JPWO2022202540A1 - - Google Patents
Info
- Publication number
- JPWO2022202540A1 JPWO2022202540A1 JP2023509068A JP2023509068A JPWO2022202540A1 JP WO2022202540 A1 JPWO2022202540 A1 JP WO2022202540A1 JP 2023509068 A JP2023509068 A JP 2023509068A JP 2023509068 A JP2023509068 A JP 2023509068A JP WO2022202540 A1 JPWO2022202540 A1 JP WO2022202540A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/04—Wires; Strips; Foils
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/16—Electroplating with layers of varying thickness
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Laminated Bodies (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021053817 | 2021-03-26 | ||
PCT/JP2022/011924 WO2022202540A1 (ja) | 2021-03-26 | 2022-03-16 | 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2022202540A1 true JPWO2022202540A1 (ja) | 2022-09-29 |
Family
ID=83397231
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023509068A Pending JPWO2022202540A1 (ja) | 2021-03-26 | 2022-03-16 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPWO2022202540A1 (ja) |
KR (1) | KR20230159392A (ja) |
CN (1) | CN116997684A (ja) |
TW (1) | TW202239593A (ja) |
WO (1) | WO2022202540A1 (ja) |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105102678B (zh) * | 2013-02-14 | 2018-06-12 | 三井金属矿业株式会社 | 表面处理铜箔及用表面处理铜箔得到的覆铜层压板 |
MY181562A (en) | 2013-02-28 | 2020-12-29 | Mitsui Mining & Smelting Co Ltd | Black color surface-treated copper foil, method of manufacturing black color surface-treated copper foil, copper-clad laminate and flexible printed wiring board |
WO2015040998A1 (ja) * | 2013-09-20 | 2015-03-26 | 三井金属鉱業株式会社 | 銅箔、キャリア箔付銅箔及び銅張積層板 |
KR101975135B1 (ko) | 2015-04-28 | 2019-05-03 | 미쓰이금속광업주식회사 | 조면화 처리 구리박 및 프린트 배선판 |
JP6945523B2 (ja) * | 2016-04-14 | 2021-10-06 | 三井金属鉱業株式会社 | 表面処理銅箔、キャリア付銅箔、並びにそれらを用いた銅張積層板及びプリント配線板の製造方法 |
KR102268478B1 (ko) * | 2016-12-14 | 2021-06-22 | 후루카와 덴키 고교 가부시키가이샤 | 표면 처리 동박 및 동 클래드 적층판 |
JP7492808B2 (ja) * | 2017-03-31 | 2024-05-30 | Jx金属株式会社 | 表面処理銅箔、樹脂層付き表面処理銅箔、キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法 |
JP7114499B2 (ja) * | 2019-01-30 | 2022-08-08 | Jx金属株式会社 | 表面処理銅箔、銅張積層板及びプリント配線板 |
-
2022
- 2022-03-16 WO PCT/JP2022/011924 patent/WO2022202540A1/ja active Application Filing
- 2022-03-16 CN CN202280021758.6A patent/CN116997684A/zh active Pending
- 2022-03-16 JP JP2023509068A patent/JPWO2022202540A1/ja active Pending
- 2022-03-16 KR KR1020237030059A patent/KR20230159392A/ko unknown
- 2022-03-23 TW TW111110889A patent/TW202239593A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
TW202239593A (zh) | 2022-10-16 |
WO2022202540A1 (ja) | 2022-09-29 |
KR20230159392A (ko) | 2023-11-21 |
CN116997684A (zh) | 2023-11-03 |