KR101872056B1 - 처리액 공급 장치 및 처리액 공급 방법 - Google Patents

처리액 공급 장치 및 처리액 공급 방법 Download PDF

Info

Publication number
KR101872056B1
KR101872056B1 KR1020140130245A KR20140130245A KR101872056B1 KR 101872056 B1 KR101872056 B1 KR 101872056B1 KR 1020140130245 A KR1020140130245 A KR 1020140130245A KR 20140130245 A KR20140130245 A KR 20140130245A KR 101872056 B1 KR101872056 B1 KR 101872056B1
Authority
KR
South Korea
Prior art keywords
pump
filter device
liquid
supply
discharge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020140130245A
Other languages
English (en)
Korean (ko)
Other versions
KR20150039569A (ko
Inventor
유이치 데라시타
고우스케 요시하라
고지 다카야나기
도시노부 후루쇼
다카시 사사
Original Assignee
도쿄엘렉트론가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 도쿄엘렉트론가부시키가이샤 filed Critical 도쿄엘렉트론가부시키가이샤
Publication of KR20150039569A publication Critical patent/KR20150039569A/ko
Application granted granted Critical
Publication of KR101872056B1 publication Critical patent/KR101872056B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274Photolithographic processes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Coating Apparatus (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Degasification And Air Bubble Elimination (AREA)
  • Filtration Of Liquid (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
KR1020140130245A 2013-10-02 2014-09-29 처리액 공급 장치 및 처리액 공급 방법 Active KR101872056B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013207748A JP5967045B2 (ja) 2013-10-02 2013-10-02 処理液供給装置及び処理液供給方法
JPJP-P-2013-207748 2013-10-02

Publications (2)

Publication Number Publication Date
KR20150039569A KR20150039569A (ko) 2015-04-10
KR101872056B1 true KR101872056B1 (ko) 2018-06-27

Family

ID=52739842

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020140130245A Active KR101872056B1 (ko) 2013-10-02 2014-09-29 처리액 공급 장치 및 처리액 공급 방법

Country Status (5)

Country Link
US (2) US10074546B2 (enExample)
JP (1) JP5967045B2 (enExample)
KR (1) KR101872056B1 (enExample)
CN (1) CN104517814B (enExample)
TW (1) TWI621472B (enExample)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
PT3137768T (pt) * 2014-04-30 2021-01-19 Anthony George Hurter Aparelho e processo de purificação com água supercrítica de óleo combustível usado
CN106463357B (zh) * 2014-05-15 2019-06-28 东京毅力科创株式会社 增加光致抗蚀剂分配系统中再循环和过滤的方法和设备
KR102637965B1 (ko) * 2015-12-09 2024-02-20 에이씨엠 리서치 (상하이), 인코포레이티드 고온 화학물 및 초음파 장치를 이용한 기판 세정 방법 및 장치
JP6685754B2 (ja) 2016-02-16 2020-04-22 株式会社Screenホールディングス ポンプ装置および基板処理装置
JP6685759B2 (ja) * 2016-02-18 2020-04-22 株式会社Screenホールディングス 基板処理装置
JP6736989B2 (ja) * 2016-06-07 2020-08-05 東京エレクトロン株式会社 処理液供給装置、機器ユニット、処理液供給方法及び記憶媒体
CN110520965B (zh) * 2017-04-06 2023-06-02 东京毅力科创株式会社 供液装置和供液方法
JP6920133B2 (ja) * 2017-08-23 2021-08-18 株式会社Screenホールディングス 処理液供給装置
JP6966265B2 (ja) * 2017-08-31 2021-11-10 株式会社Screenホールディングス ポンプ装置、処理液供給装置、基板処理装置、液抜き方法および液置換方法
JP6905902B2 (ja) * 2017-09-11 2021-07-21 東京エレクトロン株式会社 処理液供給装置
JP6924846B2 (ja) * 2017-12-12 2021-08-25 東京エレクトロン株式会社 液供給装置及び液供給方法
JP6987649B2 (ja) * 2018-01-12 2022-01-05 株式会社Screenホールディングス 処理液供給装置及びその脱気方法
TWI800623B (zh) * 2018-03-23 2023-05-01 日商東京威力科創股份有限公司 液處理裝置及液處理方法
US10663865B2 (en) * 2018-06-29 2020-05-26 Taiwan Semiconductor Manufacturing Co., Ltd. Photoresist recycling apparatus
US11273396B2 (en) * 2018-08-31 2022-03-15 Taiwan Semiconductor Manufacturing Company, Ltd. Liquid supply system with improved bubble venting capacity
JP7202817B2 (ja) * 2018-09-05 2023-01-12 東京エレクトロン株式会社 送液システム
KR20200126552A (ko) 2019-04-30 2020-11-09 삼성전자주식회사 다중 필터들을 가진 레지스트 필터링 시스템 및 레지스트 코팅 설비
KR102444840B1 (ko) * 2019-11-07 2022-09-16 세메스 주식회사 약액공급장치
CN112786479B (zh) * 2019-11-08 2022-12-02 夏泰鑫半导体(青岛)有限公司 管理液体供应的系统与方法
US12194394B2 (en) * 2020-10-23 2025-01-14 Lg Energy Solution, Ltd. Electrode insulation liquid supply apparatus and electrode insulation liquid supply method
CN114609866A (zh) * 2021-02-02 2022-06-10 台湾积体电路制造股份有限公司 用于改进光致抗蚀剂涂覆操作的系统、装置和方法
JP7578535B2 (ja) * 2021-04-15 2024-11-06 株式会社コガネイ 液体供給装置
KR20230006728A (ko) 2021-07-02 2023-01-11 삼성전자주식회사 웨이퍼 건조 장치 및 웨이퍼 건조 방법
CN114446841B (zh) * 2022-04-12 2022-07-29 广州粤芯半导体技术有限公司 供酸装置及湿刻系统
CN119572956A (zh) * 2025-02-08 2025-03-07 沈阳芯源微电子设备股份有限公司 一种流体处理装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000012449A (ja) * 1998-06-26 2000-01-14 Tokyo Electron Ltd 処理液供給装置及び処理液供給方法
US20080230492A1 (en) 2007-03-20 2008-09-25 Taiwan Semiconductor Manufacturing Company, Ltd. System and Method for Replacing Resist Filter to Reduce Resist Filter-Induced Wafer Defects

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR970008315A (ko) * 1995-07-26 1997-02-24 김광호 반도체장치
JP3340394B2 (ja) * 1998-10-08 2002-11-05 東京エレクトロン株式会社 薬液供給システムおよび基板処理システムおよび基板処理方法
JP4011210B2 (ja) * 1998-10-13 2007-11-21 株式会社コガネイ 薬液供給方法および薬液供給装置
JP3952771B2 (ja) * 2001-12-27 2007-08-01 凸版印刷株式会社 塗布装置
JP3890229B2 (ja) * 2001-12-27 2007-03-07 株式会社コガネイ 薬液供給装置および薬液供給装置の脱気方法
JP3947398B2 (ja) * 2001-12-28 2007-07-18 株式会社コガネイ 薬液供給装置および薬液供給方法
US6848458B1 (en) * 2002-02-05 2005-02-01 Novellus Systems, Inc. Apparatus and methods for processing semiconductor substrates using supercritical fluids
JP4541069B2 (ja) * 2004-08-09 2010-09-08 東京エレクトロン株式会社 薬液供給システム
KR100643494B1 (ko) * 2004-10-13 2006-11-10 삼성전자주식회사 반도체 제조용 포토레지스트의 디스펜싱장치
US20070272327A1 (en) * 2006-04-27 2007-11-29 Applied Materials, Inc. Chemical dispense system
JP5018255B2 (ja) * 2007-06-07 2012-09-05 東京エレクトロン株式会社 薬液供給システム及び薬液供給方法並びに記憶媒体
JP4879253B2 (ja) * 2008-12-04 2012-02-22 東京エレクトロン株式会社 処理液供給装置
JP5451515B2 (ja) * 2010-05-06 2014-03-26 東京エレクトロン株式会社 薬液供給システム、これを備える基板処理装置、およびこの基板処理装置を備える塗布現像システム
JP5524154B2 (ja) * 2011-09-09 2014-06-18 東京エレクトロン株式会社 液処理装置及び液処理方法
JP5571056B2 (ja) 2011-11-04 2014-08-13 東京エレクトロン株式会社 処理液供給方法、プログラム、コンピュータ記憶媒体及び処理液供給装置
KR101849799B1 (ko) * 2012-02-16 2018-04-17 도쿄엘렉트론가부시키가이샤 액 처리 방법 및 필터 내의 기체의 제거 장치
JP5439579B2 (ja) * 2012-02-27 2014-03-12 東京エレクトロン株式会社 液処理装置及び液処理方法
JP5741549B2 (ja) * 2012-10-09 2015-07-01 東京エレクトロン株式会社 処理液供給方法、処理液供給装置及び記憶媒体
JP5453561B1 (ja) * 2012-12-20 2014-03-26 東京エレクトロン株式会社 液処理装置、液処理方法及び液処理用記憶媒体
US9446331B2 (en) * 2013-03-15 2016-09-20 Taiwan Semiconductor Manufacturing Co., Ltd. System and method for dispensing photoresist

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000012449A (ja) * 1998-06-26 2000-01-14 Tokyo Electron Ltd 処理液供給装置及び処理液供給方法
US20080230492A1 (en) 2007-03-20 2008-09-25 Taiwan Semiconductor Manufacturing Company, Ltd. System and Method for Replacing Resist Filter to Reduce Resist Filter-Induced Wafer Defects

Also Published As

Publication number Publication date
KR20150039569A (ko) 2015-04-10
US20150092167A1 (en) 2015-04-02
CN104517814B (zh) 2019-05-10
TW201529142A (zh) 2015-08-01
JP5967045B2 (ja) 2016-08-10
US20200227286A1 (en) 2020-07-16
CN104517814A (zh) 2015-04-15
US11342198B2 (en) 2022-05-24
TWI621472B (zh) 2018-04-21
US10074546B2 (en) 2018-09-11
JP2015073007A (ja) 2015-04-16

Similar Documents

Publication Publication Date Title
KR101872056B1 (ko) 처리액 공급 장치 및 처리액 공급 방법
TWI491432B (zh) 液體處理裝置及液體處理方法
KR102091984B1 (ko) 처리액 공급 방법, 처리액 공급 장치 및 컴퓨터 판독 가능한 기억 매체
US10268116B2 (en) Processing liquid supplying apparatus and method of supplying processing liquid
JP6607820B2 (ja) フィルタ立ち上げ装置、処理液供給装置、治具ユニット、フィルタの立ち上げ方法
KR102369120B1 (ko) 처리액 공급 방법, 컴퓨터 판독 가능한 기억 매체 및 처리액 공급 장치
JP5018255B2 (ja) 薬液供給システム及び薬液供給方法並びに記憶媒体
KR102477917B1 (ko) 처리액 여과 장치, 약액 공급 장치 및 처리액 여과 방법과 기억 매체
JPWO2019117043A1 (ja) 液供給装置及び液供給方法
JP6425669B2 (ja) 処理液供給方法、読み取り可能なコンピュータ記憶媒体及び処理液供給装置
JP2013058655A (ja) 液処理装置及び液処理方法
JP5956975B2 (ja) 液処理装置及び液処理方法
JP2016189493A (ja) 液処理方法、液処理装置及び記憶媒体
KR102873322B1 (ko) 액 처리 장치의 운전 방법 및 액 처리 장치
CN111589218B (zh) 过滤器润湿方法和处理液供给装置
JP5991403B2 (ja) フィルタウエッティング方法、フィルタウエッティング装置及び記憶媒体

Legal Events

Date Code Title Description
PA0109 Patent application

Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 20140929

PG1501 Laying open of application
A201 Request for examination
A302 Request for accelerated examination
AMND Amendment
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20170621

Comment text: Request for Examination of Application

Patent event code: PA02011R01I

Patent event date: 20140929

Comment text: Patent Application

PA0302 Request for accelerated examination

Patent event date: 20170621

Patent event code: PA03022R01D

Comment text: Request for Accelerated Examination

Patent event date: 20140929

Patent event code: PA03021R01I

Comment text: Patent Application

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20171025

Patent event code: PE09021S01D

AMND Amendment
E601 Decision to refuse application
PE0601 Decision on rejection of patent

Patent event date: 20180329

Comment text: Decision to Refuse Application

Patent event code: PE06012S01D

Patent event date: 20171025

Comment text: Notification of reason for refusal

Patent event code: PE06011S01I

AMND Amendment
PX0901 Re-examination

Patent event code: PX09011S01I

Patent event date: 20180329

Comment text: Decision to Refuse Application

Patent event code: PX09012R01I

Patent event date: 20171226

Comment text: Amendment to Specification, etc.

Patent event code: PX09012R01I

Patent event date: 20170621

Comment text: Amendment to Specification, etc.

PX0701 Decision of registration after re-examination

Patent event date: 20180529

Comment text: Decision to Grant Registration

Patent event code: PX07013S01D

Patent event date: 20180427

Comment text: Amendment to Specification, etc.

Patent event code: PX07012R01I

Patent event date: 20180329

Comment text: Decision to Refuse Application

Patent event code: PX07011S01I

Patent event date: 20171226

Comment text: Amendment to Specification, etc.

Patent event code: PX07012R01I

Patent event date: 20170621

Comment text: Amendment to Specification, etc.

Patent event code: PX07012R01I

X701 Decision to grant (after re-examination)
GRNT Written decision to grant
PR0701 Registration of establishment

Comment text: Registration of Establishment

Patent event date: 20180621

Patent event code: PR07011E01D

PR1002 Payment of registration fee

Payment date: 20180621

End annual number: 3

Start annual number: 1

PG1601 Publication of registration
PR1001 Payment of annual fee

Payment date: 20210601

Start annual number: 4

End annual number: 4

PR1001 Payment of annual fee

Payment date: 20220518

Start annual number: 5

End annual number: 5

PR1001 Payment of annual fee

Payment date: 20230523

Start annual number: 6

End annual number: 6

PR1001 Payment of annual fee

Payment date: 20240521

Start annual number: 7

End annual number: 7