TW201728721A - 電路連接用接著劑組成物及結構體 - Google Patents

電路連接用接著劑組成物及結構體 Download PDF

Info

Publication number
TW201728721A
TW201728721A TW105138741A TW105138741A TW201728721A TW 201728721 A TW201728721 A TW 201728721A TW 105138741 A TW105138741 A TW 105138741A TW 105138741 A TW105138741 A TW 105138741A TW 201728721 A TW201728721 A TW 201728721A
Authority
TW
Taiwan
Prior art keywords
mass
circuit
adhesive composition
parts
component
Prior art date
Application number
TW105138741A
Other languages
English (en)
Chinese (zh)
Inventor
Tomoki Morijiri
Kazuya Matsuda
Masaru Tanaka
Takashi Tatsuzawa
Kengo Shinohara
Yasunori Kawabata
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of TW201728721A publication Critical patent/TW201728721A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Physics & Mathematics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Combinations Of Printed Boards (AREA)
TW105138741A 2015-11-25 2016-11-25 電路連接用接著劑組成物及結構體 TW201728721A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015229924 2015-11-25

Publications (1)

Publication Number Publication Date
TW201728721A true TW201728721A (zh) 2017-08-16

Family

ID=58764257

Family Applications (3)

Application Number Title Priority Date Filing Date
TW111143136A TWI836720B (zh) 2015-11-25 2016-11-25 電路連接用接著劑組成物及結構體
TW105138741A TW201728721A (zh) 2015-11-25 2016-11-25 電路連接用接著劑組成物及結構體
TW112138764A TW202402994A (zh) 2015-11-25 2016-11-25 電路連接用接著劑組成物及結構體

Family Applications Before (1)

Application Number Title Priority Date Filing Date
TW111143136A TWI836720B (zh) 2015-11-25 2016-11-25 電路連接用接著劑組成物及結構體

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW112138764A TW202402994A (zh) 2015-11-25 2016-11-25 電路連接用接著劑組成物及結構體

Country Status (5)

Country Link
JP (1) JP6870618B2 (ja)
KR (1) KR102615097B1 (ja)
CN (2) CN118291047A (ja)
TW (3) TWI836720B (ja)
WO (1) WO2017090659A1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020066851A1 (ja) 2018-09-27 2020-04-02 日産化学株式会社 無機酸化物粒子を含むアクリル系コーティング組成物
CN113613892A (zh) * 2019-03-13 2021-11-05 昭和电工材料株式会社 电路连接用黏合剂膜及其制造方法、电路连接结构体的制造方法以及黏合剂膜收纳套组
CN116802243A (zh) * 2021-01-25 2023-09-22 株式会社力森诺科 膜状黏合剂及连接结构体的制造方法
JP2024042257A (ja) * 2022-09-15 2024-03-28 株式会社レゾナック 接着剤組成物、接着剤フィルム、接続構造体及びその製造方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006199778A (ja) 2005-01-19 2006-08-03 Hitachi Chem Co Ltd 接着剤組成物、回路接続用接着剤及びこれを用いた回路接続方法、接続体
JPWO2009063827A1 (ja) 2007-11-12 2011-03-31 日立化成工業株式会社 回路接続材料、及び回路部材の接続構造
WO2010038574A1 (ja) * 2008-09-30 2010-04-08 ソニーケミカル＆インフォメーションデバイス株式会社 アクリル系絶縁性接着剤
KR101763458B1 (ko) * 2010-03-12 2017-07-31 히타치가세이가부시끼가이샤 접착재 릴
JP2012046756A (ja) 2011-09-28 2012-03-08 Hitachi Chem Co Ltd 回路接続用接着剤及びこれらを用いた回路接続方法、接続体
JP2012046757A (ja) 2011-09-28 2012-03-08 Hitachi Chem Co Ltd 回路接続用接着剤及びこれらを用いた回路接続方法、接続体
JP5392333B2 (ja) 2011-09-28 2014-01-22 日立化成株式会社 回路接続用接着剤及びこれらを用いた回路接続方法、接続体
JP6024261B2 (ja) * 2012-07-26 2016-11-16 日立化成株式会社 回路接続用接着剤、回路部材の接続構造体及び太陽電池モジュール
JP6029922B2 (ja) * 2012-10-05 2016-11-24 デクセリアルズ株式会社 回路接続材料及びその製造方法、並びにそれを用いた実装体の製造方法
JP5887304B2 (ja) * 2013-06-21 2016-03-16 株式会社タムラ製作所 異方性導電性ペーストおよびそれを用いたプリント配線基板
JP2015098575A (ja) * 2013-10-16 2015-05-28 日立化成株式会社 接着剤組成物及び接続体
JP6417675B2 (ja) * 2014-03-03 2018-11-07 日立化成株式会社 接着剤組成物及び接続体

Also Published As

Publication number Publication date
KR20180084929A (ko) 2018-07-25
TWI836720B (zh) 2024-03-21
JPWO2017090659A1 (ja) 2018-09-13
CN118291047A (zh) 2024-07-05
JP6870618B2 (ja) 2021-05-12
TW202402994A (zh) 2024-01-16
KR102615097B1 (ko) 2023-12-18
CN108291114A (zh) 2018-07-17
WO2017090659A1 (ja) 2017-06-01
TW202313896A (zh) 2023-04-01

Similar Documents

Publication Publication Date Title
KR101970376B1 (ko) 접착제 조성물 및 접속체
US9515042B2 (en) Anisotropic conductive film, connection structure and method of producing the same
TW200811262A (en) Adhesive sheet, and connecting structure for circuit member and semiconductor device which use the adhesive sheet
TW201728721A (zh) 電路連接用接著劑組成物及結構體
JP2009170898A (ja) 回路接続材料及び回路部材の接続構造
TW200303708A (en) Method for connecting electrodes, surface-treated wiring board and adhesive film used in the method, and electrodes-connected structure
JP7172991B2 (ja) 接着剤組成物及び構造体
TWI718199B (zh) 接著劑組成物及結構體
KR20140064967A (ko) 회로 접속 재료 및 그것을 사용한 접속 방법 및 접속 구조체
JP7124936B2 (ja) 接着剤組成物及び構造体
TWI814761B (zh) 接著劑膜
JP7172990B2 (ja) 接着剤組成物及び構造体
KR102467385B1 (ko) 접속 구조체, 회로 접속 부재 및 접착제 조성물
JP2012046757A (ja) 回路接続用接着剤及びこれらを用いた回路接続方法、接続体
TW201833941A (zh) 接著劑膜
TW201728730A (zh) 接著劑組成物及結構體
JP2024085094A (ja) 接着剤組成物、構造体及びその製造方法