TW201139259A - Adhesive material reel - Google Patents

Abstract

An adhesive material reel of this invention includes: a reel core, a pair of side plates disposed on the both side of the reel core and opposite to each other, an adhesive material tape having a tape-shaped substrate and an adhesive layer disposed on one side of the substrate, wherein the adhesive material tape is wrapped on the reel core in a way of the side of the substrate which the adhesive layer is not formed thereon facing the reel core.

Description

201139259 L VI. OBJECTS OF THE INVENTION: TECHNICAL FIELD OF THE INVENTION The present invention relates to a roll of a composite material, and more particularly to a tape-shaped substrate and a surface disposed on the substrate The adhesive tape of the adhesive layer is wound around a web of reel on the core. [Prior Art] A connecting material for electrically connecting circuit members having a plurality of electrodes to each other to manufacture a circuit connecting body is an anisotropic conductive film (ACF). The anisotropic conductive film is an integrated circuit connected to a substrate such as a printed wiring board, a liquid crystal display (LCD) glass substrate, or a flexible printed circuit board (

Circuit, IC), large integrated circuit (Scde integrated

Circuit, LSI) A material for electrically connecting and mechanically fixing a conductor element or a package member in order to maintain a conductive state of the opposing electrodes and to keep the adjacent electrodes insulated from each other. In addition to the anisotropic conductive film, a known material such as a non-conductive film (NCF) is used. The connecting material includes an adhesive component containing a thermosetting resin and conductive particles which are optionally formulated according to the case of the anisotropic conductive film, and is used in a base such as a polyethylene terephthalate film (PET film). The film is formed into a film. The entire material of the obtained film is cut into a strip shape so as to have a width suitable for the application, and is wound around a winding core to produce a backing roll (see Patent Document 1). However, one of the reasons for the decrease in the connection reliability of the circuit connector is the phenomenon of agglomeration in 201139259. The agglomeration refers to a phenomenon in which the adhesive layer is transferred to the back surface of the substrate when the adhesive tape in the wound state is pulled out. The adhesive layer provided on one side of the substrate is in an uncured state, and thus has a certain degree of fluidity. If the backing roll is placed for a long time, there is a case where the adhesive oozes from the end face of the tape, and the adhesive adheres to the side plate of the roll. When the adhesive tape is pulled out from the roll in this state, there is a problem that a part of the adhesive layer is transferred to the back surface of the substrate, or the adhesive layer is peeled off from the substrate to pull out only the substrate. The situation of the bad state. Fig. 9 is a cross-sectional view schematically showing an example of agglomerates generated when a subsequent tape is pulled from a previous material roll. The adhesive tape 25 shown in Fig. 9 is wound around the winding core 1 so that the adhesive layer 28 faces the core side (inner side) (the substrate % faces outward). When agglomeration occurs when the adhesive tape is pulled out, when a part of the adhesive layer is transferred to the back surface of the substrate, a necessary amount of the adhesive layer cannot be disposed at a predetermined position on the circuit member, and the connection portion is electrically charged. Sexual connections or mechanical fixation become inadequate. Further, in the case where the adhesive layer is peeled off from the substrate and only the substrate is pulled out, it is necessary to stop the production equipment, and the productivity is drastically lowered. In the field of circuit connectors, semiconductor wafers, and printed wiring boards, which require a large amount of production, etc., in order to be cost-competitive, it is very important to increase the number of production per unit time, and even if the stop time is several minutes or so, the influence is extremely large. Therefore, it has been strongly desired to improve agglomeration in the above-mentioned fields (Patent Document 2 to Patent Document 8). Patent Document 2 and Patent Document 3 describe a technique for suppressing agglomeration from the viewpoint of the shape of the adhesive tape, and discloses a width of the two-bit brain which is narrower than the width of the substrate at 4 201139259. Reading tape. Patent Document 4 describes a technique for suppressing agglomeration by the self-adhesive agent = Cheng, and the release material has a temporary fixing force to the substrate within a predetermined range. In Patent Document 5, it is noted that f has a technique for suppressing agglomeration from the viewpoint of use conditions, and discloses a device having a mechanism for controlling the temperature of the reel. In the case of the structure of the roll member of the material tape, the rib structure provided on the side plate is electrically conductive, and the structure of the base material is described. The technique of suppressing the riding block reveals a weight body having a surface 々ίϊϊ potential difference on the back surface of the inspection table as a base material. In the case of the patent document 8, the following is a viewpoint of the end point of the mark and the compatibility of the adhesive agent. [Prior Art Document] [Patent Document] Patent Document 1. Japanese Patent Laid-Open Publication No. Hei 2 No. Hei. Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. s self-contained, self-circuit connection 201139259 However, the current situation is that no consideration has been found, and the prevention measures against agglomeration are studied, and the countermeasures are replaced. [Summary of the Invention]

The layer is peeled off from the substrate to pull out the poor state of the substrate. n/, from the cutting of the coffin, which can suppress the bad state of the adhesive at a very high level. In the following description, "caking" refers to "a defective state in which the underlayer is peeled off from the substrate and the substrate is pulled out only when the adhesive tape is pulled out." The binder roll of the present invention comprises: a core; a pair of side plates disposed on opposite sides of the core in a mutually opposing manner; and a subsequent strip having a strip substrate and disposed on the substrate - The surface is followed by (4) and wound on the core; and the above-mentioned bonding material is wound on the winding core so that the surface of the substrate on which the adhesive layer is not formed faces the winding core side. In the field of the material roll, it is common knowledge that in order to keep the sizing agent layer away from the external environment, the adhesive layer is rolled toward the core side ((1)), and the substrate is oriented toward the outside. It is wound around a core (refer to FIG. 3 and FIG. 4 of the above-mentioned patent document 2). For example, when the adhesive layer is directed to the outside, there is a problem that a dust or the like adheres to the dust. In particular, even a small amount of dust used in the adhesive tape of the electronic material causes the σ to be made, so that it is subsequently wound toward the roll (10) to protect it from the source of contamination. However, the inventors of the present invention have attempted to fabricate a subsequent material in a manner that the substrate tape is wound toward the core side (closed) and the adhesive layer is directed outward, so that the adhesive tape is wound on the core, in violation of the conventional knowledge. The presence or absence of agglomeration on the web of the laminate was evaluated, and it was found that the agglomeration was prevented at an extremely high level. The reason why the agglomeration of the back surface of the adhesive tape can be highly suppressed by the reverse of the front surface is not necessarily clear, but the inventors of the present invention presume the following. That is, in the present invention, even if the adhesive is adhered to the side plate from the end surface of the adhesive layer of the adhesive tape, the tape is pulled out more than the adhesive layer when the tape is pulled out. The wire is spliced, so that the force of the subsequent strip to be pulled out and the force to be peeled off is not exerted, and the view from the portion adhered to the side panel is small; Block suppression. First, since the agglomeration is easy to occur, the length of the adhesive tape that can be wound around the winding core is closed, but by the configuration, the adhesive tape can be made longer than the prior art ( For example, 2〇〇m or more). In addition to the subsequent striping of the strip, in accordance with the present invention, the viscosity ratio can be lowered and the prior art towel is susceptible to agglomeration followed by the adhesive layer. This is a fortune, and then the ride is preferably 3 (the shear viscosity of rc is 10=00 Pa.s or less. The low-viscosity adhesive is, for example, a thermal radical-curable adhesive), which can be cited as a low-temperature hardening adhesive. The hardening type of adhesive is required to increase the flow under low temperature (4) such as 丨 丨赃 ~ 丨赃. Specific examples thereof include a thermal radical curing type adhesive containing a radical polymerization initiator having a one-minute half-life temperature of 16 or less. According to the present invention, even if the adhesive layer contains a large amount of a material in which 3CTC is liquid, the fluidity is relatively high, and agglomeration can be sufficiently suppressed. In the case where the above-mentioned thermal radical curing type is provided with a heat-radical resin, a radical polymerizable material derived from a base polymerizable substance from 201139259, and a radical polymerization initiator in a liquid form, the previous laminate roll is used. It is easy to produce agglomeration in a high probability in the cylinder. On the other hand, in the binder roll of the present invention, the content of the radical polymerizable substance in the thermal radical-curable adhesive is 2 即便 with respect to 100 parts by mass of the total amount of the thermoplastic resin and the radical polymerizable material. The mass parts of -80 parts by mass' can also sufficiently inhibit the agglomeration. The elixir layer 1 contains a thermoplastic resin, an epoxy-based adhesive contained in 3 (rc is a thermosetting material of liquid white epoxy resin, and a curing agent.) In the 'previous backing roll' The high solution produces agglomerates, but the invented web roll of the invention, even if it is separated from the thermoplastic resin and the heat hardening, the total amount of the material of the material is 1 GG parts by mass, and the content of the ring of the epoxy-based film is 2 G parts by mass. , the mass part, can also fully suppress the inorganic filler content of the connector layer (4) 'the carrier layer can be 2 〇 volume percentage (vg1%) or less based on the volume of the adhesive layer & volume. The filler can reduce the fluidity of the adhesive layer to reduce the agglomerate. In the present invention, even if the non-phase is not disposed in the adhesive layer, or even if the amount of the inorganic filler is 20% by volume or less, the agglomeration is sufficiently suppressed. Yes; = hundred inorganic:: it is not in the middle of the 1 with '; = = above the dioxane containing the second drought, preferably less than 35 mass%. In the case of using oxygen 8 201139259 aluminum as an inorganic filler, the above When the content of alumina is based on the mass of the above-mentioned agent layer, Preferably, it is 5 〇 mass% or less. According to the present invention, agglomeration can be sufficiently suppressed even if the width of the subsequent material tape is 〇5 mm to 3 〇mm'. The narrow width band is compared with the thick width band. The influence of the adhesive bleed out is relatively large, and it is easy to produce agglomerate. The above-mentioned adhesive tape is suitable for circuit connection. As described above, since the agglomeration is suppressed at a south level, it is possible to manufacture a circuit having excellent connection reliability. EFFECTS According to the present invention, the peeling of the adhesive layer from the substrate can be suppressed at an extremely high level when the adhesive tape in the wound state is pulled out. ^ To make the above and other objects, features and advantages of the present invention more DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the description of the drawings, the same elements are denoted by the same reference numerals, and the description thereof will not be repeated. In addition, for the convenience of the drawings, the size ratio of the drawings does not necessarily coincide with the illustrated ratio. The backing material roll 10 shown in Fig. 1 includes a cylindrical core 1 and a pair of side plates 2 which are disposed on opposite sides of the winding core 1 in the axial direction so as to face each other. An opposite conductive tape (subsequent material tape) 5 is wound around the outer surface F1 of the core 1 to constitute a roll weight. The isotropic conductive tape 5 is directed toward the core 1 side of the surface of the substrate 6 where the adhesive layer is not formed, and then The agent layer 8 faces outwards 201139259: 2 rolls = core 1. In the state of the roll weight, the (four) face of the substrate 6 is in direct contact with the adhesive layer 8 of the anisotropic conductive tape 5 on the inside of the roll. When the isotropic conductive tape 5 is wound around the core layer 8 = the electric tape 5 in the orientation as described above, the adhesion of the adhesive X from the substrate 6 is suppressed at an extremely high level, and only the substrate is pulled out. In addition, the side plates are preferably placed at both ends of the winding core in the axial direction, because the plurality of the backing materials are wound into the tube, but the part of the Tsukisaki penetrates the side plate from the outer side of the side plate. The side panels are set in a prominent way. As shown in Fig. 3, the side plate 2 is provided with a rib-like structural portion 2b extending radially from the edge of the φ F2 on the inner side surface F2 adjacent to the anisotropic conductive strip 5 so as to extend radially from the edge of the ridge F4. By providing the rib-like structure portion 2b, even if the adhesive agent permeates from the end face of the different-direction f-belt 5, the area of the adhesive adhered to the side plate 2 can be sufficiently reduced, so that the agglomeration can be effectively suppressed in accordance with the present invention. . Further, as shown in FIG. 1 and FIG. 2, the material roll 1〇 has a shaft hole l〇a into which a rotating shaft of a crimping device (not shown) is inserted, and the shaft hole l〇a is provided with and set. A notch portion 1bb fitted to the convex portion on the rotating shaft. Here, the configuration other than the notch portion 10b may be employed if the configuration in which the secondary reel 10 is attached to the rotating shaft of the crimping device while preventing the idling. A plastic molded article or the like can be used for the reel parts including the winding core 1 and the side plate 2. As shown in Fig. 4, the anisotropic conductive tape 5 is provided with a belt-like base material 6 and an adhesive layer 8 formed on one surface of the base material 6. The length of the anisotropic conductive strip 5 is preferably 1 m to 1 μm, more preferably 200 201139259 m to 1000 m, particularly preferably 200 m to 500 m, and even more preferably 250 m to 500 m, which is particularly good. It is 300 m to 500 m. Previously, since the agglomeration was liable to occur, the length of the anisotropic conductive tape 5 which can be wound around the core 1 was limited, but the anisotropic conductive tape 5 was wound around the core by the substrate 6 facing inward. 1 upper 'can wind the opposite conductive strip 5 longer than the previous product on the winding core 1. The width of the anisotropic conductive tape 5 is preferably from 0.5 mm to 30 mm, more preferably from 0.5 mm to 3.0 mm, even more preferably from 0.5 mm to 2.0 mm, and particularly preferably from 〇.5 mm to 1.0 mm. Previously, since the agglomeration was liable to occur, the width of the anisotropic conductive tape 5 which can be wound around the winding core 1 was limited, but the anisotropic conductive tape 5 was wound around the core by the substrate 6 facing inward. On the 1st, the anisotropic conductive tape 5 having a narrower width than the previous product can be wound around the winding core 1. Further, the width of the substrate 6 is preferably the same as the width of the adhesive layer 8 formed on the substrate 6, or wider than the width of the adhesive layer 8. The width of the subsequent agent layer 8 may be adjusted according to the intended use. The thickness of the adhesive layer 8 may be appropriately selected depending on the adhesive component to be used and the type of the material to be used, etc., preferably 5 μηι to 1 μm, more preferably 10 μm to 40 μm. Previously, since the agglomeration is liable to occur, the thickness of the adhesive layer 8 of the anisotropic conductive tape 5 which can be wound around the winding core 1 is limited, but the anisotropic conductive tape 5 is formed in such a manner that the substrate 6 faces inward. Winding on the core 1, it is also possible to wind up the anisotropic conductive tape 5 including the adhesive layer 8 which is thicker than the previous product having a thickness of, for example, about 3 μm to 1 μm. In addition, the thickness of the substrate ό is preferably about 4 μm to about 200, more preferably 2 〇μιη to 100 μπη 〇π 201139259. The substrate 6 can be, for example, polyethylene terephthalate or polynaphthalene. Polyethylene naphthalate, polyethylene isophthalate, polybutylene terephthalate, polyolefin, polyacetate, polycarbonate Polycarbonate, polyphenylene sulfide, polyamide, ethylene-vinyl acetate copolymer, polyvinyl chloride, polyvinylidene chloride, synthetic rubber Various plastic tapes such as liquid crystal polymers. However, the material constituting the substrate 6 is not limited to these materials. Further, as the substrate 6, a substrate subjected to mold release treatment such as a contact surface with the adhesive layer 8 may be used. Further, it may be a substrate obtained by mixing two or more kinds selected from the above materials, or a substrate obtained by multilayering the above film. The adhesive component 8a of the adhesive layer 8 can be widely applied to a material which exhibits curability by heat or light, and an epoxy-based adhesive or a radical-reactive type can be used. Alternatively, or a polyamine group can be used. Acetic acid (pQlyurethane) or polyethylene based S (a thermoplastic adhesive such as pGlyvinyleste®. It is considered to be a crosslinkable material because it is excellent in heat resistance and resistance after bonding. S ' contains a domain-hardening resin. Epoxy is the ring of the main component, and the second agent can be used for short-term hardening and good workability, and the molecular beding agent is better in characteristics. In addition, the radical hardening type is followed by a lower temperature of the agent. The characteristics such as excellent curability can be appropriately selected depending on the application. The oxygen-based secondary shaft is made of a thermosetting material such as an epoxy resin and a chemical agent such as the item 12 201139259. In addition, a thermoplastic resin or a coupling agent is usually blended as needed. , Filler, etc. The above-mentioned epoxy resin may, for example, be a bisphen A epoxide, a bisphen 〇 1 F epoxy resin, or a double s (8) ring. Oxygen resin, benzene _ (phen0ln0V0lac) ^• epoxy fine Θ, A riding acid (_Q1 nQVGlae) type epoxy resin, double age A secret (bisphen〇1 An〇v〇lac) type epoxy resin, gamma F _ iTr\Fnovolac) ^ Glycidyl ester epoxy resin, Glycidyl rm oxy-resin, ethyl endoenzyme (h fine 0in) type epoxy resin, t (lS; cyanurate>, a. k some epoxy resins can be _, can also be hydrogenated. In addition, == brewing base or Methyl propylene is added to the side chain of the epoxy resin. ~Epoxy resin can be used alone or in combination of two or more. If the hardener can harden the epoxy resin, it will be hardened. Agent, = ionic polymerizability __ hard tilting, hardening in polyaddition, excellent in quick-curing property, no need for chemical equivalent considerations, and L' is preferably anionic or cationically polymerizable catalyst-type hardening Listed as a cation or a cationically polymerizable catalyst-type hardener, for example, lmldazoIe, hy (hyd ::, amine salt, diazomum salt, aliphatic salt Et,) 13 201139259 amine imide, diammine maleimide, melamine and its derivatives, polyamine salts, dicyandiamide ( Such as dicyandiamide), etc., it is also possible to use modified substances of these compounds, etc. Examples of the curing agent include polyamines, polythiols, polyphenols, acid anhydrides, etc. The curing agents of these epoxy resins are polyamino phthalate esters. A polymer material such as a polyester, a metal thin film such as nickel or copper, or an inorganic material coated with an inorganic material such as a sulphuric acid or the like, which is microencapsulated, is preferred because it can be used for a long period of time. These hardeners may be used alone or in combination of two or more. The amount of the above-mentioned hardening agent is usually from about 5 parts by mass to about 20 parts by mass based on the total amount of the thermosetting material and the thermoplastic resin to be blended as needed. The radical-curable adhesive is, for example, a radical polymerizable material and a radical polymerization S-starting agent. Further, a thermoplastic resin, a coupling agent, a filler, and the like are usually formulated as needed. The radically polymerizable material can be used without limitation as long as it is, for example, a substance having a functional group polymerized by a radical. Specific examples include, for example, a lactic acid acrylate (including a corresponding methyl acetoacetate, the same applies hereinafter) a compound, a propylene sulfhydryl group (including a corresponding methyl propylene oxide oxy group or lower) compound, Cis-butadiene di-imine (de-maize W) 4 : a radically polymerizable substance such as a methyl cis-butanimide (c) (reagent (10)) resin, nadimide resin. These 201139259 radical polymerizable substances may be used in the form of a monomer or a polymer, or may be used in combination with a monomer. Examples of the above acrylate compound include methyl acrylate, ethyl acrylate, isopropyl acrylate, isobutyl acrylate, and ethylene glycol diacrylate. (ethyleneglycol diacrylate), diethyleneglycol diacrylate, trimethylolpropane triacrylate, tetramethylolmethane tetraacrylate 2-Hydroxy-1,3-diacryloxypropane, 2,2-bis[4-(acryloxymethoxy)phenyl]propane 2,2-bis[4-(acryloxymethoxy)phenyl]propane ), 2,2-bis[4-(acryloxypolyethoxy)phenyl]propane (2,2_bis[4-(acryl〇xy polyethoxy) Phenyl]propane), dicyclopentenyl acrylate, tricyclodecanyl acrylate, tris(acryloyloxyethyl)isocyanurate ), urethane urate (urert) Ianeacrylate) and so on. Further, a polymerization inhibitor such as hydroquinone or methyiettler hydroquinone may be suitably used as needed. In addition, from the viewpoint of the improvement of heat resistance, a radically polymerizable substance such as an acrylate compound preferably has at least one substituent such as a dicyclopentenyl group, a tricyclodecanyl group or a triazine ring. The radically polymerizable substance other than the acrylate compound may be, for example, a compound described in International Publication No. 2009/063827. These compounds may be used alone or in combination of two or more. The above-mentioned radical polymerization initiator can be used without particular limitation as long as it is a compound which decomposes to generate free radicals by, for example, heating or light irradiation. Specifically, for example, a peroxidic compound, an azo compound, or the like can be mentioned. Such a hardener can be appropriately selected depending on the target connection temperature, connection time, use period, and the like. More specifically, the radical polymerization initiator may be exemplified by diacyl peroxide, peroxydicarbonate, peroxyacetic acid (per0Xyest; er), peroxyketal, Dialkylperxide, hydroperoxide, siiyi peroxide, and the like. Among these radical polymerization initiators, peroxy esters, dialkyl peroxides, hydroperoxides, decyl peroxides and the like are preferred, and more preferred peroxyesters are obtained. As the radical polymerization initiator, for example, a compound described in International Publication No. 2009/063827 can be suitably used. These radical polymerization initiators may be used alone or in combination of two or more. The amount of the above-mentioned radical polymerization initiator is usually from 0.1 part by mass to about 1 part by mass based on 100 parts by mass of the total amount of the radical polymerizable material and the thermoplastic resin to be blended as needed. The thermoplastic resin to be blended as needed in the epoxy-based adhesive and the radical-curable adhesive is, for example, a resin which is easy to impart a film property to the adhesive. Examples of the thermoplastic resin include a phenoxy group (phen〇Xy). Resin, polyvinyl formal resin, polystyrene 16 201139259. (polystyrene) resin, polyvinyl butyral (p〇iyVinyi butyral) resin, polyester resin, polyamide resin, xylene resin , polyamino phthalic acid resin, polyacetic acid vinegar resin, enamel resin, terpene phenol resin and the like. As the thermoplastic resin, for example, a compound described in International Publication No. 2009/063827 can be suitably used. Among these compounds, a phenoxy resin is preferred in terms of excellent properties such as adhesion, compatibility, heat resistance, and mechanical strength. These resins may be used alone or in combination of two or more. In the case of being blended in an epoxy-based adhesive, the amount of the thermoplastic resin is usually from 5 parts by mass to about 80 parts by mass based on 1 part by mass of the total amount of the thermoplastic resin and the thermosetting material. In the case where the thermoplastic resin is blended in the radical-curable adhesive, the amount of the thermoplastic resin is usually from 5 parts by mass to 80 parts by mass based on the total mass of the thermoplastic resin and the radical polymerizable material. By winding the anisotropic conductive tape 5 around the core 1 in such a manner that the substrate 6 faces inward, an adhesive having a relatively low viscosity and which is prone to agglomeration in the prior art can be used in the adhesive layer. The subsequent layer 8 may have a shear viscosity of 3 Å < t of 100000 Pa.s or less. The viscosity is preferably 1 〇〇〇 Pa s~ 50000 Pa_s, and more preferably 1000 Pa.s~3 〇〇〇〇卩. The low-viscosity adhesive component 8a is a thermal radical-curable adhesive, and a low-temperature curing type adhesive is exemplified. Specific examples thereof include a thermal radical curing type adhesive containing a radical polymerization initiator having a 丨 minute half-life temperature of 16 or less. The i-minute half-life temperature is more preferably a machine 丨 丨 thief, and particularly preferably _ 〜 l2 〇 (>c. Such a hardener is exemplified by: T. ternary hexaoxyperoxide hexaphthalate terephthalic acid brewing 17 201139259 (1 minute half-life temperature: 142 ° C, HTP-65W manufactured by Kayaku Akzo Co., Ltd. (trade name)), substituted amber-based peroxide (1 minute half-life temperature: 13 U 〇 C, manufactured by Nippon Oil Co., Ltd., Nyper BMT (trade name)), February lauric acid peroxide ( 】 Minute half-agricultural temperature: 116.4 ° C 'Manufactured by Nippon Oil & Fat Co., Ltd., Peroyl L (trade name)), etc. Other examples of the low-grade adhesive component 8a include a thermoplastic resin and 30. a free radical polymerizable material and a thermal radical curing type binder of a radical polymerization initiator; the content of the above radical polymerizable substance in the thermal radical curing type binder is relative to thermoplastic The total amount of the fat and the radical polymerizable material is 1 part by mass, preferably 20 parts by mass to 80 parts by mass. The content is more preferably 3 parts by mass to 80 parts by mass 'more preferably 4 parts by mass to 8 parts by mass. The binder component 8a may be an epoxy binder containing a thermoplastic resin, a thermosetting material containing a liquid epoxy resin, and a curing agent. In this case, an epoxy-based adhesive is used. The content of the epoxy resin is preferably 2 parts by mass to 8 parts by mass, based on the total amount of the thermoplastic resin and the thermosetting material, and is preferably 2 parts by mass to 8 parts by mass. The mass portion is particularly preferably 30 parts by mass to 80 parts by mass. Further, when the 1C wafer is mounted on a glass substrate or a flexible printed circuit board (FPC), the difference in the coefficient of linear expansion between the wafer and the substrate is self-suppressed. In view of the warpage of the substrate to be produced, it is preferable that a component that exhibits a relaxation effect of internal stress is blended in the adhesive component. Specifically, it is preferable to blend an acrylic rubber or an elastomer component into the adhesive component. Another 18 ii201139259 ^Type^::Use as country The radical hard metal described in the publication No. 98/44067 may, for example, be a ceramic such as Au, Ag, Ni, Cu, or a solder, or may be a non-conductive glass, ceramic, or material. The core is coated with a film of the above metal or carbon on the core, or metal or thermally melted. If the conductive particles 8b are made of plastic, the conductive particles can be deformed when the connector is heated and pressurized. When the contact area of the 0-electrode electrode and the conductive particle 8b is increased, the surface of the conductive particle 8b can be added and the "two (10) edge particles of the polymer tree can be added. By adding the insulating particles, the amount of the particles is increased. Case ' When used as an anisotropic conductive tape, the short circuit caused by the particles can be suppressed, and the adjacent circuit electrodes can be improved. Further, it can be selected from insulating particles and conductive particles! Or use two types of particles in combination. The average particle size of the conductive particles and the insulating particles is preferably from 1 μΠ1 to 18, more preferably from 2.5 μm to 10 μιη, in terms of dispersibility and goodness. The blending amount of the sub- 8b is not particularly limited. When the adhesive composition is based on 2, it is preferably W% by volume to 3G, more preferably (Π /〇~10% by volume, particularly preferably 〇5% by volume). 5% by volume. If the amount of the conductive $8b is less than 〇]% by volume, there is an excellent conductivity, and if it exceeds 3.5% by volume, the domain is short-circuited by the circuit when the phase is in the intestinal conductive band. In order to reduce the fluidity of the adhesive layer 8, the inorganic filler may be adjusted to the adhesive component 8a in accordance with 201139259. The inorganic filler is not particularly limited as long as it is, for example, a solid particulate inorganic compound. Specific examples of the material include, for example, water hydroxide IS, magnesium hydroxide, carbonated water, carbonic acid town, Shixi acid office, Shixi acid town, oxidation word, oxidation town, oxidation Ming, nitrite, and occupational aluminum. The aluminum borate whisker, the boron nitride, the crystalline cerium oxide, or the amorphous dioxide dioxin, the cerium oxide, etc. may be used singly or in combination of two or more. In the present embodiment, the substrate 6 is oriented The core side (inside) manner is such that the anisotropic conductive strip 5 is pure to the core 丨±, that is, the material is dispensed in the adhesive layer 8 or even if the volume is set to 1 based on the volume of _ 8 20% by volume or less can also sufficiently suppress agglomeration. The content of the inorganic filler is more preferably from 0% by volume to 15% by volume, particularly preferably from 0% by volume to 1% by volume. Further, even if the amount of the adhesive layer 8 is f 4 t mass 5G mass can be used to suppress agglomeration. Inorganic = 3 is more preferably G mass % ~ 4G f %, especially preferably G mass % ~ 3 tannin, %. The content of the mass base is preferably a suitable layer depending on the inorganic filler to be used: the case where the material is cerium oxide, even if it is based on the mass of the adhesive agent 4 is set to % f by % or less, and may be sufficiently agglomerated. The content of the cerium oxide is preferably 〇% by mass to 3% by mass, especially two parts by weight of I2 2G. The inorganic filler is oxidized 18 In the case of 'the content of the mass of the following 8 is set to 5〇 mass%, the underarm' can also sufficiently suppress the oxygen content of the knot I. Good for G mass%~ 20 201139259 & 40% by mass, especially for 〇% by mass%~3〇% by mass. Next, it can be calculated as 'but in self-determination. For the case of Dingxu, for example, the electric furnace can be measured by the following method (The temperature of the air ring is raised to the temperature of the shoe first and then heated for 45 minutes. The dense electronic balance measuring the content of the filler, the fine ru^, τ produced by the manufacturer, and the decimal point (0.0 〇U) are measured. Bodhisattva (4)% Γ上玫去撕撕' The bribe is turned over from the adhesive tape and placed on the carrier layer about 1 g. The material ' _ amount is carried out in 23 machines, stupid, 1 atmosphere. (4) will join The crucible having the adhesive layer was heated in an electric furnace for 45 minutes in the same manner as (1). By this heating, _ becomes ash. (5) The temperature of the electric furnace was returned to the normal temperature, and the mass of the crucible and the ash taken out from the electric furnace were quickly weighed in the same manner as in the above (2) and (3) in the drier. (6) The mass of the ash obtained in (2) is subtracted from the mass of the 坩埚 and ash obtained in (5), and the mass of the ash is calculated. The ash should contain inorganic fillers and conductive particles (metal components). (7) The type and content of the conductive particles (metal components) contained in the ash are calculated by Inductively Coupled Plasma (ICP) luminescence spectrometry. At this time, the ash is decomposed by the mixed acid of argon fluoride acid and nitrate 21 201139259 acid to prepare the supply.

(Quantitative analysis of the genus and its content of ICP-AES. The gold acid and water on the mass ratio i: i: 1 mixed acid, stone ash ash minus the above-mentioned use = 6 = obtained electric particles (Gold W The quality of the inorganic filler is calculated as the mass of the inorganic filler. *»,p The dry specific gravity is 6丨 (Shimadzu Corporation, dry-type dense series) Min (4) The ash of the money is taken =, == The specific gravity of the agent layer, the theoretical specific gravity of the metal detected by the 1 cp luminescence spectrometry and the volume percentage of the ash-containing filler relative to the original adhesive layer. The calculation machine may firstly The coating liquid containing the adhesive component is applied to a substrate film (the above various materials can be used as a substrate, for example, polyethylene terephthalate), and the entire material β of the opposite conductive material is produced. The entire material is cut into a strip shape so as to be suitable for the width of the application. For the cutting, for example, a dividing device described in Japanese Laid-Open Patent Publication No. 2003-285293 can be used, by using an anisotropic conductive tape 5 having a predetermined width. Roll taken from the roll part In this embodiment, the counter conductive tape 5 is wound around the winding core 1 so that the base material 6 faces the winding core 1 side and the adhesive layer 8 faces outward. In the invention, in order to wind the anisotropic conductive tape on the core of the reel part, it is preferable to fix the initial portion (the portion where the winding starts) 22 201139259 of the anisotropic conductive tape to the core. A well-known method can be used, for example, by an adhesive tape or an adhesive. Alternatively, a clip or a notch can be provided on the roll to fix it. Among them, it is preferable to use adhesiveness from the viewpoint of workability. In addition, the adhesive layer 8' is exposed on the outer periphery of the weight body of the anisotropic conductive tape 5 so that the portion is not contaminated by dust or the like, and the following measures are required as needed. For example, The adhesive layer 8 on the substrate 6 is previously removed from the last portion of the anisotropic conductive tape 5 (the end of the winding), and a blank portion is provided, which is wound around the weight body, thereby preventing the adhesive layer 8 is exposed. Alternatively, it can be substituted for the substrate 6 A blank portion is provided to prepare another tape (which may not be associated with the substrate), and is attached to the end of the substrate 6 to be wound around the + heavy body. In addition to the above, the laminate can also be rolled 1 〇 〇 〇 保存 保存 ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( The circuit connector 1A of FIG. 5 includes a first circuit member 3A and a first circuit member 40 opposed to each other, and is disposed between the first circuit member 3A and the second circuit member 4A. The connection portion 5A is connected to the members. The first circuit member 30 includes a circuit board 31 and circuit electrodes 32 formed on the main surface 31a of the circuit board 31. The second circuit member 40 includes a circuit board 41 and a circuit electrode 42 formed on the main surface 41a of the circuit board 41. Specific examples of the circuit member include a semiconductor wafer (IC wafer), a wafer component such as a resistor 23, a semiconductor chip, and an electric grid wafer. These circuit members are provided with circuit electrodes', and usually have a plurality of (at least two or more) circuit electrodes. Specific examples of the other electric component to which the above-mentioned circuit member is connected include a metal-containing flexible tape, a switchable printed wiring board, and a glass in which indium tin oxide (IT0) is deposited. A wiring board such as a substrate. By using the anisotropic conductive tape 5 drawn from the backing roll 1 , the circuit members can be connected to each other efficiently and with high connection reliability. Therefore, the anisotropic conductive tape 5 of the present embodiment is suitable for c〇G mounting or COF mounting (Chip0nFlex) of a wafer component including a plurality of fine connection terminals (circuit electrodes) on a wiring substrate. The surface of each of the circuit electrodes 32 and 42 may be composed of a metal selected from the group consisting of gold, silver, tin, antimony, bismuth, palladium, iridium, iridium, platinum, and indium tin oxide (IT〇), or may be composed of two or more kinds. Further, the material of the surface of the circuit electrodes 32, 42 may be the same or different in all of the circuit electrodes. The connecting portion 50a includes a cured product 8A such as an adhesive component contained in the adhesive layer 8, and conductive particle ribs dispersed therein. Further, the circuit electrode 32 opposed to the circuit connector 100 and the circuit electrode 42 are electrically connected via the conductive particles 8b. That is, the conductive particles % are in direct contact with both of the circuit electrodes 32, 42. Therefore, the connection resistance of the circuit electrodes 32, 42A is sufficiently lowered, and a good electrical connection between the circuit electrodes 32, 42 is possible. On the other hand, the cured product 8A is electrically insulating, and the insulation of the adjacent circuit electrodes is ensured. Therefore, the flow of the current between the circuit electrodes 32 and 42 can be made smooth, and the function of the circuit can be sufficiently exhibited. 24 201139259 . . 'a (Method of Manufacturing Circuit Connector) A step diagram of an embodiment of the method. In the present embodiment, the final manufacturing circuit connecting tape reel (8) is used as the splicing agent, and the counter conductive tape 5 is pulled up from the upper mounting foil. The type is loaded from the bonding material U). The circuit member 30# main surface is electrically conductive; "5 is cut to a predetermined length and then to H (Fig. 6U) of Fig. 2). The subsequent agent layer 8 is temporarily fixed to the first circuit structure, and the front 3 = f is pressurized. The pressure at this time is not electrically connected (Fig. 6 (1)). Special restrictions, usually less than &A D 知 知 的 的 , , , , , , , 知 知 。 。 。 。 。 。 。 。 。 。 。 。 After the heating temperature agent layer 8 is substantially not hardly peeled off the substrate 6, as shown in Fig. 6 (c) 42 toward the side of the first circuit member 3), the arrow A and the arrow B of the second circuit electrode (C) The degree of heating is such that the heating temperature of the adhesive layer 8 is f:f°, and the heating temperature becomes slow. If the curing rate is higher than 8 C, the undesired secondary reaction is likely to occur. Propensity. The heating time is preferably 〇 sec to 180 sec, more preferably 〇 5 sec to 180 sec, and particularly preferably 1 sec to 180 sec. The connecting portion 5a is formed by hardening of the adhesive component 8a, and the circuit body 1GG shown in Fig. 5 is obtained. The conditions for the connection are appropriately selected depending on the use, the adhesive composition, and the circuit member to be used. Further, in the case where the (four) which is hardened by light is used as the adhesive component of the lining agent 8, the active light ray or the energy ray may be appropriately applied to the adhesive layer 8. Examples of the active light include ultraviolet light, visible light, infrared light, and the like. Examples of the energy line include an electron beam, X-rays, γ-rays, microwaves, and the like. According to the embodiment, the anisotropic conductive tape 5 is wound on the core rim by the substrate 6 toward the core side (inner side), and the anisotropic conductive tape wound on the reel part can be used. When the film is pulled out, the layer 8 is peeled off from the substrate 6 with an extremely high level. The preferred embodiments of the present invention have been described above, but the present invention is not limited to the above-described embodiments. The present invention can be variously modified without departing from the spirit and scope of the invention. For example, in the above embodiment, the anisotropic conductive tape 5 has been exemplified as a connection (four) adhesive tape, but a non-conductive tape including a bonding agent and a conductive particle rib may be wound around Core! Up, the 乍 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 Further, it can be suitably used for an adhesive film for various electronic materials such as an adhesive film, a silver film, or a semiconductor wafer. Further, in the above-described embodiment, the case where the side plate 2 having the rib-like structure portion 2b is used has been exemplified, but the 2b-plate (see Fig. 7) of the rib-like structure portion may be replaced by the side plate 2 instead of the side plate 2. Such a non-producible side panel can sufficiently suppress agglomeration by the present invention because it is more versatile than the side panel having the rib-like structure portion described above. In the above embodiment, it has been exemplified that the following 8 includes one; It is also possible to provide a plurality of layers on the substrate 6. For example, FIG. 8(a) #u s A material tape 15A has an adhesive layer 18 having a multilayer structure. The subsequent composition is composed of a non-containing layer 18& and a conductive layer-containing layer 18b. Further, the conductive particles are not used, and the subsequent components of the conductive particle-containing layer 18b can be the same as those of the adhesive layer of the read layer 8. When the above-described two-layered adhesive layer 18 is used as a circuit connecting material, the number of conductive particles on the circuit electrodes caused by the flow of the _knife between the circuit members is reduced. For example, when the 1C wafer is connected to the earth plate by C0G mounting or c〇F cracking, the number of conductive particles on the metal bump of the 1C wafer can be sufficiently ensured. In this case, it is preferable that the adhesive layer 18 is disposed such that the metal-containing conductive particle-containing layer 18a of the IC wafer and the substrate on which the 1C wafer can be mounted are in contact with the electrode-containing layer 18b. / From the viewpoint of more reliably preventing the peeling of the adhesive layer 8, the adhesive tape 15B shown in Fig. 8 (b) has an adhesive layer 9a between the substrate 6 and the adhesive layer 8. From the viewpoint of improved adhesion of the circuit member, the adhesive tape 15C shown in Fig. 8(c) has an adhesive layer 9b laminated on the adhesive layer 8. [Examples] 27 201139259 Hereinafter, the present invention is not limited to the examples by way of examples. (Example 1) Although the preparation of the raw material of the adhesive component is prepared in detail, the following raw materials are prepared in order to produce the adhesive component. Guyang has a thermoplastic phenoxy resin (uni〇n (five) this share division' Shangyukou name. pKHc, the mass average molecular weight dissolved in A, (Bu (10)) and acetic acid B (boiling point 771. 〇 = 1) A phenoxy resin solution having a solid content of 40% by mass is prepared in a mixed solvent of 1 (mass ratio). Prepared in a 30 C liquid urethane urethane (manufactured by Shin-Nakamura Chemical Co., Ltd.) , trade name: UA_512, mass average molecular weight · 2800), and 3 〇. (: liquid dimethyl acrylate vinegar (manufactured by Shin-Nakamura Chemical Co., Ltd., trade name: Dcp, mass average molecular weight: 332) , as a radically polymerizable substance. Prepared as a free radical to produce a ruthenium-based peroxide (manufactured by Nippon Oil & Fat Co., Ltd., trade name: Peroyl L, 1 minute half-life temperature: 1164 ΐ, mass average molecular weight: 399) Hardener (free radical generator) [Production of Substrate Film] Using the raw material prepared as described above, a film of a film was produced as follows. Relative to 40 parts by mass of benzene. The base resin solution was prepared by dissolving 4 parts by mass of liquid acrylamide phthalate, 20 parts by mass of liquid dimercaptopropionate, and 4 parts by mass of a radical generator to obtain a mixed solution. 28 201139259 Mixing average particles _ search for 5μηι recording powder (conductive particles), and an average particle size of 0.5 μηι #二氧化石夕粉 (inorganic filler), obtained by dispersing nickel powder and oxidized hair powder in the mixture The coating liquid was applied to a pET film (carrier film) having a thickness of 80 μm and a width of 5 mm and both sides of which were subjected to polyoxo oxygen release treatment using a coating apparatus at a length of 32 μm. Drying was performed at a speed of 3 m/min using a drying furnace having a furnace length of 15 m and a hot air temperature thief. Thereby, a backing film having an adhesive layer (thickness: 4 〇 μηη) provided on one surface of the ρΕτ film was obtained ( The total thickness of the adhesive layer after drying is 15% by volume, and the content of nickel powder of the dried adhesive layer is 15% by volume, and the content of cerium oxide powder is 15% by volume (26% by mass). [Measurement of Shear Viscosity] By using the above-mentioned adhesive film Adhesive layer (thickness: 4 〇 laminate 15 pieces to make thickness about 〇 A .6 mm adhesive layer was used as a sample to cut a material having a size of i cmxl cm, and the shear viscosity of the adhesive layer was measured. The shear viscoelasticity measuring device (manufactured by TA Instmments, trade name: ARES) was used for the measurement. As a result, the shear viscosity of the adhesive layer at 3 ° C was 20000 IVs. Further, the measurement conditions were as follows. Measurement frequency: 1 〇 Hz; Ambient gas: under nitrogen; Temperature range: 〇 ° C ~150 °c; heating rate: l〇 °C / min; probe diameter: 8 mm; sample size: 10 mm x lO mm; 29 201139259 sample thickness: about 0.6 mm; measured strain: 1.0%. [Preparation of the material roll] The above-mentioned film film was cut to a width of 1.5 mm by a roll to roll dividing device, and the backing tape was taken up to the roll part at a length of 300 m (outside the core) Diameter: 66 mm, molded on plastic). At this time, the substrate including PET was wound toward the core side (inner side), and the adhesive layer was taken up toward the outside. A roll side plate (thickness 2 mm) is disposed on both sides of the core, and the gap between the roll side plate and the roll weight of the backing tape is in the range of about 0.1 mm to 0.5 mm. Further, in the present example, the reel member having the reel side plate provided with the radially extending rib-like structural portion 2b shown in Fig. 1 is used, but has an extension extending radially as shown in Fig. 7 The reel part of the reel side plate of the rib structure portion also obtains the effects of the present invention. [Evaluation of the presence or absence of peeling of the adhesive layer] The above-mentioned binder roll was 35. After standing in a state in which the crucible was left standing vertically for 24 hours, the side_state was observed by a microscope. As a result, it is confirmed that the lion that has been infiltrated by the weight of the weight is attached to the side plate of the reel. Then, the full-length test was carried out at a rate of m per second, and the adhesive layer was peeled off from the substrate. (Example 2) [Preparation of raw materials for the adhesive component] Next to the ingredients, the following raw materials were prepared. 30 201139259 Limited: to have a hot product:: Stupid oxy-resin (Uni°nc Na ice merchant 〇〇 name ^c, mass average molecular weight: 4500 〇), two two < A stupid (Bud point 11 〇.6 £ >C) In the mixed solvent of ethyl acetate (boiling point 77.rC) 1 · 1 (supervised ^ μμ, human 'main), the solid component *''' Base resin solution. Yang Ba ^t 3G °C is a liquid epoxy resin (Japanese epoxy resin shares have two trade names: pore_epoxy equivalent: 180~19〇), and ^ core epoxy resin (曰本环Ϊ 氧 : : : : : : : : : : : : : : : : : : : : : 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 A hardener for oxyresin. [Preparation of the material] The raw material prepared as described above was used, and a film of the film was produced as follows. In an amount of 35 parts by mass of the phenoxy resin solution, 6 parts by mass of the liquid epoxy resin YL-980 and 5 parts by mass of the epoxy resin 1032H60, and 4 parts by mass of the hardener SI-60 to obtain a mixture/liquid. The mixture was prepared with a nickel powder having an average particle diameter of 5 μm and a carbon dioxide having an average particle diameter of G.5, which was dispersed in the mixed solution. Coating solution of nickel powder and cerium oxide powder. The coating liquid was applied to a ρ Ετ film having a thickness of 80 μm and a width of 500 mm and both sides of which were subjected to polyfluorination treatment by a coating apparatus using a coating apparatus. Drying was carried out at a speed of 3 m/mm using a furnace of furnace I 15 m and a hot air temperature of 7 ° C. Thereby, a laminate film of a thickness of 40 μπΟ (a thickness of 40 μπΟ) was provided on one side of the PET film. The total length of the adhesive layer after drying was 1.5% by volume, and the content of the pulverized powder was 15% by volume (26% by mass). [Measurement of Shear Viscosity] The same manner as in Example 1 was carried out. The shear viscosity of the above-mentioned adhesive film 'results in the adhesive layer at 30. (: The shear viscosity is loooo pa. s [Production of Substrate Reel] The above-mentioned adhesive film was cut in the same manner as in Example 1, and the substrate of the attached tape was oriented toward the core side (inside), and the adhesive layer was oriented outward. In the manner, the above tape is taken up on a reel part (plastic molded article), whereby a web of a web having a width of 1.5 mm and a length of 300 m is obtained. The reel side plate and the backing material are The gap distance between the weight bodies is in the range of about mm1 mm to 〇5 mm, respectively. [Evaluation of the presence or absence of peeling of the adhesive layer] The above-mentioned succeeding material roll is vertically static in a 35 ° C thermostatic chamber. After the state of being placed for 24 hours, the state of the side surface was observed with a microscope. As a result, it was confirmed that the adhesion surface from which the self-rolling body was oozing out was followed by the side plate of the roll. Then, the roll of the material was wound per second. The speed of 丨m was subjected to a full-length 3 (8) extraction test. The result was followed by a failure in the peeling of the substrate. (Example 3) First, a film roll was produced in the same manner as in the example. Easy to ooze out from the side of the heavy body, so A hammer of 5 G g was placed at the subsequent end to apply a winding tension to the entire weight body to 32. 39259, and placed in a state of standing still in the constant temperature bath for 24 hours in the same manner as in Example 1. Thereafter, the microscope was used. The state of the side surface was observed, and it was confirmed that the adhesive oozing from the side surface of the weighted body adhered to the side plate of the roll. Then, the film roll was subjected to a full-length 3 (8) (five) extraction test at a rate of 1 „! per second. The defect of peeling off the layer from the substrate was also not produced. (Example 4) A laminate roll produced in the same manner as in Example 2 was used instead of the film roll produced in the same manner as in Example 1. In the same manner as in Example 3, in the same manner as in Example 3, a weight (4) of the hammer (4) of the backing material was placed in the temperature-sensing tank. Thereafter, the state of (4) was observed under a microscope, and it was confirmed that the subsequent age from the weight-surface bleed was followed by the side plate of the roll, followed by 'the bottom of the roll was carried out at a speed of 1 〇 1 per second. The extraction test, the result of the (four) 丨 layer from the substrate _ bad i times did not occur. (Example 5) Except for the film roll produced in the same manner as in Example 1, the temperature of the strange temperature tank was set to be a thief instead of being set to be hungry, and the same thing as in Example 1 was placed in a pure temperature bath. Money, the state of the side surface was observed by a microscope, and it was confirmed that the adhesive oozing out from the side of the weight body adhered to the side plate of the roll. Next, the slab of the slab was fed at a speed of i m per second for a full-length 3 GGm extraction test, and as a result, the defect of the adhesive layer peeled off from the substrate was not produced once. (Comparative Example 1) A laminate roll was produced in the same manner as in Example i except that the substrate tape was taken up on the core with the substrate facing outward and the adhesive layer was directed toward the roll side (inside) 33 201139259. The tube was placed in a constant temperature in a 35 ° C thermostatic chamber for 24 hours. Thereafter, the state of the side surface was observed by a microscope, and as a result, it was confirmed that the adhesive oozing out from the side surface of the weighted body adhered to the reel. Then, the backing roll was subjected to a pull-out test of a total length of 3 μm at a speed of 1 m per second, and as a result, the adhesive layer was peeled off from the substrate 15 times. (Comparative Example 2) A film roll was produced in the same manner as in Example 2, except that the substrate tape was wound on the core side so that the substrate layer was directed outward (the inner layer). It was left to stand vertically in a constant temperature bath at 35 ° C for 24 hours. Thereafter, the state of the side surface was observed with a microscope, and as a result, it was confirmed that the adhesive oozing from the side surface of the weighted body adhered to the side plate of the roll. Next, this continuous material roll was subjected to a full-length 3 〇〇 melon = extraction test at a rate of 丨m per second, and as a result, the defect of peeling off the adhesive layer from the substrate occurred 17 times. Although this (4) has been read well, the above is not the same as the invention. Anyone who is familiar with the art can make some changes and refinements without departing from the invention. Therefore, the vehicle of the present invention The application is __ defined as the standard. [Simple diagram of the diagram] Figure. Fig. 1 is a perspective view showing an embodiment of the present invention. Fig. 2 is a cross-sectional view showing the internal structure 34 201139259 _____ Γιτ of the bonding material (4) shown in Fig. i. Fig. 3 is a plan view showing the inner side of the side plate of the binder roll of the present invention. Fig. 4 is a cross-sectional view showing an example of an anisotropic conductive tape. Fig. 5 is a cross-sectional view showing an example of a circuit connection in which circuit electrodes are connected to each other. 6(a) to 6(c) are cross-sectional views schematically showing an example of a method of manufacturing a circuit-connected body. 'Picture Figure 8(a) to Fig. 8(c) are cross-sectional views schematically showing other examples of the anisotropic conductive tape. Fig. 9 is a cross-sectional view showing an example of agglomeration generated when the backing member is pulled out from the previous web roll. [Description of Main Element Symbols] 7 is a vertical one showing another embodiment of the binder roll of the present invention: core 2 = side plate 2a: through hole 2b: rib structure portion 5: anisotropic conductive tape (subsequent material tape) 6 ' 26 : substrate 8 ' 18, 28 : adhesive layer 8A · cured product 8a : adhesive composition 35 201139259. 8b : conductive particles 9a, 9b : adhesive layer 10 : secondary material roll 10a : shaft hole 10b : Notch portions 15A, 15B, 15C, 25: Substrate tape 18a: Conductive particle non-containing layer 18b: Conductive particle containing layer 30: First circuit member 31, 41: Circuit substrate 31a, 41a: Main surface 32, 42: Circuit electrode 40: second circuit member 50a: connection portion 100: circuit connection body A, B. front head F1: outer surface F2: inner side surface 36

Claims (1)

201139259 VII. Patent application scope: 1. A continuous material reel comprising: a core; a pair of side plates ' disposed on opposite sides of the winding core in a mutually opposing manner; and a strip of material having a strip shape a substrate and an adhesive layer disposed on one surface of the substrate and wound around the winding core; and the adhesive tape is oriented toward the core side of a surface of the substrate on which the adhesive layer is not formed The method is wound on the above-mentioned winding core. 2. The binder roll according to claim 1, wherein the length of the above-mentioned backing tape is 2 〇〇 m or more. 3. The binder roll of the above-mentioned adhesive layer according to claim 1 or 2, wherein the above-mentioned adhesive layer has a shear viscosity at 30 ° C of 100000 Pa.s or less. 4. The material roll according to any one of claims 1 to 3, wherein the adhesive layer contains a thermal radical hardening type adhesive. 5. The web roll of claim 4, wherein the thermal radical hardening type adhesive has a one minute half-life temperature of 16 Torr. 〇 The following free radical polymerization initiators. 6. The binder roll according to item 4 or 5, wherein the thermal radical-curable adhesive contains a thermoplastic resin and a radical containing a radical polymerizable substance in a liquid state of 30 C. a polymerizable material and a radical polymerization initiator; and the radical polymerizable substance in the thermal radical-curable adhesive agent in an amount of 100 parts by mass of the total amount of 2011 201129259 of the thermoplastic resin and the radical polymerizable material; The content is 20 parts by mass to 80 parts by mass. The adhesive roll according to any one of claims 1 to 3, wherein the adhesive layer contains an epoxy-based adhesive, and the epoxy-based adhesive contains a thermoplastic resin and is contained in 3 〇 It is a thermosetting material of a liquid epoxy resin and a curing agent; and the epoxy resin is the above-mentioned epoxy with respect to the total amount of the thermoplastic resin and the thermosetting material in an amount of 1 part by mass. The content of the resin is 20 parts by mass to 8 parts by mass. 8. If the scope of the patent is in the first place? In any of the coffin reels, wherein the content of the inorganic filler in the smear layer is 2 vol% or less based on the volume of the above-mentioned adhesive layer. 9. If applying for a full-time sub-item to 帛; the material roll' is based on the mass of the above-mentioned adhesive layer 4 = the inorganic filler content of the agent layer is 5 〇 mass. the following. 10. In the case of the above-mentioned ninth slag, the inorganic filler in the above-mentioned _ is dioxobic, and the mass of the splicer layer is on time 9% or less of the above inorganic filler. 11. The binder roll according to claim 9, wherein the inorganic filler formulated in the above-mentioned _ is oxygen, and the content of the layer is 5Q at the time of the quality of the layer. U. 38 201139259 Subsequent roll according to any one of the claims of the present invention, wherein the width of the above-mentioned adhesive tape is 0.5 mm to 3.0 mm 〇 13. As claimed in the first item The web roll of any one of item 12, wherein the above-mentioned adhesive tape is for electrical connection. 39