KR101332390B1 - 접촉자 조립체 - Google Patents

접촉자 조립체 Download PDF

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Publication number
KR101332390B1
KR101332390B1 KR1020070079112A KR20070079112A KR101332390B1 KR 101332390 B1 KR101332390 B1 KR 101332390B1 KR 1020070079112 A KR1020070079112 A KR 1020070079112A KR 20070079112 A KR20070079112 A KR 20070079112A KR 101332390 B1 KR101332390 B1 KR 101332390B1
Authority
KR
South Korea
Prior art keywords
vertical probe
conductive
contact assembly
resin film
vertical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020070079112A
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English (en)
Korean (ko)
Other versions
KR20080013791A (ko
Inventor
군세이 기모토
Original Assignee
군세이 기모토
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Filing date
Publication date
Application filed by 군세이 기모토 filed Critical 군세이 기모토
Publication of KR20080013791A publication Critical patent/KR20080013791A/ko
Application granted granted Critical
Publication of KR101332390B1 publication Critical patent/KR101332390B1/ko
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06772—High frequency probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
KR1020070079112A 2006-08-07 2007-08-07 접촉자 조립체 Expired - Fee Related KR101332390B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2006-00239544 2006-08-07
JP2006239544A JP5077735B2 (ja) 2006-08-07 2006-08-07 複数梁合成型接触子組立

Publications (2)

Publication Number Publication Date
KR20080013791A KR20080013791A (ko) 2008-02-13
KR101332390B1 true KR101332390B1 (ko) 2013-11-22

Family

ID=39028522

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020070079112A Expired - Fee Related KR101332390B1 (ko) 2006-08-07 2007-08-07 접촉자 조립체

Country Status (5)

Country Link
US (1) US7423441B2 (enExample)
JP (1) JP5077735B2 (enExample)
KR (1) KR101332390B1 (enExample)
CN (1) CN101122616B (enExample)
TW (1) TW200809215A (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI397696B (zh) * 2006-02-19 2013-06-01 Gunsei Kimoto Probe assembly
JP5147227B2 (ja) * 2006-12-19 2013-02-20 株式会社日本マイクロニクス 電気的接続装置の使用方法
JP5099487B2 (ja) * 2007-08-03 2012-12-19 軍生 木本 複数梁合成型接触子
JP2011141126A (ja) * 2010-01-05 2011-07-21 Toshiba Corp プローブカード
CN102207435B (zh) * 2011-03-25 2013-06-26 宾伟雄 消除牵引力测试装置水平偏移的方法及其牵引力测试装置
US20130233099A1 (en) * 2012-03-08 2013-09-12 Gunsei Kimoto Probe assembly
KR101999720B1 (ko) * 2012-11-20 2019-07-16 삼성디스플레이 주식회사 기판 정전기 검사 장치 및 기판 제조 방법
CN103245808A (zh) * 2013-05-22 2013-08-14 太仓华众金属制品有限公司 一种悬臂式探针
CN106249006A (zh) * 2016-09-30 2016-12-21 乐依文半导体(东莞)有限公司 测试夹具及其单尾回形探针
CN107525953A (zh) * 2017-09-25 2017-12-29 惠科股份有限公司 一种探针装置
JP7292921B2 (ja) * 2019-03-29 2023-06-19 株式会社日本マイクロニクス 多ピン構造プローブ体及びプローブカード

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH075196A (ja) * 1993-06-18 1995-01-10 Fujitsu Autom Ltd プローブヘッドとプロービング方法
JPH07115110A (ja) * 1993-08-24 1995-05-02 Nobuaki Suzuki 回路基板の検査・試験用プローブとその取付構造
JP2000338133A (ja) 1999-05-31 2000-12-08 Isao Kimoto 接触子
JP2005300545A (ja) 2004-03-16 2005-10-27 Isao Kimoto 電気信号接続装置及びこれを用いたプローブ組立体並びにプローバ装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3611128A (en) * 1968-07-26 1971-10-05 Hitachi Ltd Probe header for testing integrated circuits
US4116523A (en) * 1976-01-23 1978-09-26 James M. Foster High frequency probe
US5599194A (en) * 1992-08-18 1997-02-04 Enplas Corporation IC socket and its contact pin
US6034534A (en) * 1995-05-25 2000-03-07 Kiyota; Shigeo Laminated contact probe for inspection of ultra-microscopic pitch
US6271674B1 (en) * 1999-04-07 2001-08-07 Kabushiki Kaisha Nihon Micronics Probe card
JP2002296295A (ja) * 2001-03-29 2002-10-09 Isao Kimoto 接触子組立体の接触子保持構造
US6489795B1 (en) * 2001-05-18 2002-12-03 Anthony G. Klele High-frequency test probe assembly for microcircuits and associated methods
US7449906B2 (en) * 2003-05-13 2008-11-11 Kabushiki Kaisha Nihon Micronics Probe for testing an electrical device
TWI286606B (en) * 2004-03-16 2007-09-11 Gunsei Kimoto Electric signal connecting device, and probe assembly and prober device using it
JP4521611B2 (ja) * 2004-04-09 2010-08-11 ルネサスエレクトロニクス株式会社 半導体集積回路装置の製造方法
TWI398640B (zh) * 2005-09-19 2013-06-11 Gunsei Kimoto Contact assembly and its LSI wafer inspection device
TWI397696B (zh) * 2006-02-19 2013-06-01 Gunsei Kimoto Probe assembly

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH075196A (ja) * 1993-06-18 1995-01-10 Fujitsu Autom Ltd プローブヘッドとプロービング方法
JPH07115110A (ja) * 1993-08-24 1995-05-02 Nobuaki Suzuki 回路基板の検査・試験用プローブとその取付構造
JP2000338133A (ja) 1999-05-31 2000-12-08 Isao Kimoto 接触子
JP2005300545A (ja) 2004-03-16 2005-10-27 Isao Kimoto 電気信号接続装置及びこれを用いたプローブ組立体並びにプローバ装置

Also Published As

Publication number Publication date
US7423441B2 (en) 2008-09-09
JP2008039754A (ja) 2008-02-21
JP5077735B2 (ja) 2012-11-21
KR20080013791A (ko) 2008-02-13
US20080030216A1 (en) 2008-02-07
CN101122616B (zh) 2012-07-04
TWI339266B (enExample) 2011-03-21
CN101122616A (zh) 2008-02-13
TW200809215A (en) 2008-02-16

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