TWI543862B - 表面處理銅箔以及使用表面處理銅箔而得之貼銅積層板 - Google Patents

表面處理銅箔以及使用表面處理銅箔而得之貼銅積層板 Download PDF

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Publication number
TWI543862B
TWI543862B TW103104874A TW103104874A TWI543862B TW I543862 B TWI543862 B TW I543862B TW 103104874 A TW103104874 A TW 103104874A TW 103104874 A TW103104874 A TW 103104874A TW I543862 B TWI543862 B TW I543862B
Authority
TW
Taiwan
Prior art keywords
copper foil
copper
treated
roughened
composite compound
Prior art date
Application number
TW103104874A
Other languages
English (en)
Chinese (zh)
Other versions
TW201446492A (zh
Inventor
津吉裕昭
細川真
Original Assignee
三井金屬鑛業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三井金屬鑛業股份有限公司 filed Critical 三井金屬鑛業股份有限公司
Publication of TW201446492A publication Critical patent/TW201446492A/zh
Application granted granted Critical
Publication of TWI543862B publication Critical patent/TWI543862B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/385—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/538—Roughness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1157—Using means for chemical reduction
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Laminated Bodies (AREA)
  • Chemical Treatment Of Metals (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • ing And Chemical Polishing (AREA)
TW103104874A 2013-02-14 2014-02-14 表面處理銅箔以及使用表面處理銅箔而得之貼銅積層板 TWI543862B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013027059 2013-02-14
JP2013195941 2013-09-20

Publications (2)

Publication Number Publication Date
TW201446492A TW201446492A (zh) 2014-12-16
TWI543862B true TWI543862B (zh) 2016-08-01

Family

ID=51354192

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103104874A TWI543862B (zh) 2013-02-14 2014-02-14 表面處理銅箔以及使用表面處理銅箔而得之貼銅積層板

Country Status (5)

Country Link
JP (1) JP5809361B2 (ja)
KR (1) KR101574475B1 (ja)
CN (2) CN107881505A (ja)
TW (1) TWI543862B (ja)
WO (1) WO2014126193A1 (ja)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015151935A1 (ja) * 2014-03-31 2015-10-08 三井金属鉱業株式会社 キャリア箔付銅箔、銅張積層板及びプリント配線板
JP6110581B2 (ja) * 2014-12-05 2017-04-05 三井金属鉱業株式会社 高周波信号伝送回路形成用表面処理銅箔、銅張積層板及びプリント配線板
KR102490491B1 (ko) 2015-07-29 2023-01-19 나믹스 코포레이션 조면화 처리 구리박, 동장 적층판 및 프린트 배선판
JP6087028B1 (ja) * 2015-09-30 2017-03-01 三井金属鉱業株式会社 粗化処理銅箔、銅張積層板及びプリント配線板
US10280501B2 (en) 2015-09-30 2019-05-07 Mitsui Mining & Smelting Co., Ltd. Roughened copper foil, copper clad laminate, and printed circuit board
JP6449823B2 (ja) * 2016-01-21 2019-01-09 大成プラス株式会社 銅と樹脂の複合体及び塗料
US10244635B2 (en) 2016-03-03 2019-03-26 Mitsui Mining & Smelting Co., Ltd. Production method for copper-clad laminate plate
MY186859A (en) * 2016-04-14 2021-08-26 Mitsui Mining & Smelting Co Ltd Treated surface copper foil, copper foil with carrier as well as methods for manufacturing copper-clad laminate and printed circuit board using same
CN111344435A (zh) 2017-11-10 2020-06-26 纳美仕有限公司 复合铜箔
JP7013003B2 (ja) * 2017-11-10 2022-01-31 ナミックス株式会社 粗面化処理された銅表面を有する物体
JP6985745B2 (ja) 2018-06-20 2021-12-22 ナミックス株式会社 粗化処理銅箔、銅張積層板及びプリント配線板
JP7230932B2 (ja) * 2019-01-30 2023-03-01 Ａｇｃ株式会社 積層体及びその製造方法、複合積層体の製造方法、並びにポリマーフィルムの製造方法
JP7352939B2 (ja) * 2019-05-09 2023-09-29 ナミックス株式会社 複合銅部材
JP7456578B2 (ja) * 2019-05-09 2024-03-27 ナミックス株式会社 銅表面の加工装置
JP7409602B2 (ja) * 2019-05-09 2024-01-09 ナミックス株式会社 複合銅部材
KR20220088684A (ko) 2019-10-25 2022-06-28 나믹스 가부시끼가이샤 복합 구리 부재
IL301953A (en) 2020-11-20 2023-06-01 Shinetsu Chemical Co Phenol compound, conductive pulp composition, method for producing conductive pulp composition, conductive wire, and method for producing conductive wire
CN116997684A (zh) * 2021-03-26 2023-11-03 三井金属矿业株式会社 粗糙化处理铜箔、带载体铜箔、覆铜层叠板及印刷电路板
CN116997683A (zh) * 2021-03-26 2023-11-03 三井金属矿业株式会社 粗糙化处理铜箔、带载体铜箔、覆铜层叠板及印刷电路板

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56153797A (en) * 1980-04-28 1981-11-27 Hitachi Chemical Co Ltd Method of manufacturing multilayer printed circuit board substrate
JPH0628941B2 (ja) * 1988-09-20 1994-04-20 株式会社日立製作所 回路基板及びその製造方法
JPH07116640B2 (ja) * 1991-04-12 1995-12-13 株式会社日立製作所 金属銅箔、及びその製造方法
JP2003293166A (ja) 2002-04-02 2003-10-15 Kobe Steel Ltd 銅又は銅合金管及びその製造方法
JP4727194B2 (ja) 2004-09-14 2011-07-20 富士通株式会社 回路基板
JP2006152329A (ja) * 2004-11-25 2006-06-15 Shin Kobe Electric Mach Co Ltd 銅層の表面処理法および当該処理をした銅層を含む積層板ならびに配線板
JP2008248269A (ja) 2007-03-29 2008-10-16 Hitachi Chem Co Ltd 銅表面の処理方法およびこの方法を用いた配線基板
WO2009078382A1 (ja) * 2007-12-14 2009-06-25 Denso Corporation 樹脂金属接合物及びその製造方法

Also Published As

Publication number Publication date
TW201446492A (zh) 2014-12-16
CN105102678B (zh) 2018-06-12
WO2014126193A1 (ja) 2014-08-21
KR101574475B1 (ko) 2015-12-03
CN107881505A (zh) 2018-04-06
JPWO2014126193A1 (ja) 2017-02-02
JP5809361B2 (ja) 2015-11-10
CN105102678A (zh) 2015-11-25
KR20150119217A (ko) 2015-10-23

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