KR101382032B1 - 전자 부품의 수지 밀봉 성형 방법 및 장치 - Google Patents

전자 부품의 수지 밀봉 성형 방법 및 장치 Download PDF

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Publication number
KR101382032B1
KR101382032B1 KR1020120068101A KR20120068101A KR101382032B1 KR 101382032 B1 KR101382032 B1 KR 101382032B1 KR 1020120068101 A KR1020120068101 A KR 1020120068101A KR 20120068101 A KR20120068101 A KR 20120068101A KR 101382032 B1 KR101382032 B1 KR 101382032B1
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KR
South Korea
Prior art keywords
resin
cavity
molding
mold
substrate
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KR1020120068101A
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English (en)
Korean (ko)
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KR20130007458A (ko
Inventor
신지 다카세
다카시 다무라
다케아키 다카
Original Assignee
토와 가부시기가이샤
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Application filed by 토와 가부시기가이샤 filed Critical 토와 가부시기가이샤
Publication of KR20130007458A publication Critical patent/KR20130007458A/ko
Application granted granted Critical
Publication of KR101382032B1 publication Critical patent/KR101382032B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
KR1020120068101A 2011-06-29 2012-06-25 전자 부품의 수지 밀봉 성형 방법 및 장치 KR101382032B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2011-144047 2011-06-29
JP2011144047A JP5468574B2 (ja) 2011-06-29 2011-06-29 電子部品の樹脂封止成形方法及び装置

Publications (2)

Publication Number Publication Date
KR20130007458A KR20130007458A (ko) 2013-01-18
KR101382032B1 true KR101382032B1 (ko) 2014-04-04

Family

ID=47395687

Family Applications (1)

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KR1020120068101A KR101382032B1 (ko) 2011-06-29 2012-06-25 전자 부품의 수지 밀봉 성형 방법 및 장치

Country Status (4)

Country Link
JP (1) JP5468574B2 (ja)
KR (1) KR101382032B1 (ja)
CN (1) CN102848515B (ja)
TW (1) TWI503901B (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6049597B2 (ja) * 2013-11-28 2016-12-21 Ｔｏｗａ株式会社 圧縮成形装置の樹脂材料供給方法及び供給機構、並びに圧縮成形方法及び圧縮成形装置
NL2016011B1 (en) 2015-12-23 2017-07-03 Besi Netherlands Bv Press, actuator set and method for encapsulating electronic components with at least two individual controllable actuators.
JP6610460B2 (ja) * 2016-07-26 2019-11-27 株式会社デンソー 電子装置、及び、電子装置の製造方法
US20190109021A1 (en) * 2016-11-11 2019-04-11 Shin-Etsu Engineering Co., Ltd. Resin-sealing device and resin-sealing method
JP7200961B2 (ja) * 2020-03-06 2023-01-10 味の素株式会社 半導体装置の製造方法、及び、樹脂シート

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09262876A (ja) * 1996-03-27 1997-10-07 Nippon Motorola Ltd 成型方法及び半導体集積回路装置用パッケージの成型方法並びに成型装置
JP2000127209A (ja) * 1998-10-26 2000-05-09 Nec Yamagata Ltd ワークの樹脂封止方法
JP2004230707A (ja) * 2003-01-30 2004-08-19 Towa Corp 電子部品の樹脂封止成形方法及び装置
KR20110005548A (ko) * 2009-07-10 2011-01-18 한미반도체 주식회사 전자부품 제조용 몰딩장치

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04147633A (ja) * 1990-10-09 1992-05-21 Nec Yamaguchi Ltd 樹脂封止用金型
JP2524955B2 (ja) * 1993-04-22 1996-08-14 トーワ株式会社 電子部品の樹脂封止成形方法及び装置
JP3407987B2 (ja) * 1994-08-18 2003-05-19 Ｔｏｗａ株式会社 樹脂封止成形用金型の保管方法及び電子部品の樹脂封止成形方法
JP3137322B2 (ja) * 1996-07-12 2001-02-19 富士通株式会社 半導体装置の製造方法及び半導体装置製造用金型及び半導体装置
JP2002043343A (ja) * 2000-07-25 2002-02-08 Mitsubishi Electric Corp 半導体装置の樹脂封止金型及び半導体装置の樹脂封止方法、並びに樹脂封止半導体装置の離型方法
JP3677763B2 (ja) * 2001-12-04 2005-08-03 株式会社サイネックス 半導体装置製造用金型
JP4059764B2 (ja) * 2002-12-26 2008-03-12 Ｎｅｃエレクトロニクス株式会社 半導体装置の製造方法
JP4373237B2 (ja) * 2004-02-13 2009-11-25 Ｔｏｗａ株式会社 半導体チップの樹脂封止成形方法および樹脂封止成形用金型
JP4794354B2 (ja) * 2006-05-23 2011-10-19 Ｏｋｉセミコンダクタ株式会社 半導体装置の製造方法
JP2008137334A (ja) * 2006-12-05 2008-06-19 Sumitomo Heavy Ind Ltd 樹脂封止装置
JP2008235489A (ja) * 2007-03-19 2008-10-02 Fujitsu Ltd 樹脂封止方法、樹脂封止用金型、及び樹脂封止装置
JP2010040992A (ja) * 2008-08-08 2010-02-18 Hitachi Ltd 電子制御装置の製造方法とそのトランスファーモールド装置および電子制御装置
JP2011014586A (ja) * 2009-06-30 2011-01-20 Asahi Engineering Kk 半導体装置の樹脂封止方法及び半導体装置の樹脂封止装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09262876A (ja) * 1996-03-27 1997-10-07 Nippon Motorola Ltd 成型方法及び半導体集積回路装置用パッケージの成型方法並びに成型装置
JP2000127209A (ja) * 1998-10-26 2000-05-09 Nec Yamagata Ltd ワークの樹脂封止方法
JP2004230707A (ja) * 2003-01-30 2004-08-19 Towa Corp 電子部品の樹脂封止成形方法及び装置
KR20110005548A (ko) * 2009-07-10 2011-01-18 한미반도체 주식회사 전자부품 제조용 몰딩장치

Also Published As

Publication number Publication date
KR20130007458A (ko) 2013-01-18
TW201301411A (zh) 2013-01-01
JP5468574B2 (ja) 2014-04-09
TWI503901B (zh) 2015-10-11
CN102848515A (zh) 2013-01-02
JP2013012573A (ja) 2013-01-17
CN102848515B (zh) 2014-10-08

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