KR101126865B1 - 도포 현상 장치 및 그 방법 - Google Patents

도포 현상 장치 및 그 방법 Download PDF

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Publication number
KR101126865B1
KR101126865B1 KR1020060005910A KR20060005910A KR101126865B1 KR 101126865 B1 KR101126865 B1 KR 101126865B1 KR 1020060005910 A KR1020060005910 A KR 1020060005910A KR 20060005910 A KR20060005910 A KR 20060005910A KR 101126865 B1 KR101126865 B1 KR 101126865B1
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KR
South Korea
Prior art keywords
unit
block
substrate
coating
film
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Expired - Lifetime
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KR1020060005910A
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English (en)
Korean (ko)
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KR20060085188A (ko
Inventor
마사미 아키모토
신이치 하야시
야스시 하야시다
노부아키 마츠오카
요시오 키무라
이세이 우에다
히카루 이토
Original Assignee
도쿄엘렉트론가부시키가이샤
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Application filed by 도쿄엘렉트론가부시키가이샤 filed Critical 도쿄엘렉트론가부시키가이샤
Publication of KR20060085188A publication Critical patent/KR20060085188A/ko
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0448—Apparatus for applying a liquid, a resin, an ink or the like
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/3042—Imagewise removal using liquid means from printing plates transported horizontally through the processing stations
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0458—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers vertical arrangement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0461—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the presence of two or more transfer chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0462—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Coating Apparatus (AREA)
  • Non-Silver Salt Photosensitive Materials And Non-Silver Salt Photography (AREA)
KR1020060005910A 2005-01-21 2006-01-19 도포 현상 장치 및 그 방법 Expired - Lifetime KR101126865B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JPJP-P-2005-00014715 2005-01-21
JP2005014715 2005-01-21
JPJP-P-2005-00294567 2005-10-07
JP2005294567A JP4955976B2 (ja) 2005-01-21 2005-10-07 塗布、現像装置及びその方法

Related Child Applications (3)

Application Number Title Priority Date Filing Date
KR1020110106342A Division KR101220623B1 (ko) 2005-01-21 2011-10-18 도포 현상 장치
KR1020110106340A Division KR101258781B1 (ko) 2005-01-21 2011-10-18 도포 현상 장치
KR1020110106232A Division KR101200155B1 (ko) 2005-01-21 2011-10-18 도포 현상 장치 및 기판 처리 장치

Publications (2)

Publication Number Publication Date
KR20060085188A KR20060085188A (ko) 2006-07-26
KR101126865B1 true KR101126865B1 (ko) 2012-03-23

Family

ID=35708779

Family Applications (4)

Application Number Title Priority Date Filing Date
KR1020060005910A Expired - Lifetime KR101126865B1 (ko) 2005-01-21 2006-01-19 도포 현상 장치 및 그 방법
KR1020110106342A Ceased KR101220623B1 (ko) 2005-01-21 2011-10-18 도포 현상 장치
KR1020110106232A Expired - Lifetime KR101200155B1 (ko) 2005-01-21 2011-10-18 도포 현상 장치 및 기판 처리 장치
KR1020110106340A Ceased KR101258781B1 (ko) 2005-01-21 2011-10-18 도포 현상 장치

Family Applications After (3)

Application Number Title Priority Date Filing Date
KR1020110106342A Ceased KR101220623B1 (ko) 2005-01-21 2011-10-18 도포 현상 장치
KR1020110106232A Expired - Lifetime KR101200155B1 (ko) 2005-01-21 2011-10-18 도포 현상 장치 및 기판 처리 장치
KR1020110106340A Ceased KR101258781B1 (ko) 2005-01-21 2011-10-18 도포 현상 장치

Country Status (6)

Country Link
US (1) US7241061B2 (https=)
EP (1) EP1684334B1 (https=)
JP (1) JP4955976B2 (https=)
KR (4) KR101126865B1 (https=)
SG (1) SG124385A1 (https=)
TW (1) TWI326805B (https=)

Cited By (1)

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Publication number Priority date Publication date Assignee Title
US8289496B2 (en) 2009-01-30 2012-10-16 Semes Co., Ltd. System and method for treating substrate

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JP4677987B2 (ja) * 2004-07-21 2011-04-27 株式会社ニコン 露光方法及びデバイス製造方法
JP4459831B2 (ja) * 2005-02-01 2010-04-28 東京エレクトロン株式会社 塗布、現像装置
JP4685584B2 (ja) 2005-03-11 2011-05-18 東京エレクトロン株式会社 塗布、現像装置
JP4566035B2 (ja) * 2005-03-11 2010-10-20 東京エレクトロン株式会社 塗布、現像装置及びその方法
JP4519037B2 (ja) * 2005-08-31 2010-08-04 東京エレクトロン株式会社 加熱装置及び塗布、現像装置
KR101364583B1 (ko) * 2006-12-18 2014-02-18 위순임 기판 처리 시스템
JP4999415B2 (ja) * 2006-09-29 2012-08-15 東京エレクトロン株式会社 基板処理装置及び基板処理方法並びに基板処理装置の用力供給装置及び基板処理装置の用力供給方法
JP5132920B2 (ja) * 2006-11-22 2013-01-30 東京エレクトロン株式会社 塗布・現像装置および基板搬送方法、ならびにコンピュータプログラム
JP2008198820A (ja) * 2007-02-14 2008-08-28 Tokyo Electron Ltd 基板処理方法及び基板処理装置
JP4924187B2 (ja) * 2007-04-27 2012-04-25 東京エレクトロン株式会社 現像装置、現像方法及び塗布、現像装置並びに記憶媒体
JP4924186B2 (ja) * 2007-04-27 2012-04-25 東京エレクトロン株式会社 塗布、現像装置及びその方法並びに記憶媒体
JP4877075B2 (ja) * 2007-05-29 2012-02-15 東京エレクトロン株式会社 塗布、現像装置及び塗布、現像装置の運転方法並びに記憶媒体
KR100897850B1 (ko) * 2007-06-18 2009-05-15 세메스 주식회사 기판 처리 장치
WO2008156366A1 (en) * 2007-06-21 2008-12-24 Asml Netherlands B.V. Clamping device and object loading method
JP5006122B2 (ja) 2007-06-29 2012-08-22 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP5128918B2 (ja) 2007-11-30 2013-01-23 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP5318403B2 (ja) * 2007-11-30 2013-10-16 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP5001828B2 (ja) 2007-12-28 2012-08-15 株式会社Ｓｏｋｕｄｏ 基板処理装置
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JP2009231624A (ja) * 2008-03-24 2009-10-08 Sokudo Co Ltd 基板処理装置
JP5280141B2 (ja) * 2008-09-30 2013-09-04 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP2010192623A (ja) * 2009-02-17 2010-09-02 Renesas Electronics Corp 半導体装置の製造装置、その制御方法、及びその制御プログラム
JP4756076B2 (ja) 2009-02-24 2011-08-24 東京エレクトロン株式会社 基板処理システム
JP5635452B2 (ja) * 2010-07-02 2014-12-03 東京エレクトロン株式会社 基板処理システム
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JP5713081B2 (ja) * 2010-07-09 2015-05-07 東京エレクトロン株式会社 塗布、現像装置
JP5454407B2 (ja) * 2010-07-23 2014-03-26 東京エレクトロン株式会社 液処理装置及び液処理方法
JP2012080077A (ja) * 2010-09-06 2012-04-19 Tokyo Electron Ltd 基板処理装置及び基板処理方法
JP5616205B2 (ja) * 2010-11-29 2014-10-29 東京エレクトロン株式会社 基板処理システム、基板処理方法、プログラム及びコンピュータ記憶媒体
JP5287913B2 (ja) * 2011-03-18 2013-09-11 東京エレクトロン株式会社 塗布、現像装置、塗布、現像方法及び記憶媒体
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8289496B2 (en) 2009-01-30 2012-10-16 Semes Co., Ltd. System and method for treating substrate
US9059224B2 (en) 2009-01-30 2015-06-16 Semes Co., Ltd. System and method for treating substrate

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EP1684334A3 (en) 2011-06-29
KR101220623B1 (ko) 2013-01-21
TWI326805B (en) 2010-07-01
KR20110128767A (ko) 2011-11-30
SG124385A1 (en) 2006-08-30
KR20110131146A (ko) 2011-12-06
KR20060085188A (ko) 2006-07-26
JP2006229183A (ja) 2006-08-31
US20060162858A1 (en) 2006-07-27
EP1684334A2 (en) 2006-07-26
JP4955976B2 (ja) 2012-06-20
KR101258781B1 (ko) 2013-04-29
TW200643644A (en) 2006-12-16
EP1684334B1 (en) 2012-11-21
US7241061B2 (en) 2007-07-10
KR20110128766A (ko) 2011-11-30
KR101200155B1 (ko) 2012-11-12

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