JP6870618B2 - 回路接続用接着剤組成物及び構造体 - Google Patents
回路接続用接着剤組成物及び構造体 Download PDFInfo
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- JP6870618B2 JP6870618B2 JP2017552682A JP2017552682A JP6870618B2 JP 6870618 B2 JP6870618 B2 JP 6870618B2 JP 2017552682 A JP2017552682 A JP 2017552682A JP 2017552682 A JP2017552682 A JP 2017552682A JP 6870618 B2 JP6870618 B2 JP 6870618B2
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- 239000004640 Melamine resin Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
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- 239000004902 Softening Agent Substances 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
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- 150000001339 alkali metal compounds Chemical class 0.000 description 1
- 150000008044 alkali metal hydroxides Chemical class 0.000 description 1
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- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 150000001450 anions Chemical class 0.000 description 1
- 230000003712 anti-aging effect Effects 0.000 description 1
- 229910000410 antimony oxide Inorganic materials 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- KGQLBLGDIQNGSB-UHFFFAOYSA-N benzene-1,4-diol;methoxymethane Chemical compound COC.OC1=CC=C(O)C=C1 KGQLBLGDIQNGSB-UHFFFAOYSA-N 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
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- IMHDGJOMLMDPJN-UHFFFAOYSA-N dihydroxybiphenyl Natural products OC1=CC=CC=C1C1=CC=CC=C1O IMHDGJOMLMDPJN-UHFFFAOYSA-N 0.000 description 1
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- 150000005309 metal halides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- ZQMHJBXHRFJKOT-UHFFFAOYSA-N methyl 2-[(1-methoxy-2-methyl-1-oxopropan-2-yl)diazenyl]-2-methylpropanoate Chemical compound COC(=O)C(C)(C)N=NC(C)(C)C(=O)OC ZQMHJBXHRFJKOT-UHFFFAOYSA-N 0.000 description 1
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- MQWFLKHKWJMCEN-UHFFFAOYSA-N n'-[3-[dimethoxy(methyl)silyl]propyl]ethane-1,2-diamine Chemical compound CO[Si](C)(OC)CCCNCCN MQWFLKHKWJMCEN-UHFFFAOYSA-N 0.000 description 1
- KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical compound CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 description 1
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- 150000002903 organophosphorus compounds Chemical class 0.000 description 1
- MPQXHAGKBWFSNV-UHFFFAOYSA-N oxidophosphanium Chemical class [PH3]=O MPQXHAGKBWFSNV-UHFFFAOYSA-N 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- VTRUBDSFZJNXHI-UHFFFAOYSA-N oxoantimony Chemical compound [Sb]=O VTRUBDSFZJNXHI-UHFFFAOYSA-N 0.000 description 1
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- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- PNXMTCDJUBJHQJ-UHFFFAOYSA-N propyl prop-2-enoate Chemical compound CCCOC(=O)C=C PNXMTCDJUBJHQJ-UHFFFAOYSA-N 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- DCVWZWOEQMSMLR-UHFFFAOYSA-N silylperoxysilane Chemical compound [SiH3]OO[SiH3] DCVWZWOEQMSMLR-UHFFFAOYSA-N 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
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- 125000001424 substituent group Chemical group 0.000 description 1
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- OPQYOFWUFGEMRZ-UHFFFAOYSA-N tert-butyl 2,2-dimethylpropaneperoxoate Chemical compound CC(C)(C)OOC(=O)C(C)(C)C OPQYOFWUFGEMRZ-UHFFFAOYSA-N 0.000 description 1
- SWAXTRYEYUTSAP-UHFFFAOYSA-N tert-butyl ethaneperoxoate Chemical compound CC(=O)OOC(C)(C)C SWAXTRYEYUTSAP-UHFFFAOYSA-N 0.000 description 1
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- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
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- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
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- 229920002554 vinyl polymer Polymers 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
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Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Inorganic Chemistry (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Physics & Mathematics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Conductive Materials (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Combinations Of Printed Boards (AREA)
Description
本実施形態の接着剤組成物は、(A)ラジカル重合性化合物(ラジカル重合性物質、ラジカル反応性成分)と、(B)ラジカル発生剤と、(C)金属水酸化物及び金属酸化物からなる群より選ばれる少なくとも一種の金属化合物を含む粒子と、を含有する回路接続用接着剤組成物である。以下、各成分について説明する。
ラジカル重合性化合物は、ラジカル重合可能な官能基を有する化合物である。このようなラジカル重合性化合物としては、(メタ)アクリレート化合物、マレイミド化合物、シトラコンイミド化合物、ナジイミド化合物等が挙げられる。「(メタ)アクリレート化合物」とは、(メタ)アクリロイル基を有する化合物を意味する。ラジカル重合性化合物は、モノマー又はオリゴマーの状態で用いてもよく、モノマーとオリゴマーとを併用することもできる。ラジカル重合性化合物は、1種単独で用いてもよく、2種以上を組み合わせて用いてもよい。
ラジカル発生剤は、熱、光(UV等)、超音波、電磁波などにより分解して遊離ラジカルを発生する硬化剤(ラジカル重合開始剤等)である。
本実施形態の接着剤組成物は、金属水酸化物及び金属酸化物からなる群より選ばれる少なくとも一種の金属化合物を含む粒子(以下、場合により「(C)成分」という)を含有する。(C)成分は、金属水酸化物を含んでいてもよく、金属酸化物を含んでいてもよい。前記金属化合物は、金属水酸化物又は金属酸化物を構成する金属元素として、アルミニウム、マグネシウム、ジルコニウム、ビスマス、カルシウム、錫、マンガン、アンチモン、ケイ素及びチタンからなる群より選ばれる少なくとも一種を含む。
本実施形態の接着剤組成物は、シランカップリング剤を含有してもよい。シランカップリング剤を用いることにより、接着剤組成物の密着力(ガラスに対する密着力等)を上昇させることができる。シランカップリング剤としては、例えば、ビニルトリメトキシシラン、ビニルトリエトキシシラン、3−グリシドキシプロピルトリメトキシシラン、3−グリシドキシプロピルメチルジエトキシシラン、3−(メタ)アクリロキシプロピルメチルジメトキシシラン、3−(メタ)アクリロキシプロピルトリメトキシシラン、3−(メタ)アクリロキシプロピルメチルジエトキシシラン、3−(メタ)アクリロキシプロピルトリエトキシシラン、N−2−(アミノエチル)−3−アミノプロピルメチルジメトキシシラン、N−フェニル−3−アミノプロピルトリメトキシシラン、3−ウレイドプロピルトリエトキシシラン、3−メルカプトプロピルトリメトキシシラン、3−イソシアネートプロピルトリエトキシシラン、及び、これらの縮合物が挙げられる。
本実施形態の接着剤組成物は、必要に応じて、フィルム形成材を含有してもよい。フィルム形成材は、液状の接着剤組成物をフィルム状に固形化した場合に、通常の状態(常温常圧)でのフィルムの取扱い性を向上させ、裂け難い、割れ難い、べたつき難い等の特性をフィルムに付与することができる。フィルム形成材としては、フェノキシ樹脂、ポリビニルホルマール、ポリスチレン、ポリビニルブチラール、ポリエステル、ポリアミド、キシレン樹脂、ポリウレタン等が挙げられる。これらの中でも、接着性、相溶性、耐熱性及び機械的強度に優れる観点から、フェノキシ樹脂が好ましい。フィルム形成材は、1種単独で用いてもよく、2種以上を組み合わせて用いてもよい。
本実施形態の接着剤組成物は、導電粒子を更に含有していてもよい。導電粒子の構成材料としては、金(Au)、銀(Ag)、ニッケル(Ni)、銅(Cu)、はんだ等の金属、カーボンなどが挙げられる。また、非導電性の樹脂、ガラス、セラミック、プラスチック等を核とし、この核に前記金属(金属粒子等)又はカーボンを被覆した被覆導電粒子でもよい。被覆導電粒子(例えば、プラスチックを核とする導電粒子)又は熱溶融金属粒子は、加熱加圧により変形性を有するため、接続時に回路電極の高さばらつきを解消し、接続時に電極との接触面積が増加することから信頼性が向上するため好ましい。
本実施形態の接着剤組成物は、必要に応じて、ハイドロキノン、メチルエーテルハイドロキノン類等の重合禁止剤を適宜含有してもよい。
本実施形態の構造体(回路接続体)は、本実施形態の接着剤組成物又はその硬化物を備える。本実施形態の構造体は、例えば、回路接続構造体等の半導体装置である。本実施形態の構造体の一態様として、回路接続構造体は、第一の回路電極を有する第一の回路部材と、第二の回路電極を有する第二の回路部材と、第一の回路部材及び第二の回路部材の間に配置された回路接続部材と、を備える。第一の回路部材は、例えば、第一の基板と、当該第一の基板上に配置された第一の回路電極と、を有する。第二の回路部材は、例えば、第二の基板と、当該第二の基板上に配置された第二の回路電極と、を有する。第一の回路電極及び第二の回路電極は、相対向すると共に電気的に接続されている。回路接続部材は、本実施形態の接着剤組成物又はその硬化物を含んでいる。本実施形態の構造体は、本実施形態の接着剤組成物又はその硬化物を備えていればよく、前記回路接続構造体の回路部材に代えて、回路電極を有していない部材(基板等)を用いてもよい。
(実施例1)
フェノキシ樹脂(商品名:PKHC、ユニオンカーバイド株式会社製、重量平均分子量45000)50gを、トルエン/酢酸エチル(質量比:50/50)の混合溶剤に溶解して、固形分40質量%のフェノキシ樹脂溶液を用意した。ラジカル重合性化合物として、イソシアヌル酸EO変性ジアクリレート(商品名:M−215、東亜合成株式会社製)、2−メタクリロイルオキシエチルアシッドフォスフェート(リン酸エステル、商品名:ライトエステルP−2M、共栄社化学株式会社製)、及び、ウレタンアクリレート(商品名:U−2PPA、新中村化学株式会社製)を用いた。シランカップリング剤として、3−メタクリロキシプロピルトリメトキシシラン(商品名:KBM503、信越化学工業株式会社製)を用意した。ラジカル発生剤として、ベンゾイルパーオキサイド(商品名:ナイパーBMT−K40、日油株式会社製、1分間半減期温度:131.1℃、10分間半減期温度:73℃)を用意した。(C)成分として、平均一次粒径1μmの水酸化アルミニウム(Al(OH)3)粒子を用意した。
(C)成分を平均一次粒径1μmの水酸化マグネシウム(Mg(OH)3)粒子に変更したこと以外は、実施例1と同様にして、フィルム状の回路接続材料を作製した。
(C)成分を平均一次粒径1μmの酸化マグネシウム(Mg2O3)粒子に変更したこと以外は、実施例1と同様にして、フィルム状の回路接続材料を作製した。
(C)成分を平均一次粒径1μmの酸化ジルコニウム(ZrO2)粒子に変更したこと以外は、実施例1と同様にして、フィルム状の回路接続材料を作製した。
(C)成分を用いないこと以外は、実施例1と同様にして、フィルム状の回路接続材料を作製した。
上記製法によって得たフィルム状の回路接続材料を介して、ライン幅75μm、ピッチ150μm、厚み18μmの銅回路を500本有するフレキシブル回路板(FPC)と、厚み0.5μmの窒化シリコン(SiNx)の薄層を形成したガラス板(厚み0.7mm)とを、熱圧着装置(加熱方式:コンスタントヒート型、東レエンジニアリング株式会社製)を用いて170℃、3MPaで20秒間の加熱加圧を行って幅2mmにわたり接続し、回路接続構造体を作製した。塩水噴霧試験機(スガ試験機株式会社製)を用いて、JIS Z 2371に準じて塩水噴霧試験を回路接続構造体に対して24時間行った。試験前後の接続部の外観を観察し、剥離の有無を評価した。剥離が観察されない場合を「A」と評価し、剥離が観察される場合を「B」と評価した。評価結果を表1に示す。
Claims (7)
- (A)ラジカル重合性化合物と、(B)ラジカル発生剤と、(C)金属水酸化物及び金属酸化物からなる群より選ばれる少なくとも一種の金属化合物を含む粒子と、シランカップリング剤と、を含有し、
前記金属化合物が、アルミニウム、マグネシウム、ジルコニウム、ビスマス、カルシウム、錫、マンガン、アンチモン、及びチタンからなる群より選ばれる少なくとも一種を含み、
前記シランカップリング剤の含有量が当該回路接続用接着剤組成物の接着剤成分の全質量を基準として0.1〜10質量%である、回路接続用接着剤組成物。 - 前記(C)成分が前記金属水酸化物を含む、請求項1に記載の回路接続用接着剤組成物。
- 前記(C)成分の平均一次粒径が10μm以下である、請求項1又は2に記載の回路接続用接着剤組成物。
- 前記(C)成分の含有量が前記(A)成分100質量部に対して0.1〜10質量部である、請求項1〜3のいずれか一項に記載の回路接続用接着剤組成物。
- 導電粒子を更に含有する、請求項1〜4のいずれか一項に記載の回路接続用接着剤組成物。
- 請求項1〜5のいずれか一項に記載の回路接続用接着剤組成物又はその硬化物を備える、構造体。
- 第一の回路電極を有する第一の回路部材と、
第二の回路電極を有する第二の回路部材と、
前記第一の回路部材及び前記第二の回路部材の間に配置された回路接続部材と、を備え、
前記第一の回路電極及び前記第二の回路電極が電気的に接続されており、
前記回路接続部材が、請求項1〜5のいずれか一項に記載の回路接続用接着剤組成物又はその硬化物を含む、構造体。
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