KR101574475B1 - 표면 처리 구리박 및 표면 처리 구리박을 사용해서 얻어지는 동장 적층판 - Google Patents
표면 처리 구리박 및 표면 처리 구리박을 사용해서 얻어지는 동장 적층판 Download PDFInfo
- Publication number
- KR101574475B1 KR101574475B1 KR1020157024932A KR20157024932A KR101574475B1 KR 101574475 B1 KR101574475 B1 KR 101574475B1 KR 1020157024932 A KR1020157024932 A KR 1020157024932A KR 20157024932 A KR20157024932 A KR 20157024932A KR 101574475 B1 KR101574475 B1 KR 101574475B1
- Authority
- KR
- South Korea
- Prior art keywords
- copper
- copper foil
- complex compound
- quot
- roughened
- Prior art date
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Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/385—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/538—Roughness
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1157—Using means for chemical reduction
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Treatment Of Metals (AREA)
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Electroplating Methods And Accessories (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- ing And Chemical Polishing (AREA)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013027059 | 2013-02-14 | ||
JPJP-P-2013-027059 | 2013-02-14 | ||
JP2013195941 | 2013-09-20 | ||
JPJP-P-2013-195941 | 2013-09-20 | ||
PCT/JP2014/053450 WO2014126193A1 (ja) | 2013-02-14 | 2014-02-14 | 表面処理銅箔及び表面処理銅箔を用いて得られる銅張積層板 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20150119217A KR20150119217A (ko) | 2015-10-23 |
KR101574475B1 true KR101574475B1 (ko) | 2015-12-03 |
Family
ID=51354192
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020157024932A KR101574475B1 (ko) | 2013-02-14 | 2014-02-14 | 표면 처리 구리박 및 표면 처리 구리박을 사용해서 얻어지는 동장 적층판 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP5809361B2 (ja) |
KR (1) | KR101574475B1 (ja) |
CN (2) | CN107881505A (ja) |
TW (1) | TWI543862B (ja) |
WO (1) | WO2014126193A1 (ja) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101713505B1 (ko) * | 2014-03-31 | 2017-03-07 | 미쓰이금속광업주식회사 | 캐리어박이 구비된 구리박, 구리 클래드 적층판 및 프린트 배선판 |
KR101931895B1 (ko) * | 2014-12-05 | 2018-12-21 | 미쓰이금속광업주식회사 | 고주파 신호 전송 회로 형성용 표면 처리 동박, 동장 적층판 및 프린트 배선판 |
JP6342078B2 (ja) * | 2015-07-29 | 2018-06-13 | 三井金属鉱業株式会社 | 粗化処理銅箔、銅張積層板及びプリント配線板 |
KR101821601B1 (ko) * | 2015-09-30 | 2018-01-24 | 미쓰이금속광업주식회사 | 조화 처리 동박, 동장 적층판 및 프린트 배선판 |
JP6087028B1 (ja) * | 2015-09-30 | 2017-03-01 | 三井金属鉱業株式会社 | 粗化処理銅箔、銅張積層板及びプリント配線板 |
JP6449823B2 (ja) * | 2016-01-21 | 2019-01-09 | 大成プラス株式会社 | 銅と樹脂の複合体及び塗料 |
WO2017150043A1 (ja) | 2016-03-03 | 2017-09-08 | 三井金属鉱業株式会社 | 銅張積層板の製造方法 |
MY186859A (en) * | 2016-04-14 | 2021-08-26 | Mitsui Mining & Smelting Co Ltd | Treated surface copper foil, copper foil with carrier as well as methods for manufacturing copper-clad laminate and printed circuit board using same |
CN111344435A (zh) | 2017-11-10 | 2020-06-26 | 纳美仕有限公司 | 复合铜箔 |
JP7013003B2 (ja) * | 2017-11-10 | 2022-01-31 | ナミックス株式会社 | 粗面化処理された銅表面を有する物体 |
JP6985745B2 (ja) | 2018-06-20 | 2021-12-22 | ナミックス株式会社 | 粗化処理銅箔、銅張積層板及びプリント配線板 |
JP7230932B2 (ja) * | 2019-01-30 | 2023-03-01 | Agc株式会社 | 積層体及びその製造方法、複合積層体の製造方法、並びにポリマーフィルムの製造方法 |
JP7352939B2 (ja) * | 2019-05-09 | 2023-09-29 | ナミックス株式会社 | 複合銅部材 |
JP7456578B2 (ja) * | 2019-05-09 | 2024-03-27 | ナミックス株式会社 | 銅表面の加工装置 |
JP7409602B2 (ja) * | 2019-05-09 | 2024-01-09 | ナミックス株式会社 | 複合銅部材 |
KR20220088684A (ko) | 2019-10-25 | 2022-06-28 | 나믹스 가부시끼가이샤 | 복합 구리 부재 |
US20230332008A1 (en) | 2020-11-20 | 2023-10-19 | Shin-Etsu Chemical Co., Ltd. | Phenol compound, conductive paste composition, method for producing conductive paste composition, conductive wire, and method for producing conductive wire |
JPWO2022202541A1 (ja) * | 2021-03-26 | 2022-09-29 | ||
JPWO2022202540A1 (ja) * | 2021-03-26 | 2022-09-29 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003293166A (ja) | 2002-04-02 | 2003-10-15 | Kobe Steel Ltd | 銅又は銅合金管及びその製造方法 |
JP2006086212A (ja) | 2004-09-14 | 2006-03-30 | Fujitsu Ltd | 回路基板及びその製造方法 |
JP2008248269A (ja) | 2007-03-29 | 2008-10-16 | Hitachi Chem Co Ltd | 銅表面の処理方法およびこの方法を用いた配線基板 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56153797A (en) * | 1980-04-28 | 1981-11-27 | Hitachi Chemical Co Ltd | Method of manufacturing multilayer printed circuit board substrate |
JPH0628941B2 (ja) * | 1988-09-20 | 1994-04-20 | 株式会社日立製作所 | 回路基板及びその製造方法 |
JPH07116640B2 (ja) * | 1991-04-12 | 1995-12-13 | 株式会社日立製作所 | 金属銅箔、及びその製造方法 |
JP2006152329A (ja) * | 2004-11-25 | 2006-06-15 | Shin Kobe Electric Mach Co Ltd | 銅層の表面処理法および当該処理をした銅層を含む積層板ならびに配線板 |
JP4883425B2 (ja) * | 2007-12-14 | 2012-02-22 | 株式会社デンソー | 樹脂金属接合物及びその製造方法 |
-
2014
- 2014-02-14 CN CN201711130781.6A patent/CN107881505A/zh active Pending
- 2014-02-14 TW TW103104874A patent/TWI543862B/zh active
- 2014-02-14 JP JP2014526727A patent/JP5809361B2/ja active Active
- 2014-02-14 WO PCT/JP2014/053450 patent/WO2014126193A1/ja active Application Filing
- 2014-02-14 CN CN201480018448.4A patent/CN105102678B/zh active Active
- 2014-02-14 KR KR1020157024932A patent/KR101574475B1/ko active IP Right Grant
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003293166A (ja) | 2002-04-02 | 2003-10-15 | Kobe Steel Ltd | 銅又は銅合金管及びその製造方法 |
JP2006086212A (ja) | 2004-09-14 | 2006-03-30 | Fujitsu Ltd | 回路基板及びその製造方法 |
JP2008248269A (ja) | 2007-03-29 | 2008-10-16 | Hitachi Chem Co Ltd | 銅表面の処理方法およびこの方法を用いた配線基板 |
Also Published As
Publication number | Publication date |
---|---|
CN105102678A (zh) | 2015-11-25 |
TWI543862B (zh) | 2016-08-01 |
CN105102678B (zh) | 2018-06-12 |
CN107881505A (zh) | 2018-04-06 |
WO2014126193A1 (ja) | 2014-08-21 |
JP5809361B2 (ja) | 2015-11-10 |
KR20150119217A (ko) | 2015-10-23 |
TW201446492A (zh) | 2014-12-16 |
JPWO2014126193A1 (ja) | 2017-02-02 |
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