KR101476943B1 - 슬러리, 연마액 세트, 연마액, 기판의 연마 방법 및 기판 - Google Patents

슬러리, 연마액 세트, 연마액, 기판의 연마 방법 및 기판 Download PDF

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Publication number
KR101476943B1
KR101476943B1 KR1020137012271A KR20137012271A KR101476943B1 KR 101476943 B1 KR101476943 B1 KR 101476943B1 KR 1020137012271 A KR1020137012271 A KR 1020137012271A KR 20137012271 A KR20137012271 A KR 20137012271A KR 101476943 B1 KR101476943 B1 KR 101476943B1
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polishing
liquid
polished
film
abrasive grains
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KR20130133188A (ko
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도모히로 이와노
다케노리 나리타
다이스케 류자키
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히타치가세이가부시끼가이샤
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K13/00—Etching, surface-brightening or pickling compositions
    • C09K13/12—Etching, surface-brightening or pickling compositions containing heavy metal salts in an amount of at least 50% of the non-solvent components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/402—Chemomechanical polishing [CMP] of semiconductor materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/06—Planarisation of inorganic insulating materials
    • H10P95/062—Planarisation of inorganic insulating materials involving a dielectric removal step

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
KR1020137012271A 2010-11-22 2011-11-21 슬러리, 연마액 세트, 연마액, 기판의 연마 방법 및 기판 Active KR101476943B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2010-260036 2010-11-22
JP2010260036 2010-11-22
PCT/JP2011/076822 WO2012070541A1 (ja) 2010-11-22 2011-11-21 スラリー、研磨液セット、研磨液、基板の研磨方法及び基板

Related Child Applications (3)

Application Number Title Priority Date Filing Date
KR1020137017128A Division KR101886895B1 (ko) 2010-11-22 2011-11-21 슬러리, 연마액 세트, 연마액, 기판의 연마 방법 및 기판
KR1020137017130A Division KR20130129397A (ko) 2010-11-22 2011-11-21 슬러리, 연마액 세트, 연마액, 기판의 연마 방법 및 기판
KR1020137017129A Division KR20130129396A (ko) 2010-11-22 2011-11-21 슬러리, 연마액 세트, 연마액, 기판의 연마 방법 및 기판

Publications (2)

Publication Number Publication Date
KR20130133188A KR20130133188A (ko) 2013-12-06
KR101476943B1 true KR101476943B1 (ko) 2014-12-24

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KR1020137012271A Active KR101476943B1 (ko) 2010-11-22 2011-11-21 슬러리, 연마액 세트, 연마액, 기판의 연마 방법 및 기판
KR1020137017128A Active KR101886895B1 (ko) 2010-11-22 2011-11-21 슬러리, 연마액 세트, 연마액, 기판의 연마 방법 및 기판
KR1020137017129A Withdrawn KR20130129396A (ko) 2010-11-22 2011-11-21 슬러리, 연마액 세트, 연마액, 기판의 연마 방법 및 기판
KR1020137017130A Withdrawn KR20130129397A (ko) 2010-11-22 2011-11-21 슬러리, 연마액 세트, 연마액, 기판의 연마 방법 및 기판

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KR1020137017128A Active KR101886895B1 (ko) 2010-11-22 2011-11-21 슬러리, 연마액 세트, 연마액, 기판의 연마 방법 및 기판
KR1020137017129A Withdrawn KR20130129396A (ko) 2010-11-22 2011-11-21 슬러리, 연마액 세트, 연마액, 기판의 연마 방법 및 기판
KR1020137017130A Withdrawn KR20130129397A (ko) 2010-11-22 2011-11-21 슬러리, 연마액 세트, 연마액, 기판의 연마 방법 및 기판

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US (5) US9988573B2 (enExample)
JP (4) JP5590144B2 (enExample)
KR (4) KR101476943B1 (enExample)
CN (4) CN103497732B (enExample)
SG (1) SG190054A1 (enExample)
TW (4) TWI434919B (enExample)
WO (1) WO2012070541A1 (enExample)

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WO2018179061A1 (ja) 2017-03-27 2018-10-04 日立化成株式会社 研磨液、研磨液セット及び研磨方法
WO2019043819A1 (ja) 2017-08-30 2019-03-07 日立化成株式会社 スラリ及び研磨方法
WO2019181016A1 (ja) 2018-03-22 2019-09-26 日立化成株式会社 研磨液、研磨液セット及び研磨方法
WO2020021680A1 (ja) * 2018-07-26 2020-01-30 日立化成株式会社 スラリ及び研磨方法
JP6888744B2 (ja) 2018-09-25 2021-06-16 昭和電工マテリアルズ株式会社 スラリ及び研磨方法
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US20130143404A1 (en) 2013-06-06
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US20180251680A1 (en) 2018-09-06
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