TW200809215A - Contactor assembly - Google Patents
Contactor assembly Download PDFInfo
- Publication number
- TW200809215A TW200809215A TW096125294A TW96125294A TW200809215A TW 200809215 A TW200809215 A TW 200809215A TW 096125294 A TW096125294 A TW 096125294A TW 96125294 A TW96125294 A TW 96125294A TW 200809215 A TW200809215 A TW 200809215A
- Authority
- TW
- Taiwan
- Prior art keywords
- probe
- probe assembly
- vertical
- conductive
- parallel
- Prior art date
Links
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06772—High frequency probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Geometry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006239544A JP5077735B2 (ja) | 2006-08-07 | 2006-08-07 | 複数梁合成型接触子組立 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200809215A true TW200809215A (en) | 2008-02-16 |
| TWI339266B TWI339266B (enExample) | 2011-03-21 |
Family
ID=39028522
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW096125294A TW200809215A (en) | 2006-08-07 | 2007-07-11 | Contactor assembly |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US7423441B2 (enExample) |
| JP (1) | JP5077735B2 (enExample) |
| KR (1) | KR101332390B1 (enExample) |
| CN (1) | CN101122616B (enExample) |
| TW (1) | TW200809215A (enExample) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI397696B (zh) * | 2006-02-19 | 2013-06-01 | Gunsei Kimoto | Probe assembly |
| JP5147227B2 (ja) * | 2006-12-19 | 2013-02-20 | 株式会社日本マイクロニクス | 電気的接続装置の使用方法 |
| JP5099487B2 (ja) * | 2007-08-03 | 2012-12-19 | 軍生 木本 | 複数梁合成型接触子 |
| JP2011141126A (ja) * | 2010-01-05 | 2011-07-21 | Toshiba Corp | プローブカード |
| CN102207435B (zh) * | 2011-03-25 | 2013-06-26 | 宾伟雄 | 消除牵引力测试装置水平偏移的方法及其牵引力测试装置 |
| US20130233099A1 (en) * | 2012-03-08 | 2013-09-12 | Gunsei Kimoto | Probe assembly |
| KR101999720B1 (ko) * | 2012-11-20 | 2019-07-16 | 삼성디스플레이 주식회사 | 기판 정전기 검사 장치 및 기판 제조 방법 |
| CN103245808A (zh) * | 2013-05-22 | 2013-08-14 | 太仓华众金属制品有限公司 | 一种悬臂式探针 |
| CN106249006A (zh) * | 2016-09-30 | 2016-12-21 | 乐依文半导体(东莞)有限公司 | 测试夹具及其单尾回形探针 |
| CN107525953A (zh) * | 2017-09-25 | 2017-12-29 | 惠科股份有限公司 | 一种探针装置 |
| JP7292921B2 (ja) * | 2019-03-29 | 2023-06-19 | 株式会社日本マイクロニクス | 多ピン構造プローブ体及びプローブカード |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3611128A (en) * | 1968-07-26 | 1971-10-05 | Hitachi Ltd | Probe header for testing integrated circuits |
| US4116523A (en) * | 1976-01-23 | 1978-09-26 | James M. Foster | High frequency probe |
| US5599194A (en) * | 1992-08-18 | 1997-02-04 | Enplas Corporation | IC socket and its contact pin |
| JPH075196A (ja) * | 1993-06-18 | 1995-01-10 | Fujitsu Autom Ltd | プローブヘッドとプロービング方法 |
| JP3762444B2 (ja) * | 1993-08-24 | 2006-04-05 | 信昭 鈴木 | 回路基板の検査用プローブとその取付構造 |
| US6034534A (en) * | 1995-05-25 | 2000-03-07 | Kiyota; Shigeo | Laminated contact probe for inspection of ultra-microscopic pitch |
| US6271674B1 (en) * | 1999-04-07 | 2001-08-07 | Kabushiki Kaisha Nihon Micronics | Probe card |
| JP2000338133A (ja) * | 1999-05-31 | 2000-12-08 | Isao Kimoto | 接触子 |
| JP2002296295A (ja) * | 2001-03-29 | 2002-10-09 | Isao Kimoto | 接触子組立体の接触子保持構造 |
| US6489795B1 (en) * | 2001-05-18 | 2002-12-03 | Anthony G. Klele | High-frequency test probe assembly for microcircuits and associated methods |
| US7449906B2 (en) * | 2003-05-13 | 2008-11-11 | Kabushiki Kaisha Nihon Micronics | Probe for testing an electrical device |
| TWI286606B (en) * | 2004-03-16 | 2007-09-11 | Gunsei Kimoto | Electric signal connecting device, and probe assembly and prober device using it |
| JP4721099B2 (ja) * | 2004-03-16 | 2011-07-13 | 軍生 木本 | 電気信号接続装置及びこれを用いたプローブ組立体並びにプローバ装置 |
| JP4521611B2 (ja) * | 2004-04-09 | 2010-08-11 | ルネサスエレクトロニクス株式会社 | 半導体集積回路装置の製造方法 |
| TWI398640B (zh) * | 2005-09-19 | 2013-06-11 | Gunsei Kimoto | Contact assembly and its LSI wafer inspection device |
| TWI397696B (zh) * | 2006-02-19 | 2013-06-01 | Gunsei Kimoto | Probe assembly |
-
2006
- 2006-08-07 JP JP2006239544A patent/JP5077735B2/ja not_active Expired - Fee Related
-
2007
- 2007-07-11 TW TW096125294A patent/TW200809215A/zh not_active IP Right Cessation
- 2007-08-01 US US11/888,563 patent/US7423441B2/en not_active Expired - Fee Related
- 2007-08-06 CN CN200710143125XA patent/CN101122616B/zh not_active Expired - Fee Related
- 2007-08-07 KR KR1020070079112A patent/KR101332390B1/ko not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| US7423441B2 (en) | 2008-09-09 |
| JP2008039754A (ja) | 2008-02-21 |
| JP5077735B2 (ja) | 2012-11-21 |
| KR20080013791A (ko) | 2008-02-13 |
| US20080030216A1 (en) | 2008-02-07 |
| CN101122616B (zh) | 2012-07-04 |
| TWI339266B (enExample) | 2011-03-21 |
| CN101122616A (zh) | 2008-02-13 |
| KR101332390B1 (ko) | 2013-11-22 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |