided with a test head (32) having first test contact elements (36) for contacting the contact fields (24) on the upper sides (28) of the modules (14) as well as second test contact elements (38). The test head (32) is positioned such that it faces the upper side of the tray (10). The device further comprises several contact deflection elements (42) which are arranged on the lower side of the tray (10) facing away from the test head (32). Said deflection elements comprise test contact elements (46) for contacting the contact fields (26) on the lower sides (30) of the modules (14) as well as contact fields (50) which are electrically connected to the test contact elements (46) for being contacted by the second test contact elements (38) of the test head (32). Each contact deflection elements (42) comprises a first part (44), which is arranged inside a through hole (22) of the tray (10) beneath the module (14) and carries the test contact elements (46), and a second part (48) which is positioned next to a module (14) within the uncovered area (52) of a through hole (22) of the tray (10) and has a surface which faces the test head (32) which is provided with the contact fields (50) of the contact deflection element (46).
Description
Testvorrichtung für Module Test device for modules
Die Erfindung betrifft eine Testvorrichtung für in Aufhahmevertiefungen eines Tray angeordnete elektronische Module mit einer Platine mit elektrischen Kontaktfeldem an einer Ober- und einer Unterseite und mit elektronischen Bauteilen auf der Platine.The invention relates to a test device for electronic modules arranged in receiving recesses of a tray with a circuit board with electrical contact fields on an upper and a lower side and with electronic components on the circuit board.
Das Testen von elektronischen Modulen, also von mit Bauteilen bestückten Platinen, auf deren Funktionstüchtigkeit hin macht dann, wenn die Platine an ihrer Ober- und an ihrer Unterseite Kontaktfelder aufweist, die beidseitige Kontaktierung der Platine mittels Testkontaktelementen einer Testvorrichtung erforderlich. Der Aufbau der Testvorrichtung vereinfacht sich, wenn sämtliche Testkontaktelemente von einer Seite, nämlich entweder von der Ober- oder von der Unterseite des zu testenden Moduls gegen dieses gefahren werden können. Das wiederum setzt voraus, daß die Kontaktfelder auf den den Testkontaktelementen abgewandten Seiten mittels eines Kontaktumlenkungselements elektrisch derart „verlagert" werden, daß sie nun von der gleichen Seite wie die Kontaktfelder auf der den Testkon taktelementen zugewandten Seite kontaktiert werden können. Eine derartige Kontaktumleitungsvorrichtung ist aus DE-A-196 54 404 bekannt. Diese Norrichtung ist jedoch nicht für das Testen von auf einem Tray angeordneteThe testing of electronic modules, that is to say printed circuit boards equipped with components, for their functionality, if the printed circuit board has contact fields on its top and on its underside, makes it necessary to make contact with the board on both sides by means of test contact elements of a test device. The structure of the test device is simplified if all test contact elements can be moved against the module to be tested from one side, namely either from the top or from the bottom. This in turn presupposes that the contact fields on the sides facing away from the test contact elements are electrically “displaced” by means of a contact deflection element such that they can now be contacted from the same side as the contact fields on the side facing the test contact elements. Such a contact redirection device is out DE-A-196 54 404. However, this device is not for testing devices placed on a tray
Module geeignet.Suitable for modules.
Der Erfindung liegt die Aufgabe zugrunde, eine Testvorrichtung für elektronische Module zu schaffen, die das Testen einer Vielzahl dieser Module auf einem Tray erlaubt.The invention has for its object to provide a test device for electronic modules that allows testing a variety of these modules on a tray.
Zur Lösung dieser Aufgabe wird mit der Erfindung eine Testvorrichtung für in Aufnahmevertiefungen eines Tray angeordnete elektronische Module mit einer Platine mit elektrischen Kontaktfeldern an einer Ober- und einer Unterseite und mit elektronischen Bauelementen auf der Platine vorgeschlagen, wobei die
Aufnahmevertiefungen sich von der Oberseite bis zur Unterseite des Tray erstreckende Durchgangsöffnungen mit Auflagerändern für die Module aufweisen und die Module unter Freilassen von Bereichen der Durchgangsöffhungen auf denTo achieve this object, the invention proposes a test device for electronic modules arranged in receiving recesses of a tray with a circuit board with electrical contact fields on an upper and a lower side and with electronic components on the circuit board, the Receiving recesses have through openings extending from the top to the underside of the tray with support edges for the modules and the modules leaving areas of the through openings on the
Auflagerändern ruhen. Diese Testvorrichtung ist erfindungsgemäß versehen mit: - einem Testkopf mit ersten Testkontaktelementen zur Kontaktierung derRest edges. According to the invention, this test device is provided with: a test head with first test contact elements for contacting the
Kontaktfelder auf den Oberseiten der Module und mit zweitenContact fields on the top of the modules and with second ones
Testkontaktelementen, wobei der Testkopf der Oberseite des Tray zugewandt angeordnet ist, und mehreren auf der dem Testkopf abgewandten Unterseite des Tray angeordneten Kontaktumlenkungelementen, die Testkontaktelemente zurTest contact elements, the test head being arranged facing the top of the tray, and a plurality of contact deflection elements arranged on the underside of the tray facing away from the test head, the test contact elements for
Kontaktierung der Kontaktfelder an den Unterseiten der Module und mit den Testkontaktelementen elektrisch verbundene Kontaktfelder zur Kontaktierung durch die zweiten Testkontaktelemente des Testkopfes aufweisen, - wobei jedes Kontaktumlenkungselement einen innerhalb einerContacting the contact fields on the undersides of the modules and having contact fields electrically connected to the test contact elements for contacting by the second test contact elements of the test head, each contact deflection element being one within one
Durchgangsöffnung des Tray unterhalb des Moduls angeordneten, die Testkontaktelemente tragenden ersten Teil und einen zweiten Teil aufweist, der neben einem Modul innerhalb des freiliegenden Bereichs einer Durchgangsöff ung des Tray angeordnet ist und eine dem Testkopf zugewandte Oberseite aufweist, die mit den Kontaktfeldern desThrough opening of the tray arranged below the module, the test contact elements carrying the first part and a second part, which is arranged next to a module within the exposed area of a through opening of the tray and has an upper side facing the test head, which is in contact with the contact fields of the
Kontaktumlenkungselements versehen ist.Contact deflection element is provided.
Nach der Erfindung sind die Kontaktumlenkungselemente derart ausgestaltet, daß sich jeweils ein Teil von ihnen innerhalb eines von den Modulen nicht überdeckten freigelassenen Bereichs der Durchgangsöffhungen des Trays befindet, wenn getestet wird.According to the invention, the contact deflection elements are designed in such a way that a part of them is located within an uncovered area of the through-openings of the tray that is not covered by the modules when testing.
In vorteilhafter Weiterbildung der Erfindung ist vorgesehen, daß sämtliche Kontaktumlenkungselemente, die in die freigelassenen Bereiche der ihnen zugeordneten Durchgangsöffhungen der Aufhahmevertiefungen des Tray
eintauchen bzw. in diesen angeordnet sind, von einem gemeinsamen Trägerelement gehalten sind. Zweckmäßigerweise ist zum Kontaktieren der Kontaktfelder der Kontaktumlenkungselemente durch die zweiten Testkontaktelemente des Testkopfes das Tray in Richtung auf die Kontaktumlenkungselemente bewegbar, oder alternativ bzw. zusätzlich, sind die Kontaktumlenkungselemente in Richtung auf das Tray bewegbar.In an advantageous development of the invention, it is provided that all the contact deflection elements which are in the released areas of the through openings of the receiving recesses of the tray assigned to them immerse or are arranged in these are held by a common carrier element. Appropriately, for contacting the contact fields of the contact deflection elements by the second test contact elements of the test head, the tray can be moved in the direction of the contact deflection elements, or alternatively or additionally, the contact deflection elements can be moved in the direction of the tray.
Schließlich besteht eine weitere Alternative der Erfindung darin, daß die Kontaktumlenkungselemente Bestandteil des Testkopfes sind oder im Tray integriert sind. Im erstgenannten Fall wird dann zweckmäßigerweise derjenige Teil des Testkopfes, der die Testkontaktelemente trägt, von der einen Seite und derjenige Teil des Testkopfes, der die Kontaktumlenkungselemente aufweist, von der anderen Seite an das Tray und damit an die in dessen Aufhahmevertiefungen angeordneten Module herangefahren.Finally, a further alternative of the invention is that the contact deflection elements are part of the test head or are integrated in the tray. In the former case, that part of the test head which carries the test contact elements is expediently moved from one side and that part of the test head which has the contact deflection elements from the other side to the tray and thus to the modules arranged in its receiving recesses.
Die Erfindung wird nachfolgend anhand der Zeichnung,' in der im Querschnitt der Aufbau einer Testvorrichtung dargestellt ist, näher erläutert.The invention is illustrated below with reference to the drawing, 'in the cross-section of the construction of a test device, described in more detail.
Auf einem Tray 10 mit mehreren Nertiefungen 12 sind eine Vielzahl von Speichermodulen 14 angeordnet. Jedes Speichermodul 14 weist eine Platine 16 mit einem oder mehreren Speicherbausteinen 18 auf. Die Speichermodule 14 liegen jeweils an drei Rändern ihrer Platinen 16 auf den Rändern 20 von Durchgangsöffnungen 22 der Vertiefungen 12 des Tray 10 auf. Im Bereich der jeweils freibleibenden vierten Ränder 23 der Speichermodule 14 befinden sich die elektrischen Kontaktfelder 24 und 26. Dabei befinden sich die elektrischen Kontaktfelder 24 auf den Oberseiten 28 der Module 14, während die elektrischen Kontaktfelder 26 direkt unterhalb der Kontaktfelder 24 auf den Unterseiten 30 der Module 14 angeordnet sind.
Oberhalb des Tray 10 befindet sich der Testkopf 32 einer Testvorrichtung 34, welcher zum Testen der Module 14 nach unten, das heißt in Richtung auf das Tray 10, verfahrbar ist. Der Testkopf 32 hat eine Vielzahl von ersten Kontaktelementen 36 und eine Vielzahl von zweiten Kontaktelementen 38. In der Zeichnung ist der Testkopf 32 in durchgezogenen Linien in demjenigen Zustand dargestellt, in dem die ersten Testkontaktelemente 36 die Kontaktfelder 24 kontaktieren; in gestrichelten Linien ist die Situation gezeigt, in der der Testkopf 32 von dem Tray 10 abgerückt ist. Auf der dem Testkopf 32 abgewandten Seite des Tray 10, das heißt in der Zeichnung unterhalb des Tray 10, ist ein Trägerelement 40 dargestellt, auf dem eine der Anzahl der Vertiefungen 12 und der Durchgangsöffhungen 22 des Tray entsprechende Anzahl von Kontaktumlenkungselementen 42 angeordnet sind. Jedes dieser Kontaktumlenkungselemente 42 ist im wesentlichen L-förmig ausgebildet und weist einen ersten Teil 44 mit Testkontaktelementen 46 und einen vom ersten Teil 44 in Richtung auf das Tray 10 nach oben vorstehenden zweiten Teil 48 mit Kontaktfeldem 50 auf. Die Testkontaktelemente 46 der Kontaktumlenkungselemente 42 kontaktieren die Kontaktfelder 26 an den Unterseiten 30 der Module 14. In diesem Kontaktierungszustand befinden sich die vorstehenden zweiten Teile 48 der Kontaktumlenkungselemente 42 innerhalb der sich an die Ränder 23 der Module 14 anschließenden freigelassenen Bereiche 52 der Durchgangsöffhungen 22 der Vertiefungen 12 des Tray 10 und erstrecken sich durch diese hindurch, wobei ihre Kontaktfelder 50 in im wesentlichen der gleichen Höhe wie die Kontaktfelder 24 an den Oberseiten 28 der Module 14 angeordnet sind. Wenn sich die Kontaktumlenkungselemente 42 in diesem in der Zeichnung in durchgezogenen Linien dargestellten Zustand befinden, können durch Heranfahren des Testkopfes 32 die zweiten Testkontaktelemente 38 die Kontaktfelder 50 der Kontaktumlenkungselemente kontaktieren. Wie in der Zeichnung bei 54 angedeutet, sind die Kontaktfelder 50 mit den Testkontaktelementen 46 elektrisch verbunden, so daß damit die zweiten Testkontaktelemente 38 des Testkopfes 32 elektrisch mit den an den Unterseiten 30 der Module 14 befindlichen Kontaktfelder 26 verbunden sind. Damit lassen sich auch die an den Unterseiten 30 der Module
14 befindlichen Kontaktfelder 26 sozusagen von der Oberseite 28 der Module 14 kontaktieren.
A multiplicity of memory modules 14 are arranged on a tray 10 with a plurality of N-depressions 12. Each memory module 14 has a circuit board 16 with one or more memory modules 18. The memory modules 14 each lie on three edges of their boards 16 on the edges 20 of through openings 22 of the depressions 12 of the tray 10. The electrical contact fields 24 and 26 are located in the area of the free fourth edges 23 of the memory modules 14. The electrical contact fields 24 are located on the top sides 28 of the modules 14, while the electrical contact fields 26 are located directly below the contact fields 24 on the undersides 30 of the Modules 14 are arranged. Above the tray 10 is the test head 32 of a test device 34, which can be moved downward, that is to say in the direction of the tray 10, for testing the modules 14. The test head 32 has a multiplicity of first contact elements 36 and a multiplicity of second contact elements 38. In the drawing, the test head 32 is shown in solid lines in the state in which the first test contact elements 36 contact the contact fields 24; The situation in which the test head 32 has moved away from the tray 10 is shown in dashed lines. On the side of the tray 10 facing away from the test head 32, that is to say in the drawing below the tray 10, a carrier element 40 is shown, on which a number of contact deflection elements 42 corresponding to the number of depressions 12 and through openings 22 of the tray are arranged. Each of these contact deflection elements 42 is essentially L-shaped and has a first part 44 with test contact elements 46 and a second part 48 with contact fields 50 projecting upward from the first part 44 in the direction of the tray 10. The test contact elements 46 of the contact deflection elements 42 contact the contact fields 26 on the undersides 30 of the modules 14. In this contacting state, the projecting second parts 48 of the contact deflection elements 42 are located within the exposed areas 52 of the through openings 22 of the depressions adjoining the edges 23 of the modules 14 12 of the tray 10 and extend through them, their contact fields 50 being arranged at substantially the same height as the contact fields 24 on the upper sides 28 of the modules 14. If the contact deflection elements 42 are in this state shown in solid lines in the drawing, the second test contact elements 38 can contact the contact fields 50 of the contact deflection elements by moving the test head 32 up. As indicated in the drawing at 54, the contact fields 50 are electrically connected to the test contact elements 46, so that the second test contact elements 38 of the test head 32 are thus electrically connected to the contact fields 26 located on the undersides 30 of the modules 14. This also allows the modules on the undersides 30 Contact 14 located contact fields 26, so to speak, from the top 28 of the modules 14.
Claims
1. Testvorrichtung (34) für in Aufhahmevertiefungen (12) eines Tray (10) angeordnete elektronische Module (14) mit einer Platine (16) mit elektrischen Kontaktfeldem (24,26) an einer Oberseite (28) und einer Unterseite (30) der1. Test device (34) for electronic modules (14) arranged in receiving recesses (12) of a tray (10) with a circuit board (16) with electrical contact fields (24, 26) on an upper side (28) and a lower side (30) of the
Platine (16) und mit elektronischen Bauteilen (18) auf zumindest einer Seite der Platine (16), wobei die Aufhahmevertiefungen (12) des Tray (10) sich von der Oberseite bis zur Unterseite des Tray (10) erstreckende Durchgangsöffnungen (22) mit Auflagerändern (20) für die Module (14) aufweisen und die Module (14) unter Freilassung von Bereichen (52) derCircuit board (16) and with electronic components (18) on at least one side of the circuit board (16), the receiving recesses (12) of the tray (10) extending through openings (22) from the top to the bottom of the tray (10) Have support edges (20) for the modules (14) and the modules (14) leaving areas (52) free
Durchgangsöffnungen (22) auf den Auflagerändern (20) ruhen, wobei die Testvorrichtung (34) versehen ist mit einem Testkopf (32) mit ersten Testkontaktelementen (36) zur Kontaktierung der Kontaktfelder (24) auf den Oberseiten (28) der Module (14) und mit zweiten Testkontaktelementen (38), wobei der Testkopf (32) der Oberseite des Tray (10) zugewandt angeordnet ist, und mehreren auf der dem Testkopf (32) abgewandten Unterseite des Tray (10) angeordneten Kontaktumlenkungelementen (42), die Testkontaktelemente (46) zur Kontaktierung der Kontaktfelder (26) an den Unterseiten (30) der Module (14) und mit den Testkontaktelementen (46) elektrisch verbundene Kontaktfelder (50) zur Kontaktierung durch die zweiten Testkontaktelemente (38) des Testkopfes (32) aufweisen, wobei jedes Kontaktumlenkungselement (42) einen innerhalb einer Durchgangsöffnung (22) des Tray (10) unterhalb des Moduls (14) angeordneten, die Testkontaktelemente (46) tragenden ersten Teil (44) und einen zweiten Teil (48) aufweist, der neben einem Modul (14) innerhalb des freiliegenden Bereichs (52) einer Durchgangsöffnung (22) des Tray (10) angeordnet ist und eine dem Testkopf (32) zugewandte Oberseite aufweist, die mit den Kontaktfeldem (50) des Kontaktumlenkungselements (46) versehen ist.
Through openings (22) rest on the support edges (20), the test device (34) being provided with a test head (32) with first test contact elements (36) for contacting the contact fields (24) on the upper sides (28) of the modules (14) and with second test contact elements (38), the test head (32) being arranged facing the top of the tray (10), and a plurality of contact deflection elements (42) arranged on the underside of the tray (10) facing away from the test head (32), the test contact elements ( 46) for contacting the contact fields (26) on the undersides (30) of the modules (14) and with the test contact elements (46) electrically connected contact fields (50) for contacting through the second test contact elements (38) of the test head (32), wherein each contact deflection element (42) has a first part (44), which carries the test contact elements (46) and a second part (48), which is arranged inside a through opening (22) of the tray (10) below the module (14) which is arranged next to a module (14) within the exposed area (52) of a through opening (22) of the tray (10) and has an upper side facing the test head (32) which is in contact with the contact fields (50) of the contact deflection element (46 ) is provided.
2. Testvorrichtung nach Anspruch 1 , dadurch gekennzeichnet, daß die Kontaktumlenkungselemente (42) von einem gemeinsamen Trägerelement (40) gehalten sind.2. Test device according to claim 1, characterized in that the contact deflection elements (42) are held by a common carrier element (40).
3. Testvorrichtung nach Anspruch 1 oder 2, dadurch gekennzeichnet, daß das Tray (10) in Richtung auf die Kontaktumlenkungselemente (42) bewegbar ist oder die Kontaktumlenkungselemente (42) in Richtung auf das Tray (10) bewegbar sind.3. Test device according to claim 1 or 2, characterized in that the tray (10) in the direction of the contact deflection elements (42) is movable or the contact deflection elements (42) in the direction of the tray (10) are movable.
4. Testvorrichtung nach Anspruch 1 , dadurch gekennzeichnet, daß die Kontaktumlenkungselemente (42) in das Tray (10) integriert sind.
4. Test device according to claim 1, characterized in that the contact deflection elements (42) are integrated in the tray (10).
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19843775.7 | 1998-09-24 | ||
| DE19843775 | 1998-09-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2000017662A1 true WO2000017662A1 (en) | 2000-03-30 |
Family
ID=7882068
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/EP1999/007082 WO2000017662A1 (en) | 1998-09-24 | 1999-09-23 | Testing device for modules |
Country Status (1)
| Country | Link |
|---|---|
| WO (1) | WO2000017662A1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001071371A1 (en) * | 2000-03-20 | 2001-09-27 | Atg Test Systems Gmbh & Co Kg | Testing device for printed boards |
| WO2005078460A1 (en) * | 2004-02-16 | 2005-08-25 | Infineon Technologies Ag | Device and method for testing a semi-conductor component having contact surfaces on both sides |
| KR20180050672A (en) * | 2015-08-21 | 2018-05-15 | 광저우 패스트프린트 서킷 테크 컴퍼니 리미티드 | How to Test the Electrical Performance of Multi-Material Water Connection Plates |
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|---|---|---|---|---|
| DE19654404A1 (en) * | 1996-12-24 | 1998-06-25 | Hewlett Packard Co | Adaptation device for the electrical test of printed circuit boards |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| DE19654404A1 (en) * | 1996-12-24 | 1998-06-25 | Hewlett Packard Co | Adaptation device for the electrical test of printed circuit boards |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001071371A1 (en) * | 2000-03-20 | 2001-09-27 | Atg Test Systems Gmbh & Co Kg | Testing device for printed boards |
| US6677773B2 (en) | 2000-03-20 | 2004-01-13 | Atg Test Systems Gmbh & Co. Kg | Testing device for printed circuit boards |
| WO2005078460A1 (en) * | 2004-02-16 | 2005-08-25 | Infineon Technologies Ag | Device and method for testing a semi-conductor component having contact surfaces on both sides |
| US7768284B2 (en) | 2004-02-16 | 2010-08-03 | Infineon Technologies Ag | Test apparatus for testing a semiconductor device, and method for testing the semiconductor device |
| KR20180050672A (en) * | 2015-08-21 | 2018-05-15 | 광저우 패스트프린트 서킷 테크 컴퍼니 리미티드 | How to Test the Electrical Performance of Multi-Material Water Connection Plates |
| KR102012323B1 (en) | 2015-08-21 | 2019-08-20 | 광저우 패스트프린트 서킷 테크 컴퍼니 리미티드 | Electrical performance test method of multi-material junction board |
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