KR101166634B1 - 접착 필름 및 웨이퍼 가공용 테이프 - Google Patents

접착 필름 및 웨이퍼 가공용 테이프 Download PDF

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Publication number
KR101166634B1
KR101166634B1 KR1020100035055A KR20100035055A KR101166634B1 KR 101166634 B1 KR101166634 B1 KR 101166634B1 KR 1020100035055 A KR1020100035055 A KR 1020100035055A KR 20100035055 A KR20100035055 A KR 20100035055A KR 101166634 B1 KR101166634 B1 KR 101166634B1
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South Korea
Prior art keywords
adhesive
layer
film
bond layer
gmin
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KR1020100035055A
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Korean (ko)
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KR20100115313A (ko
Inventor
구니히꼬 이시구로
신이찌 이시와따
야스마사 모리시마
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후루카와 덴키 고교 가부시키가이샤
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Publication of KR20100115313A publication Critical patent/KR20100115313A/ko
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors

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  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Dicing (AREA)
  • Die Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Laminated Bodies (AREA)
KR1020100035055A 2009-04-17 2010-04-16 접착 필름 및 웨이퍼 가공용 테이프 Active KR101166634B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009100583 2009-04-17
JPJP-P-2009-100583 2009-04-17

Publications (2)

Publication Number Publication Date
KR20100115313A KR20100115313A (ko) 2010-10-27
KR101166634B1 true KR101166634B1 (ko) 2012-07-18

Family

ID=42956185

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020100035055A Active KR101166634B1 (ko) 2009-04-17 2010-04-16 접착 필름 및 웨이퍼 가공용 테이프

Country Status (4)

Country Link
JP (1) JP5520673B2 (https=)
KR (1) KR101166634B1 (https=)
CN (1) CN101864249A (https=)
TW (1) TW201043674A (https=)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013021945A1 (ja) * 2011-08-05 2013-02-14 電気化学工業株式会社 仮固定用接着剤組成物
DE102012001346A1 (de) * 2012-01-24 2013-07-25 Giesecke & Devrient Gmbh Verfahren zum Herstellen eines Datenträgers
JP6033116B2 (ja) * 2013-02-22 2016-11-30 株式会社ディスコ 積層ウェーハの加工方法および粘着シート
JP5373215B1 (ja) * 2013-03-28 2013-12-18 日東電工株式会社 システム、製造条件決定装置および製造管理装置
JP5603453B1 (ja) * 2013-04-26 2014-10-08 古河電気工業株式会社 半導体ウェハ保護用粘着テープ
EP3543306B1 (en) 2016-11-18 2025-09-10 Furukawa Electric Co., Ltd. Joining film, tape for wafer processing, method for producing joined body, and joined body
CN109642123B (zh) 2016-12-21 2021-07-02 古河电气工业株式会社 接合膜及晶圆加工用带
JP6917166B2 (ja) * 2017-03-15 2021-08-11 マクセルホールディングス株式会社 ダイシング用粘着テープ、ダイシング用粘着テープの製造方法、および半導体チップの製造方法
WO2018216732A1 (ja) * 2017-05-24 2018-11-29 日産化学株式会社 エポキシ変性ポリシロキサンを含有する仮接着剤
KR102144950B1 (ko) * 2017-09-29 2020-08-14 주식회사 엘지화학 점착 조성물 및 점착 필름
JP7035347B2 (ja) * 2017-10-05 2022-03-15 昭和電工マテリアルズ株式会社 半導体加工用テープ
MY205061A (en) 2019-07-16 2024-09-30 Furukawa Electric Co Ltd Bonding film, tape for wafer processing, method for producing bonded body, and bonded body and pasted body
WO2022024408A1 (ja) * 2020-07-30 2022-02-03 古河電気工業株式会社 半導体加工用テープ
CN116014360A (zh) * 2023-01-03 2023-04-25 蜂巢能源科技股份有限公司 一种复合隔膜及其制备方法和应用
WO2025084363A1 (ja) * 2023-10-20 2025-04-24 株式会社レゾナック フィルム状接着剤、ダイシング・ダイボンディング一体型フィルム、並びに半導体装置及びその製造方法
WO2025083909A1 (ja) * 2023-10-20 2025-04-24 株式会社レゾナック フィルム状接着剤、ダイシング・ダイボンディング一体型フィルム、並びに半導体装置及びその製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004043762A (ja) 2001-08-27 2004-02-12 Hitachi Chem Co Ltd 接着シート並びに半導体装置及びその製造方法
JP2004186398A (ja) 2002-12-03 2004-07-02 Mitsui Chemicals Inc ウエハ加工用粘着テープ
JP2007126622A (ja) 2005-10-06 2007-05-24 Hitachi Chem Co Ltd 接着シート、半導体装置及び半導体装置の製造方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3572653B2 (ja) * 1994-02-03 2004-10-06 住友電気工業株式会社 フレキシブル印刷配線板用接着剤組成物
JP2000248026A (ja) * 1999-02-26 2000-09-12 Hitachi Chem Co Ltd アクリル樹脂とこれを用いた接着剤及び接着フィルム並びにアクリル樹脂の製造法
JP4607270B2 (ja) * 1999-11-24 2011-01-05 日東電工株式会社 熱硬化型接着剤とその接着シ―ト類
JP2002371262A (ja) * 2001-06-14 2002-12-26 Nitto Denko Corp ウエハ加工用粘着シート用粘着剤およびウエハ加工用粘着シート
JP2003105279A (ja) * 2001-09-28 2003-04-09 Sliontec Corp 光感応性両面粘着テープ・シート及びその製造方法
JP3966808B2 (ja) * 2002-12-03 2007-08-29 古河電気工業株式会社 粘接着テープ
JP2004221336A (ja) * 2003-01-15 2004-08-05 Hitachi Chem Co Ltd ダイボンドダイシング一体型フィルム
JP4283596B2 (ja) * 2003-05-29 2009-06-24 日東電工株式会社 チップ状ワークの固定方法
JP4712468B2 (ja) * 2004-11-30 2011-06-29 古河電気工業株式会社 ダイシングダイボンドテープ
JP4780653B2 (ja) * 2005-02-21 2011-09-28 日東電工株式会社 半導体装置の製造方法
JP4748518B2 (ja) * 2005-07-20 2011-08-17 古河電気工業株式会社 ダイシングダイボンドテープおよびダイシングテープ
JP4800694B2 (ja) * 2005-07-26 2011-10-26 日東電工株式会社 ダイシング・ダイボンドフィルム
JP4380684B2 (ja) * 2006-10-20 2009-12-09 住友ベークライト株式会社 半導体用接着フィルム、ダイシングフィルムおよび半導体装置
JP4430085B2 (ja) * 2007-03-01 2010-03-10 日東電工株式会社 ダイシング・ダイボンドフィルム
JP2010171402A (ja) * 2008-12-24 2010-08-05 Nitto Denko Corp 熱硬化型ダイボンドフィルム

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004043762A (ja) 2001-08-27 2004-02-12 Hitachi Chem Co Ltd 接着シート並びに半導体装置及びその製造方法
JP2004186398A (ja) 2002-12-03 2004-07-02 Mitsui Chemicals Inc ウエハ加工用粘着テープ
JP2007126622A (ja) 2005-10-06 2007-05-24 Hitachi Chem Co Ltd 接着シート、半導体装置及び半導体装置の製造方法

Also Published As

Publication number Publication date
CN101864249A (zh) 2010-10-20
TW201043674A (en) 2010-12-16
KR20100115313A (ko) 2010-10-27
JP2010265453A (ja) 2010-11-25
TWI361211B (https=) 2012-04-01
JP5520673B2 (ja) 2014-06-11

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