KR101779250B1 - 시트 모양 수지체, 수지 성형 장치, 수지 성형 방법 및 성형 제품의 제조 방법 - Google Patents

시트 모양 수지체, 수지 성형 장치, 수지 성형 방법 및 성형 제품의 제조 방법 Download PDF

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Publication number
KR101779250B1
KR101779250B1 KR1020150040945A KR20150040945A KR101779250B1 KR 101779250 B1 KR101779250 B1 KR 101779250B1 KR 1020150040945 A KR1020150040945 A KR 1020150040945A KR 20150040945 A KR20150040945 A KR 20150040945A KR 101779250 B1 KR101779250 B1 KR 101779250B1
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KR
South Korea
Prior art keywords
resin
sheet
cavity
release film
mold
Prior art date
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KR1020150040945A
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English (en)
Korean (ko)
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KR20150125560A (ko
Inventor
신지 다카세
요시히사 가와모토
Original Assignee
토와 가부시기가이샤
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Application filed by 토와 가부시기가이샤 filed Critical 토와 가부시기가이샤
Publication of KR20150125560A publication Critical patent/KR20150125560A/ko
Application granted granted Critical
Publication of KR101779250B1 publication Critical patent/KR101779250B1/ko

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B29C43/183—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles the preformed layer being a lining, e.g. shaped in the mould before compression moulding, or a preformed shell adapted to the shape of the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/20—Making multilayered or multicoloured articles
    • B29C43/203—Making multilayered articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Engineering & Computer Science (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Mechanical Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Led Device Packages (AREA)
KR1020150040945A 2014-04-30 2015-03-24 시트 모양 수지체, 수지 성형 장치, 수지 성형 방법 및 성형 제품의 제조 방법 KR101779250B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014093364A JP6430143B2 (ja) 2014-04-30 2014-04-30 樹脂成形装置及び樹脂成形方法並びに成形製品の製造方法
JPJP-P-2014-093364 2014-04-30

Publications (2)

Publication Number Publication Date
KR20150125560A KR20150125560A (ko) 2015-11-09
KR101779250B1 true KR101779250B1 (ko) 2017-09-26

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020150040945A KR101779250B1 (ko) 2014-04-30 2015-03-24 시트 모양 수지체, 수지 성형 장치, 수지 성형 방법 및 성형 제품의 제조 방법

Country Status (4)

Country Link
JP (1) JP6430143B2 (zh)
KR (1) KR101779250B1 (zh)
CN (1) CN105034228B (zh)
TW (1) TWI597164B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210093149A (ko) * 2020-01-17 2021-07-27 토와 가부시기가이샤 수지 성형 장치, 수지 성형품의 제조 방법

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6641209B2 (ja) * 2016-03-22 2020-02-05 株式会社ディスコ 保護部材形成装置
JP6763692B2 (ja) * 2016-05-30 2020-09-30 アピックヤマダ株式会社 樹脂供給方法および樹脂成形方法
CN111801756A (zh) * 2018-02-23 2020-10-20 积水化学工业株式会社 构造体、光电转换元件的制造方法以及光电转换元件
WO2020115801A1 (ja) * 2018-12-03 2020-06-11 日立化成株式会社 封止シート、封止構造体及び封止構造体の製造方法
JP7439575B2 (ja) * 2020-03-06 2024-02-28 味の素株式会社 半導体装置の製造方法、及び、樹脂シート
JP7200961B2 (ja) * 2020-03-06 2023-01-10 味の素株式会社 半導体装置の製造方法、及び、樹脂シート
JP7444453B2 (ja) * 2020-11-25 2024-03-06 アピックヤマダ株式会社 樹脂封止装置及び樹脂封止方法
WO2023238516A1 (ja) * 2022-06-08 2023-12-14 アピックヤマダ株式会社 樹脂封止装置及び樹脂封止方法

Citations (2)

* Cited by examiner, † Cited by third party
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JP2003117933A (ja) 2001-10-17 2003-04-23 Matsushita Electric Works Ltd 電子部品の製造方法
JP2009113443A (ja) 2007-11-09 2009-05-28 Toray Ind Inc 微細形状転写シートの成形方法および微細形状転写シートの成形装置

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JPH11330010A (ja) * 1998-05-15 1999-11-30 Fujitsu Ltd 半導体装置の製造方法
JP4484329B2 (ja) * 2000-07-21 2010-06-16 アピックヤマダ株式会社 樹脂封止方法及び樹脂封止装置
JP2002231740A (ja) * 2001-01-30 2002-08-16 Towa Corp 樹脂封止装置の型開閉機構
JP4326786B2 (ja) * 2002-11-26 2009-09-09 Ｔｏｗａ株式会社 樹脂封止装置
JP4519398B2 (ja) * 2002-11-26 2010-08-04 Ｔｏｗａ株式会社 樹脂封止方法及び半導体装置の製造方法
JP2007301950A (ja) * 2006-05-15 2007-11-22 Sumitomo Heavy Ind Ltd 熱硬化性樹脂の成形方法及び成形装置
JP2009029930A (ja) * 2007-07-26 2009-02-12 Panasonic Electric Works Co Ltd 離型フィルム付き接着シートの作製方法
KR101101669B1 (ko) * 2009-12-01 2011-12-30 삼성전기주식회사 전자부품 제조장치 및 전자부품 제조방법
JP2012240348A (ja) * 2011-05-23 2012-12-10 Kyocera Chemical Corp 複合シート、複合シートの製造方法、電子部品、および電子機器
JP6071216B2 (ja) * 2012-02-28 2017-02-01 Ｔｏｗａ株式会社 樹脂封止用材料の製造方法及び樹脂封止装置
JP6039198B2 (ja) * 2012-03-07 2016-12-07 Ｔｏｗａ株式会社 樹脂封止電子部品の製造方法及び樹脂封止電子部品の製造装置
JP6143665B2 (ja) * 2013-12-26 2017-06-07 Ｔｏｗａ株式会社 半導体封止方法及び半導体封止装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003117933A (ja) 2001-10-17 2003-04-23 Matsushita Electric Works Ltd 電子部品の製造方法
JP2009113443A (ja) 2007-11-09 2009-05-28 Toray Ind Inc 微細形状転写シートの成形方法および微細形状転写シートの成形装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210093149A (ko) * 2020-01-17 2021-07-27 토와 가부시기가이샤 수지 성형 장치, 수지 성형품의 제조 방법
KR102361912B1 (ko) 2020-01-17 2022-02-14 토와 가부시기가이샤 수지 성형 장치, 수지 성형품의 제조 방법

Also Published As

Publication number Publication date
KR20150125560A (ko) 2015-11-09
CN105034228B (zh) 2018-12-25
CN105034228A (zh) 2015-11-11
TWI597164B (zh) 2017-09-01
TW201540501A (zh) 2015-11-01
JP6430143B2 (ja) 2018-11-28
JP2015208967A (ja) 2015-11-24

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