KR101249479B1 - 수지 조성물 및 그 수지 조성물을 이용하여 얻어진 수지부착 동박 - Google Patents

수지 조성물 및 그 수지 조성물을 이용하여 얻어진 수지부착 동박 Download PDF

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Publication number
KR101249479B1
KR101249479B1 KR1020097026807A KR20097026807A KR101249479B1 KR 101249479 B1 KR101249479 B1 KR 101249479B1 KR 1020097026807 A KR1020097026807 A KR 1020097026807A KR 20097026807 A KR20097026807 A KR 20097026807A KR 101249479 B1 KR101249479 B1 KR 101249479B1
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South Korea
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component
weight
resin
parts
resin composition
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KR1020097026807A
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Korean (ko)
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KR20100024949A (ko
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테츠로 사토
토시후미 마츠시마
테츠히로 마츠나가
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미쓰이 긴조꾸 고교 가부시키가이샤
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/56—Amines together with other curing agents
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/012—Flame-retardant; Preventing of inflammation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0358—Resin coated copper [RCC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Epoxy Resins (AREA)
KR1020097026807A 2007-06-25 2008-06-25 수지 조성물 및 그 수지 조성물을 이용하여 얻어진 수지부착 동박 KR101249479B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2007-166869 2007-06-25
JP2007166869 2007-06-25
PCT/JP2008/061529 WO2009001850A1 (ja) 2007-06-25 2008-06-25 樹脂組成物及びその樹脂組成物を用いて得られる樹脂付銅箔

Publications (2)

Publication Number Publication Date
KR20100024949A KR20100024949A (ko) 2010-03-08
KR101249479B1 true KR101249479B1 (ko) 2013-03-29

Family

ID=40185663

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020097026807A KR101249479B1 (ko) 2007-06-25 2008-06-25 수지 조성물 및 그 수지 조성물을 이용하여 얻어진 수지부착 동박

Country Status (6)

Country Link
JP (1) JP5650908B2 (zh)
KR (1) KR101249479B1 (zh)
CN (1) CN101687981B (zh)
MY (1) MY150635A (zh)
TW (1) TW200916525A (zh)
WO (1) WO2009001850A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150072904A (ko) * 2013-12-20 2015-06-30 엘지이노텍 주식회사 액정 고분자 수지 조성물 및 이를 이용한 절연층을 포함하는 인쇄 회로 기판

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KR101439496B1 (ko) * 2009-12-22 2014-09-12 에스케이이노베이션 주식회사 폴리아믹산 수지 조성물과 이의 제조방법 및 이를 이용한 폴리이미드 금속적층체
JP5491295B2 (ja) * 2010-06-25 2014-05-14 パナソニック株式会社 半導体封止用エポキシ樹脂組成物とそれを用いた半導体装置
JP5580135B2 (ja) * 2010-08-03 2014-08-27 三井金属鉱業株式会社 プリント配線板の製造方法及びプリント配線板
CN102504197B (zh) * 2011-10-10 2013-08-21 北京新福润达绝缘材料有限责任公司 具有高耐漏电起痕指数的无卤环氧树脂组合物及其应用
CN102585440B (zh) * 2012-01-16 2013-09-04 广州宏仁电子工业有限公司 用于覆铜箔基板的高cti值无卤阻燃型树脂组合物
CN102585663B (zh) * 2012-02-06 2013-11-20 苏州太湖电工新材料股份有限公司 一种电机用无卤阻燃耐高温绝缘漆
WO2014106955A1 (ja) * 2013-01-07 2014-07-10 株式会社ニコン 組成物、積層体、積層体の製造方法、トランジスタおよびトランジスタの製造方法
US9955583B2 (en) 2013-07-23 2018-04-24 Jx Nippon Mining & Metals Corporation Surface-treated copper foil, copper foil with carrier, substrate, resin substrate, printed wiring board, copper clad laminate and method for producing printed wiring board
WO2015012376A1 (ja) 2013-07-24 2015-01-29 Jx日鉱日石金属株式会社 表面処理銅箔、キャリア付銅箔、基材、樹脂基材、プリント配線板、銅張積層板及びプリント配線板の製造方法
KR102135414B1 (ko) * 2013-12-20 2020-07-17 엘지이노텍 주식회사 액정 고분자 수지 조성물 및 이를 이용한 절연층을 포함하는 인쇄 회로 기판
KR102172298B1 (ko) * 2014-03-17 2020-10-30 엘지이노텍 주식회사 에폭시 수지 조성물 및 이를 이용한 절연층을 포함하는 인쇄회로기판
KR102172297B1 (ko) * 2014-04-17 2020-10-30 엘지이노텍 주식회사 에폭시 수지 조성물 및 이를 이용한 절연층을 포함하는 인쇄회로기판
JP6640567B2 (ja) 2015-01-16 2020-02-05 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板、電子機器の製造方法及びプリント配線板の製造方法
KR101852671B1 (ko) 2015-01-21 2018-06-04 제이엑스금속주식회사 캐리어 부착 동박, 적층체, 프린트 배선판, 및, 프린트 배선판의 제조 방법
KR101942621B1 (ko) 2015-02-06 2019-01-25 제이엑스금속주식회사 캐리어 부착 동박, 적층체, 프린트 배선판, 전자 기기 및 프린트 배선판의 제조 방법
WO2017161120A1 (en) * 2016-03-17 2017-09-21 Qed Labs Inc. Articles with improved flame retardancy and/or melt dripping properties
JP2017193778A (ja) 2016-04-15 2017-10-26 Ｊｘ金属株式会社 銅箔、高周波回路用銅箔、キャリア付銅箔、高周波回路用キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
JP7312931B2 (ja) * 2016-09-28 2023-07-24 東特塗料株式会社 電気絶縁電線
CN106564240B (zh) * 2016-11-07 2018-08-31 北京新福润达绝缘材料有限责任公司 一种高耐漏电起痕玻璃毡层压板的制备方法

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JPH08193188A (ja) * 1995-01-18 1996-07-30 Mitsui Mining & Smelting Co Ltd 銅箔用接着剤および該接着剤付き銅箔
JP2001181593A (ja) 1999-12-28 2001-07-03 Kashima Oil Co Ltd 熱硬化性接着剤及びそれを用いたフレキシブルプリント配線板材料
JP2005213352A (ja) 2004-01-29 2005-08-11 Arisawa Mfg Co Ltd プリプレグ用樹脂組成物およびこれを用いたプリプレグ
JP2007099956A (ja) 2005-10-06 2007-04-19 Tamura Kaken Co Ltd 熱硬化性樹脂組成物、樹脂フィルムおよび構造体

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JPH11186723A (ja) * 1997-12-25 1999-07-09 Sumitomo Bakelite Co Ltd 多層プリント配線板の製造方法
JPH11186724A (ja) * 1997-12-25 1999-07-09 Sumitomo Bakelite Co Ltd 多層プリント配線板の製造方法
JP3533973B2 (ja) * 1998-01-27 2004-06-07 東都化成株式会社 リン含有エポキシ樹脂組成物
JP3708423B2 (ja) * 2000-10-20 2005-10-19 株式会社日鉱マテリアルズ エポキシ樹脂用フェノール系硬化剤及びそれを用いたエポキシ樹脂組成物
JP2005132925A (ja) * 2003-10-29 2005-05-26 Matsushita Electric Works Ltd エポキシ樹脂組成物、それを用いたプリプレグ、金属箔張積層板、及び金属箔付き樹脂シート
JP2005314449A (ja) * 2004-04-27 2005-11-10 Nikko Materials Co Ltd 樹脂用添加剤
JP4732001B2 (ja) * 2005-05-26 2011-07-27 株式会社タムラ製作所 ビルドアップ基板層間絶縁材料用熱硬化性樹脂組成物、樹脂フィルム、フィルム付き製品およびビルドアップ基板の層間絶縁材料

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08193188A (ja) * 1995-01-18 1996-07-30 Mitsui Mining & Smelting Co Ltd 銅箔用接着剤および該接着剤付き銅箔
JP2001181593A (ja) 1999-12-28 2001-07-03 Kashima Oil Co Ltd 熱硬化性接着剤及びそれを用いたフレキシブルプリント配線板材料
JP2005213352A (ja) 2004-01-29 2005-08-11 Arisawa Mfg Co Ltd プリプレグ用樹脂組成物およびこれを用いたプリプレグ
JP2007099956A (ja) 2005-10-06 2007-04-19 Tamura Kaken Co Ltd 熱硬化性樹脂組成物、樹脂フィルムおよび構造体

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150072904A (ko) * 2013-12-20 2015-06-30 엘지이노텍 주식회사 액정 고분자 수지 조성물 및 이를 이용한 절연층을 포함하는 인쇄 회로 기판
KR102113190B1 (ko) * 2013-12-20 2020-05-20 엘지이노텍 주식회사 액정 고분자 수지 조성물 및 이를 이용한 절연층을 포함하는 인쇄 회로 기판

Also Published As

Publication number Publication date
CN101687981A (zh) 2010-03-31
WO2009001850A1 (ja) 2008-12-31
JPWO2009001850A1 (ja) 2010-08-26
CN101687981B (zh) 2012-04-04
KR20100024949A (ko) 2010-03-08
TW200916525A (en) 2009-04-16
TWI374909B (zh) 2012-10-21
JP5650908B2 (ja) 2015-01-07
MY150635A (en) 2014-02-14

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