KR101493380B1 - 도금장치 및 도금방법 - Google Patents

도금장치 및 도금방법 Download PDF

Info

Publication number
KR101493380B1
KR101493380B1 KR20080122015A KR20080122015A KR101493380B1 KR 101493380 B1 KR101493380 B1 KR 101493380B1 KR 20080122015 A KR20080122015 A KR 20080122015A KR 20080122015 A KR20080122015 A KR 20080122015A KR 101493380 B1 KR101493380 B1 KR 101493380B1
Authority
KR
South Korea
Prior art keywords
plating
substrate
holder
anode
paddle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR20080122015A
Other languages
English (en)
Korean (ko)
Other versions
KR20090058466A (ko
Inventor
노부토시 사이토
준페이 후지카타
다다아키 야마모토
겐지 가미무라
Original Assignee
가부시키가이샤 에바라 세이사꾸쇼
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 에바라 세이사꾸쇼 filed Critical 가부시키가이샤 에바라 세이사꾸쇼
Publication of KR20090058466A publication Critical patent/KR20090058466A/ko
Application granted granted Critical
Publication of KR101493380B1 publication Critical patent/KR101493380B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/007—Current directing devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/008—Current shielding devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C25D17/08—Supporting racks, i.e. not for suspending
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
KR20080122015A 2007-12-04 2008-12-03 도금장치 및 도금방법 Active KR101493380B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007313730 2007-12-04
JPJP-P-2007-313730 2007-12-04
JP2008292174A JP5184308B2 (ja) 2007-12-04 2008-11-14 めっき装置及びめっき方法
JPJP-P-2008-292174 2008-11-14

Related Child Applications (2)

Application Number Title Priority Date Filing Date
KR1020140127522A Division KR101515120B1 (ko) 2007-12-04 2014-09-24 도금장치 및 도금방법
KR20140127518A Division KR101486441B1 (ko) 2007-12-04 2014-09-24 도금장치 및 도금방법

Publications (2)

Publication Number Publication Date
KR20090058466A KR20090058466A (ko) 2009-06-09
KR101493380B1 true KR101493380B1 (ko) 2015-02-23

Family

ID=40733742

Family Applications (3)

Application Number Title Priority Date Filing Date
KR20080122015A Active KR101493380B1 (ko) 2007-12-04 2008-12-03 도금장치 및 도금방법
KR20140127518A Active KR101486441B1 (ko) 2007-12-04 2014-09-24 도금장치 및 도금방법
KR1020140127522A Active KR101515120B1 (ko) 2007-12-04 2014-09-24 도금장치 및 도금방법

Family Applications After (2)

Application Number Title Priority Date Filing Date
KR20140127518A Active KR101486441B1 (ko) 2007-12-04 2014-09-24 도금장치 및 도금방법
KR1020140127522A Active KR101515120B1 (ko) 2007-12-04 2014-09-24 도금장치 및 도금방법

Country Status (4)

Country Link
JP (5) JP5184308B2 (https=)
KR (3) KR101493380B1 (https=)
CN (5) CN108588800B (https=)
TW (1) TWI457471B (https=)

Families Citing this family (67)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5184308B2 (ja) * 2007-12-04 2013-04-17 株式会社荏原製作所 めっき装置及びめっき方法
CN102453944A (zh) * 2010-10-19 2012-05-16 上海嘉捷通电路科技有限公司 一种新型运动式电镀设备
CN103184491A (zh) * 2011-12-28 2013-07-03 北京有色金属研究总院 一种对镀件施加外部磁场的电镀装置及方法
US20150068890A1 (en) * 2012-04-20 2015-03-12 Jcu Corporation Substrate plating jig and plating device using same
WO2014069023A1 (ja) * 2012-11-01 2014-05-08 ユケン工業株式会社 めっき装置、ノズル－アノードユニット、めっき部材の製造方法、および被めっき部材固定装置
CN103849915B (zh) * 2012-12-06 2016-08-31 北大方正集团有限公司 电镀装置和pcb板导通孔镀铜的方法
JP2014237865A (ja) * 2013-06-06 2014-12-18 株式会社荏原製作所 電解銅めっき装置
CN104562162B (zh) * 2013-10-21 2018-03-23 欣兴电子股份有限公司 隔膜装置
KR20160119128A (ko) 2014-02-06 2016-10-12 가부시키가이샤 에바라 세이사꾸쇼 기판 홀더, 도금 장치 및 도금 방법
JP6285199B2 (ja) * 2014-02-10 2018-02-28 株式会社荏原製作所 アノードホルダ及びめっき装置
US20150247251A1 (en) * 2014-02-28 2015-09-03 Applied Materials, Inc. Methods for electrochemical deposition of multi-component solder using cation permeable barrier
KR102194716B1 (ko) * 2014-03-06 2020-12-23 삼성전기주식회사 도금 장치
CN104005077B (zh) * 2014-05-14 2016-11-09 上海交通大学 优化温度场分布的电镀装置及其电镀方法
JP6411943B2 (ja) * 2014-05-26 2018-10-24 株式会社荏原製作所 基板電解処理装置、および該基板電解処理装置に使用されるパドル
JP6335763B2 (ja) * 2014-11-20 2018-05-30 株式会社荏原製作所 めっき装置及びめっき方法
JP6335777B2 (ja) 2014-12-26 2018-05-30 株式会社荏原製作所 基板ホルダ、基板ホルダで基板を保持する方法、及びめっき装置
JP6459597B2 (ja) * 2015-02-16 2019-01-30 株式会社村田製作所 電解めっき装置
JP6408936B2 (ja) 2015-03-05 2018-10-17 株式会社荏原製作所 めっき装置
JP6407093B2 (ja) * 2015-04-28 2018-10-17 株式会社荏原製作所 電解処理装置
JP6399973B2 (ja) * 2015-06-18 2018-10-03 株式会社荏原製作所 めっき装置の調整方法及び測定装置
KR101667959B1 (ko) * 2015-07-14 2016-10-24 한국기계연구원 도금용 지그
JP6813490B2 (ja) * 2015-08-05 2021-01-13 アトテツク・ドイチユラント・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツングＡｔｏｔｅｃｈ Ｄｅｕｔｓｃｈｌａｎｄ ＧｍｂＨ 基板保持器受入れ装置
JP6317299B2 (ja) * 2015-08-28 2018-04-25 株式会社荏原製作所 めっき装置、めっき方法、及び基板ホルダ
JP6746185B2 (ja) * 2016-02-01 2020-08-26 アスカコーポレーション株式会社 半導体ウェハめっき用治具
CN105648514B (zh) * 2016-03-24 2017-09-12 河南理工大学 一种用于电沉积的搅拌机构
CN105648507A (zh) * 2016-03-24 2016-06-08 河南理工大学 一种用于电沉积平面件的装置
JP6678490B2 (ja) 2016-03-28 2020-04-08 株式会社荏原製作所 めっき方法
JP6795915B2 (ja) * 2016-06-10 2020-12-02 株式会社荏原製作所 アノードに給電可能な給電体及びめっき装置
JP6754636B2 (ja) * 2016-08-12 2020-09-16 株式会社ユアサメンブレンシステム 隔膜部材
JP6713916B2 (ja) 2016-12-01 2020-06-24 株式会社荏原製作所 基板ホルダ、めっき装置、及び基板ホルダの製造方法
JP6761763B2 (ja) * 2017-02-06 2020-09-30 株式会社荏原製作所 パドル、該パドルを備えためっき装置、およびめっき方法
JP6860406B2 (ja) 2017-04-05 2021-04-14 株式会社荏原製作所 半導体製造装置、半導体製造装置の故障予知方法、および半導体製造装置の故障予知プログラム
JP2017186677A (ja) * 2017-05-29 2017-10-12 株式会社荏原製作所 電解銅めっき装置
JP6993115B2 (ja) * 2017-06-16 2022-01-13 株式会社荏原製作所 めっき装置
JP6986921B2 (ja) * 2017-10-12 2021-12-22 株式会社荏原製作所 めっき装置及びめっき方法
JP6329681B1 (ja) * 2017-10-31 2018-05-23 株式会社荏原製作所 めっき装置及びめっき方法
JP6890528B2 (ja) 2017-12-15 2021-06-18 株式会社荏原製作所 パドルに取り付け可能な消波部材および消波部材を備えるめっき装置
JP6979900B2 (ja) * 2018-02-13 2021-12-15 株式会社荏原製作所 基板保持部材、基板処理装置、基板処理装置の制御方法、プログラムを格納した記憶媒体
JP6942072B2 (ja) * 2018-02-22 2021-09-29 株式会社荏原製作所 めっき装置
JP7005381B2 (ja) * 2018-02-26 2022-01-21 三菱電機株式会社 半導体製造装置および半導体装置の製造方法
JP6966958B2 (ja) * 2018-03-01 2021-11-17 株式会社荏原製作所 めっき液を撹拌するために用いるパドルおよびパドルを備えるめっき装置
JP6790016B2 (ja) * 2018-04-10 2020-11-25 上村工業株式会社 表面処理装置、表面処理方法及びパドル
TWI668335B (zh) * 2018-08-22 2019-08-11 華紹國際有限公司 電鍍裝置及電鍍方法
TWI690620B (zh) * 2018-08-22 2020-04-11 華紹國際有限公司 化學鍍裝置及金屬化基板的製造方法
US10865496B2 (en) * 2018-10-30 2020-12-15 Taiwan Semiconductor Manufacturing Company, Ltd. Plating apparatus and plating method
JP7193381B2 (ja) * 2019-02-28 2022-12-20 株式会社荏原製作所 めっき装置
JP7183111B2 (ja) * 2019-05-17 2022-12-05 株式会社荏原製作所 めっき方法、めっき用の不溶性アノード、及びめっき装置
JP7173932B2 (ja) * 2019-06-10 2022-11-16 株式会社荏原製作所 アノードホルダ、及びめっき装置
US11608563B2 (en) * 2019-07-19 2023-03-21 Asmpt Nexx, Inc. Electrochemical deposition systems
CN110804755A (zh) * 2019-08-27 2020-02-18 宁波华远电子科技有限公司 电镀设备
JP7383441B2 (ja) * 2019-10-07 2023-11-20 上村工業株式会社 表面処理装置、表面処理方法及びパドル
JP7316908B2 (ja) * 2019-10-30 2023-07-28 株式会社荏原製作所 アノード組立体
CN110629264B (zh) * 2019-11-11 2021-09-24 生益电子股份有限公司 一种pcb电镀装置
CN110804757B (zh) * 2019-11-27 2024-02-20 镇江耐丝新型材料有限公司 一种用于镀铜槽内的铜粒平整工装
JP7460504B2 (ja) * 2020-10-20 2024-04-02 株式会社荏原製作所 めっき装置
CN114981485B (zh) 2020-12-21 2023-03-28 株式会社荏原制作所 镀覆装置以及镀覆液的搅拌方法
CN114855244A (zh) * 2021-02-04 2022-08-05 盛美半导体设备(上海)股份有限公司 电镀装置及电镀方法
US12152312B2 (en) 2021-02-25 2024-11-26 Ebara Corporation Plating apparatus and air bubble removing method of plating apparatus
US12351929B2 (en) 2021-03-10 2025-07-08 Ebara Corporation Plating apparatus and plating method
CN115110136B (zh) * 2021-03-19 2024-03-08 先进半导体材料(深圳)有限公司 电镀设备及电镀方法
CN114262927B (zh) * 2021-11-25 2023-06-06 绍兴同芯成集成电路有限公司 一种用于基板的电镀装置及电镀方法
CN114737241B (zh) * 2022-05-16 2023-10-20 广德正大电子科技有限公司 一种提高电镀均匀性的镀金整流机分布结构
CN115491740B (zh) * 2022-11-01 2024-06-21 中国工程物理研究院材料研究所 一种静态外壁管状电镀铀装置
WO2024122043A1 (ja) * 2022-12-09 2024-06-13 株式会社荏原製作所 めっき装置
CN119221083A (zh) * 2023-06-29 2024-12-31 盛美半导体设备(上海)股份有限公司 电镀设备的搅拌机构、电镀设备及电镀方法
CN117564013A (zh) * 2023-10-20 2024-02-20 株洲茂物医疗科技有限公司 一种导丝芯丝的清洁设备
KR102931671B1 (ko) 2025-08-06 2026-02-26 (주)네오피엠씨 도금장치용 패들 구동장치

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5767192A (en) * 1980-10-11 1982-04-23 C Uyemura & Co Ltd High-speed plating method
JP2006152415A (ja) * 2004-12-01 2006-06-15 Ebara Corp めっき装置及びめっき方法
JP2007527948A (ja) * 2003-06-06 2007-10-04 セミトゥール インコーポレイテッド 流れ攪拌器及び／又は複数電極を用いて微小特徴加工物を処理する方法及びシステム

Family Cites Families (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5633500A (en) * 1979-08-28 1981-04-03 Fujitsu Ltd Averaging apparatus of distribution of plating electric current
JPS61116768U (https=) * 1984-12-28 1986-07-23
JPH02145791A (ja) * 1988-11-28 1990-06-05 Eagle Ind Co Ltd めっき装置とめっき方法およびめっき用遮蔽板
JPH0444373U (https=) * 1990-08-15 1992-04-15
JP3109548B2 (ja) * 1992-07-02 2000-11-20 イビデン株式会社 電気メッキ装置
US5516412A (en) * 1995-05-16 1996-05-14 International Business Machines Corporation Vertical paddle plating cell
JPH09273000A (ja) * 1996-04-09 1997-10-21 Hitachi Kyowa Eng Kk めっき装置
CN2270737Y (zh) * 1996-05-21 1997-12-17 王明臣 内孔镀铁装置
JPH11229196A (ja) * 1998-02-12 1999-08-24 Mitsubishi Shindoh Co Ltd 電気めっき装置および電気めっき方法
US20030038035A1 (en) * 2001-05-30 2003-02-27 Wilson Gregory J. Methods and systems for controlling current in electrochemical processing of microelectronic workpieces
DE19951324C2 (de) * 1999-10-20 2003-07-17 Atotech Deutschland Gmbh Verfahren und Vorrichtung zum elektrolytischen Behandeln von elektrisch leitfähigen Oberflächen von gegeneinander vereinzelten Platten- und Folienmaterialstücken sowie Anwendung des Verfahrens
JP2001200392A (ja) * 2000-01-20 2001-07-24 Nec Corp めっき装置
JP2001329400A (ja) * 2000-05-17 2001-11-27 Hitachi Kyowa Engineering Co Ltd めっき装置およびめっき方法
US6976973B1 (en) * 2000-10-12 2005-12-20 Baxter International Inc. Peritoneal dialysis catheters
CN1153851C (zh) * 2001-02-28 2004-06-16 研能科技股份有限公司 控制电力线分布的装置及方法
JP4759834B2 (ja) * 2001-04-25 2011-08-31 凸版印刷株式会社 フィルムキャリア用電気めっき装置
JP4368543B2 (ja) * 2001-07-25 2009-11-18 シャープ株式会社 メッキ方法およびメッキ装置
JP2003226997A (ja) * 2002-02-06 2003-08-15 Sony Corp 半導体ウェハー用のメッキ治具
TWM240034U (en) * 2002-02-19 2004-08-01 Advanced Semiconductor Eng Electric field adjustment device of electroplating tank
JP2003247098A (ja) * 2002-02-21 2003-09-05 Ebara Corp めっき装置
US7247223B2 (en) * 2002-05-29 2007-07-24 Semitool, Inc. Method and apparatus for controlling vessel characteristics, including shape and thieving current for processing microfeature workpieces
CN100439571C (zh) * 2002-07-18 2008-12-03 株式会社荏原制作所 电镀装置
CN1477238A (zh) * 2002-08-20 2004-02-25 株式会社Smc 电镀装置
JP2004225129A (ja) * 2003-01-24 2004-08-12 Ebara Corp めっき方法及びめっき装置
DE10313818A1 (de) * 2003-03-24 2004-10-07 Wieland Dental + Technik Gmbh & Co. Kg Vorrichtung und deren Teile für die galvanische Abscheidung von dentalen Formteilen
JP3723963B2 (ja) * 2003-06-06 2005-12-07 三井金属鉱業株式会社 メッキ装置および電子部品実装用フィルムキャリアテープの製造方法
US7390382B2 (en) * 2003-07-01 2008-06-24 Semitool, Inc. Reactors having multiple electrodes and/or enclosed reciprocating paddles, and associated methods
JP4136830B2 (ja) * 2003-07-10 2008-08-20 株式会社荏原製作所 めっき装置
JP2005089812A (ja) * 2003-09-17 2005-04-07 Casio Comput Co Ltd めっき装置および半導体基板のめっき方法
CN1546737A (zh) * 2003-11-28 2004-11-17 魏连o 单面电镀方法及其装置
CN2898063Y (zh) * 2006-03-01 2007-05-09 长沙力元新材料股份有限公司 连续化电镀工艺设备
CN2937161Y (zh) * 2006-08-14 2007-08-22 中国铝业股份有限公司 一种用于电镀生产的电镀液循环装置
CN101054701B (zh) * 2007-02-08 2010-12-08 上海美维科技有限公司 提高电镀均匀性的方法
JP5184308B2 (ja) * 2007-12-04 2013-04-17 株式会社荏原製作所 めっき装置及びめっき方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5767192A (en) * 1980-10-11 1982-04-23 C Uyemura & Co Ltd High-speed plating method
JP2007527948A (ja) * 2003-06-06 2007-10-04 セミトゥール インコーポレイテッド 流れ攪拌器及び／又は複数電極を用いて微小特徴加工物を処理する方法及びシステム
JP2006152415A (ja) * 2004-12-01 2006-06-15 Ebara Corp めっき装置及びめっき方法

Also Published As

Publication number Publication date
JP2013064202A (ja) 2013-04-11
JP5572229B2 (ja) 2014-08-13
CN108588800B (zh) 2020-07-07
JP2009155726A (ja) 2009-07-16
CN105420778A (zh) 2016-03-23
TW200936818A (en) 2009-09-01
KR20140133788A (ko) 2014-11-20
JP5980983B2 (ja) 2016-08-31
CN103060871A (zh) 2013-04-24
CN107604426B (zh) 2019-08-30
JP5213669B2 (ja) 2013-06-19
JP2009155727A (ja) 2009-07-16
JP5726921B2 (ja) 2015-06-03
KR20090058466A (ko) 2009-06-09
KR20140130645A (ko) 2014-11-11
JP2015145537A (ja) 2015-08-13
TWI457471B (zh) 2014-10-21
KR101515120B1 (ko) 2015-04-24
CN108588800A (zh) 2018-09-28
CN101451264A (zh) 2009-06-10
CN103060871B (zh) 2015-11-25
JP2013122091A (ja) 2013-06-20
CN101451264B (zh) 2013-01-23
KR101486441B1 (ko) 2015-01-28
JP5184308B2 (ja) 2013-04-17
CN107604426A (zh) 2018-01-19

Similar Documents

Publication Publication Date Title
KR101493380B1 (ko) 도금장치 및 도금방법
US8177944B2 (en) Plating apparatus and plating method
JP6100049B2 (ja) めっき装置
KR102891957B1 (ko) 도금 장치
US10829865B2 (en) Paddle for use of stirring plating solution and plating apparatus including paddle
CN110184639B (zh) 电镀装置
EP1524338A1 (en) Plating device
JP2009155727A5 (ja) めっき装置
US20210071312A1 (en) Plating method, plating apparatus, anode holder
JP2008510889A (ja) 動的形状アノード
CN203474939U (zh) 电镀装置
JP2007046154A (ja) ワークピースを流体処理する方法及び装置
KR102744025B1 (ko) 도금 장치
WO2020250650A1 (ja) めっき方法、めっき装置、プログラムを記憶する不揮発性の記憶媒体
CN119604647B (zh) 镀敷装置、以及镀敷方法

Legal Events

Date Code Title Description
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

A107 Divisional application of patent
E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0107 Divisional application

St.27 status event code: A-0-1-A10-A18-div-PA0107

St.27 status event code: A-0-1-A10-A16-div-PA0107

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

FPAY Annual fee payment

Payment date: 20180118

Year of fee payment: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

FPAY Annual fee payment

Payment date: 20190116

Year of fee payment: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

FPAY Annual fee payment

Payment date: 20200115

Year of fee payment: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

FPAY Annual fee payment

Payment date: 20210115

Year of fee payment: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

FPAY Annual fee payment

Payment date: 20220103

Year of fee payment: 8

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 9

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 10

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 11

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 12

U11 Full renewal or maintenance fee paid

Free format text: ST27 STATUS EVENT CODE: A-4-4-U10-U11-OTH-PR1001 (AS PROVIDED BY THE NATIONAL OFFICE)

Year of fee payment: 12

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000