JP5077735B2 - 複数梁合成型接触子組立 - Google Patents

複数梁合成型接触子組立 Download PDF

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Publication number
JP5077735B2
JP5077735B2 JP2006239544A JP2006239544A JP5077735B2 JP 5077735 B2 JP5077735 B2 JP 5077735B2 JP 2006239544 A JP2006239544 A JP 2006239544A JP 2006239544 A JP2006239544 A JP 2006239544A JP 5077735 B2 JP5077735 B2 JP 5077735B2
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JP
Japan
Prior art keywords
vertical probe
resin film
probe
conductive
dummy
Prior art date
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Expired - Fee Related
Application number
JP2006239544A
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English (en)
Japanese (ja)
Other versions
JP2008039754A (ja
Inventor
軍生 木本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
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Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP2006239544A priority Critical patent/JP5077735B2/ja
Priority to TW096125294A priority patent/TW200809215A/zh
Priority to US11/888,563 priority patent/US7423441B2/en
Priority to CN200710143125XA priority patent/CN101122616B/zh
Priority to KR1020070079112A priority patent/KR101332390B1/ko
Publication of JP2008039754A publication Critical patent/JP2008039754A/ja
Application granted granted Critical
Publication of JP5077735B2 publication Critical patent/JP5077735B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06772—High frequency probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
JP2006239544A 2006-08-07 2006-08-07 複数梁合成型接触子組立 Expired - Fee Related JP5077735B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2006239544A JP5077735B2 (ja) 2006-08-07 2006-08-07 複数梁合成型接触子組立
TW096125294A TW200809215A (en) 2006-08-07 2007-07-11 Contactor assembly
US11/888,563 US7423441B2 (en) 2006-08-07 2007-08-01 Contactor assembly
CN200710143125XA CN101122616B (zh) 2006-08-07 2007-08-06 探针组合体
KR1020070079112A KR101332390B1 (ko) 2006-08-07 2007-08-07 접촉자 조립체

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006239544A JP5077735B2 (ja) 2006-08-07 2006-08-07 複数梁合成型接触子組立

Publications (2)

Publication Number Publication Date
JP2008039754A JP2008039754A (ja) 2008-02-21
JP5077735B2 true JP5077735B2 (ja) 2012-11-21

Family

ID=39028522

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006239544A Expired - Fee Related JP5077735B2 (ja) 2006-08-07 2006-08-07 複数梁合成型接触子組立

Country Status (5)

Country Link
US (1) US7423441B2 (enExample)
JP (1) JP5077735B2 (enExample)
KR (1) KR101332390B1 (enExample)
CN (1) CN101122616B (enExample)
TW (1) TW200809215A (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI397696B (zh) * 2006-02-19 2013-06-01 Gunsei Kimoto Probe assembly
JP5147227B2 (ja) * 2006-12-19 2013-02-20 株式会社日本マイクロニクス 電気的接続装置の使用方法
JP5099487B2 (ja) * 2007-08-03 2012-12-19 軍生 木本 複数梁合成型接触子
JP2011141126A (ja) * 2010-01-05 2011-07-21 Toshiba Corp プローブカード
CN102207435B (zh) * 2011-03-25 2013-06-26 宾伟雄 消除牵引力测试装置水平偏移的方法及其牵引力测试装置
US20130233099A1 (en) * 2012-03-08 2013-09-12 Gunsei Kimoto Probe assembly
KR101999720B1 (ko) * 2012-11-20 2019-07-16 삼성디스플레이 주식회사 기판 정전기 검사 장치 및 기판 제조 방법
CN103245808A (zh) * 2013-05-22 2013-08-14 太仓华众金属制品有限公司 一种悬臂式探针
CN106249006A (zh) * 2016-09-30 2016-12-21 乐依文半导体(东莞)有限公司 测试夹具及其单尾回形探针
CN107525953A (zh) * 2017-09-25 2017-12-29 惠科股份有限公司 一种探针装置
JP7292921B2 (ja) * 2019-03-29 2023-06-19 株式会社日本マイクロニクス 多ピン構造プローブ体及びプローブカード

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3611128A (en) * 1968-07-26 1971-10-05 Hitachi Ltd Probe header for testing integrated circuits
US4116523A (en) * 1976-01-23 1978-09-26 James M. Foster High frequency probe
US5599194A (en) * 1992-08-18 1997-02-04 Enplas Corporation IC socket and its contact pin
JPH075196A (ja) * 1993-06-18 1995-01-10 Fujitsu Autom Ltd プローブヘッドとプロービング方法
JP3762444B2 (ja) * 1993-08-24 2006-04-05 信昭 鈴木 回路基板の検査用プローブとその取付構造
US6034534A (en) * 1995-05-25 2000-03-07 Kiyota; Shigeo Laminated contact probe for inspection of ultra-microscopic pitch
US6271674B1 (en) * 1999-04-07 2001-08-07 Kabushiki Kaisha Nihon Micronics Probe card
JP2000338133A (ja) * 1999-05-31 2000-12-08 Isao Kimoto 接触子
JP2002296295A (ja) * 2001-03-29 2002-10-09 Isao Kimoto 接触子組立体の接触子保持構造
US6489795B1 (en) * 2001-05-18 2002-12-03 Anthony G. Klele High-frequency test probe assembly for microcircuits and associated methods
US7449906B2 (en) * 2003-05-13 2008-11-11 Kabushiki Kaisha Nihon Micronics Probe for testing an electrical device
TWI286606B (en) * 2004-03-16 2007-09-11 Gunsei Kimoto Electric signal connecting device, and probe assembly and prober device using it
JP4721099B2 (ja) * 2004-03-16 2011-07-13 軍生 木本 電気信号接続装置及びこれを用いたプローブ組立体並びにプローバ装置
JP4521611B2 (ja) * 2004-04-09 2010-08-11 ルネサスエレクトロニクス株式会社 半導体集積回路装置の製造方法
TWI398640B (zh) * 2005-09-19 2013-06-11 Gunsei Kimoto Contact assembly and its LSI wafer inspection device
TWI397696B (zh) * 2006-02-19 2013-06-01 Gunsei Kimoto Probe assembly

Also Published As

Publication number Publication date
US7423441B2 (en) 2008-09-09
JP2008039754A (ja) 2008-02-21
KR20080013791A (ko) 2008-02-13
US20080030216A1 (en) 2008-02-07
CN101122616B (zh) 2012-07-04
TWI339266B (enExample) 2011-03-21
CN101122616A (zh) 2008-02-13
KR101332390B1 (ko) 2013-11-22
TW200809215A (en) 2008-02-16

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