KR101763458B1 - 접착재 릴 - Google Patents

접착재 릴 Download PDF

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Publication number
KR101763458B1
KR101763458B1 KR1020147009593A KR20147009593A KR101763458B1 KR 101763458 B1 KR101763458 B1 KR 101763458B1 KR 1020147009593 A KR1020147009593 A KR 1020147009593A KR 20147009593 A KR20147009593 A KR 20147009593A KR 101763458 B1 KR101763458 B1 KR 101763458B1
Authority
KR
South Korea
Prior art keywords
adhesive
adhesive layer
tape
mass
winding core
Prior art date
Application number
KR1020147009593A
Other languages
English (en)
Korean (ko)
Other versions
KR20140054438A (ko
Inventor
가즈야 마쯔다
다까시 세끼
도오루 후지나와
다다야스 후지에다
Original Assignee
히타치가세이가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 히타치가세이가부시끼가이샤 filed Critical 히타치가세이가부시끼가이샤
Publication of KR20140054438A publication Critical patent/KR20140054438A/ko
Application granted granted Critical
Publication of KR101763458B1 publication Critical patent/KR101763458B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H37/00—Article or web delivery apparatus incorporating devices for performing specified auxiliary operations
    • B65H37/002—Web delivery apparatus, the web serving as support for articles, material or another web
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
    • H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15788—Glasses, e.g. amorphous oxides, nitrides or fluorides

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Storage Of Web-Like Or Filamentary Materials (AREA)
KR1020147009593A 2010-03-12 2011-03-10 접착재 릴 KR101763458B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JPJP-P-2010-056270 2010-03-12
JP2010056270 2010-03-12
JPJP-P-2010-086330 2010-04-02
JP2010086330 2010-04-02
PCT/JP2011/055671 WO2011111784A1 (ja) 2010-03-12 2011-03-10 接着材リール

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020127022602A Division KR20120113803A (ko) 2010-03-12 2011-03-10 접착재 릴

Publications (2)

Publication Number Publication Date
KR20140054438A KR20140054438A (ko) 2014-05-08
KR101763458B1 true KR101763458B1 (ko) 2017-07-31

Family

ID=44563582

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020127022602A KR20120113803A (ko) 2010-03-12 2011-03-10 접착재 릴
KR1020147009593A KR101763458B1 (ko) 2010-03-12 2011-03-10 접착재 릴

Family Applications Before (1)

Application Number Title Priority Date Filing Date
KR1020127022602A KR20120113803A (ko) 2010-03-12 2011-03-10 접착재 릴

Country Status (5)

Country Link
JP (3) JPWO2011111784A1 (ja)
KR (2) KR20120113803A (ja)
CN (2) CN104403589B (ja)
TW (1) TWI435841B (ja)
WO (1) WO2011111784A1 (ja)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6046896B2 (ja) * 2012-01-30 2016-12-21 デクセリアルズ株式会社 フィルム巻装体、及びフィルム巻装体の製造方法
JP5997306B2 (ja) * 2015-02-18 2016-09-28 株式会社ホンマ コーナー部用粘着テープ
WO2017090659A1 (ja) * 2015-11-25 2017-06-01 日立化成株式会社 回路接続用接着剤組成物及び構造体
DE102016200810A1 (de) 2016-01-21 2017-07-27 Tesa Se Abroller, Verwendung eines Abrollers, Klebeband zur Verklebung von Bauteilen und Verklebung von zwei Bauteilen
CN114196334A (zh) * 2016-01-29 2022-03-18 昭和电工材料株式会社 粘接剂带及其制造方法、以及粘接剂膜用卷轴
TWI770371B (zh) * 2018-03-23 2022-07-11 日商琳得科股份有限公司 晶粒接合薄膜、切割晶粒接合片及半導體晶片的製造方法
JP2020073404A (ja) * 2019-09-30 2020-05-14 日立化成株式会社 異方導電フィルム用リール及び異方導電フィルム巻
JP7446095B2 (ja) 2019-12-03 2024-03-08 デクセリアルズ株式会社 フィルム巻装体及び接続体の製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004186204A (ja) * 2002-11-29 2004-07-02 Hitachi Chem Co Ltd 回路部材接続用フィルム状接着剤及びこれを用いた半導体装置
JP2004323621A (ja) * 2003-04-23 2004-11-18 Hitachi Chem Co Ltd 接着材テープ
JP2009238676A (ja) * 2008-03-28 2009-10-15 Sony Chemical & Information Device Corp 異方性導電膜転写具及び接続方法

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JP3045427B2 (ja) * 1992-06-22 2000-05-29 ソニー株式会社 異方性導電膜の貼付け方法および装置
JPH0749504A (ja) * 1993-08-06 1995-02-21 Hitachi Electron Eng Co Ltd 異方性導電テープのカット目検出装置
JP3223780B2 (ja) * 1996-01-19 2001-10-29 松下電器産業株式会社 チップの実装装置
JPH1051115A (ja) * 1996-07-29 1998-02-20 Sony Corp 異方性導電膜貼付け装置及び異方性導電膜分割方法
JP4151083B2 (ja) * 1997-05-12 2008-09-17 日立化成工業株式会社 異方導電性接着テープの貼付け方法および装置
JP3648933B2 (ja) * 1997-08-06 2005-05-18 松下電器産業株式会社 異方性導電材の貼着方法
JPH11339575A (ja) * 1998-05-22 1999-12-10 Sony Corp 異方性導電性テープの製造方法及び装置
JP3680669B2 (ja) * 1999-12-17 2005-08-10 ソニーケミカル株式会社 多層異方性導電膜積層体
JP4648521B2 (ja) * 2000-07-17 2011-03-09 スタンレー電気株式会社 液晶装置の製造方法
JP2002226822A (ja) * 2001-01-30 2002-08-14 Three M Innovative Properties Co 光線活性化型接着フィルムを用いた基材接着方法
JP4239585B2 (ja) * 2002-12-24 2009-03-18 日立化成工業株式会社 接着剤テープの接続方法及び接着剤テープ接続体
CN100548840C (zh) * 2002-07-30 2009-10-14 日立化成工业株式会社 粘接材料带连接体及粘接材料带的连接方法
JP4333140B2 (ja) * 2003-01-08 2009-09-16 日立化成工業株式会社 接着剤テープの製造方法
JP4654566B2 (ja) * 2003-04-23 2011-03-23 日立化成工業株式会社 接着剤テープの接続方法及び接着剤テープ接続体
CN101831246B (zh) * 2004-06-09 2012-07-04 日立化成工业株式会社 粘结剂组合物、电路连接材料、电路部材的连接结构以及半导体装置
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JP2009004354A (ja) * 2007-05-23 2009-01-08 Hitachi Chem Co Ltd 接着材リール及びこれを用いた回路接続体の製造方法
CN102977798B (zh) * 2007-09-05 2015-04-29 日立化成株式会社 粘接剂以及使用该粘接剂的连接结构体

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004186204A (ja) * 2002-11-29 2004-07-02 Hitachi Chem Co Ltd 回路部材接続用フィルム状接着剤及びこれを用いた半導体装置
JP2004323621A (ja) * 2003-04-23 2004-11-18 Hitachi Chem Co Ltd 接着材テープ
JP2009238676A (ja) * 2008-03-28 2009-10-15 Sony Chemical & Information Device Corp 異方性導電膜転写具及び接続方法

Also Published As

Publication number Publication date
JPWO2011111784A1 (ja) 2013-06-27
JP5928567B2 (ja) 2016-06-01
KR20140054438A (ko) 2014-05-08
JP2014037544A (ja) 2014-02-27
TW201139259A (en) 2011-11-16
JP2015083691A (ja) 2015-04-30
CN102712834B (zh) 2014-11-26
CN104403589B (zh) 2017-01-11
TWI435841B (zh) 2014-05-01
WO2011111784A1 (ja) 2011-09-15
KR20120113803A (ko) 2012-10-15
CN102712834A (zh) 2012-10-03
CN104403589A (zh) 2015-03-11

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