KR101025527B1 - 반도체 제조 프로세스의 모니터링 및 제어를 위한 방법 및장치 - Google Patents
반도체 제조 프로세스의 모니터링 및 제어를 위한 방법 및장치 Download PDFInfo
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Abstract
Description
Claims (34)
- 반도체 처리 환경에서 처리 툴을 제어하기 위한 어드밴스트 프로세스 제어(Advanced Process Control : APC) 시스템에 있어서,복수의 APC 관련 어플리케이션들을 제공하는 APC 서버;상기 APC 서버에 커플링된 인터페이스 서버(IS);상기 IS 및 APC 서버에 커플링된 데이터베이스; 및상기 APC 서버에 커플링된 그래픽 사용자 인터페이스(graphical user interface, GUI) 구성요소를 포함하고,상기 IS는, 복수의 프로세스 모듈에 커플링하기 위한 수단, 복수의 센서에 커플링하기 위한 수단, 및 처리 툴에 툴 에이전트를 포함하는 처리 툴과 APC 시스템의 에이전트 클라이언트에 커플링하기 위한 수단을 포함하고, 상기 에이전트 클라이언트는 에이전트 클라이언트 통신 클래스와 드라이버를 포함하는 것인 어드밴스트 프로세스 제어 시스템.
- 제 1항에 있어서,상기 복수의 센서에 커플링하기 위한 수단은, 광학 방출 스펙트럼(OES) 센서에 커플링하기 위한 수단을 포함하는 것인 어드밴스트 프로세스 제어 시스템.
- 제 2항에 있어서,상기 OES 센서에 커플링하기 위한 수단은, TCP/IP 커넥션을 포함하는 것인 어드밴스트 프로세스 제어 시스템.
- 제 1항에 있어서,상기 복수의 프로세스 모듈에 커플링하기 위한 수단은, 광학 데이터 프로파일(ODP) 모듈에 커플링하기 위한 수단을 포함하는 것인 어드밴스트 프로세스 제어 시스템.
- 제 4항에 있어서,상기 ODP 모듈에 커플링하기 위한 수단은, ODP 라이브러리에 커플링하기 위한 수단을 포함하는 것인 어드밴스트 프로세스 제어 시스템.
- 제 1항에 있어서,상기 복수의 센서에 커플링하기 위한 수단은, 전압/전류(V/I) 프로브에 커플링하기 위한 수단을 포함하는 것인 어드밴스트 프로세스 제어 시스템.
- 제 6항에 있어서,상기 V/I 프로브에 커플링하기 위한 수단은, TCP/IP 커넥션을 포함하는 것인 어드밴스트 프로세스 제어 시스템.
- 제 1항에 있어서,E-진단 시스템에 커플링하기 위한 수단을 더 포함하는 것인 어드밴스트 프로세스 제어 시스템.
- 제 1항에 있어서,팩토리 시스템에 커플링하기 위한 수단을 더 포함하는 것인 어드밴스트 프로세스 제어 시스템.
- 제 1항에 있어서,아날로그 프로브에 커플링하기 위한 수단을 더 포함하는 것인 어드밴스트 프로세스 제어 시스템.
- 제 10항에 있어서,상기 아날로그 프로브에 커플링하기 위한 수단은, TCP/IP 커넥션을 포함하는 것인 어드밴스트 프로세스 제어 시스템.
- 제 1항에 있어서,상기 복수의 프로세스 모듈에 커플링하기 위한 수단은, 에칭 모듈에 커플링하기 위한 수단을 포함하는 것인 어드밴스트 프로세스 제어 시스템.
- 제 11항에 있어서,상기 복수의 프로세스 모듈에 커플링하기 위한 수단은, 증착 모듈에 커플링하기 위한 수단을 포함하는 것인 어드밴스트 프로세스 제어 시스템.
- 제 1항에 있어서,상기 복수의 센서에 커플링하기 위한 수단은, 이산 메세지 허브(DMH) 클라이언트를 생성하는 센서 리코더 베이스 클래스에 커플링하기 위한 수단을 포함하는 것인 어드밴스트 프로세스 제어 시스템.
- 삭제
- 제 1항에 있어서,상기 에이전트 클라이언트 통신 클래스는, 버클리 소켓 어플리케이션 프로그래밍 인터페이스(BSD 소켓)를 통해 상기 툴 에이전트와 통신하고, 스타트 에이전트(start agent) 방법, 이벤트 리시브 스레드(event receive thread), 겟 넥스트 메세지(get next message) 방법, 및 스톱 에이전트(stop agent) 방법 중 하나 이상을 포함하는 것인 어드밴스트 프로세스 제어 시스템.
- 제 1항에 있어서,상기 APC 서버는, 적어도 3 GB의 이용가능한 디스크 공간을 갖는 저장 디바이스; 2이상의 600 MHz CPU를 포함하는 프로세서; 및 적어도 512 Mb의 RAM을 포함하는 물리적인 메모리;를 포함하는 것인 어드밴스트 프로세스 제어 시스템.
- 제 1항에 있어서,상기 APC 서버는, 1이상의 툴-관련 어플리케이션, 1이상의 모듈-관련 어플리케이션, 1이상의 센서-관련 어플리케이션, 1이상의 IS-관련 어플리케이션, 1이상의 데이터베이스-관련 어플리케이션 및 1이상의 GUI-관련 어플리케이션을 포함하는 복수의 어플리케이션을 제공하는 것인 어드밴스트 프로세스 제어 시스템.
- 제 1항에 있어서,상기 APC 서버는, 툴 APC 마스터 어플리케이션; 툴 APC 알람 어플리케이션; 1이상의 센서 인터페이스 어플리케이션; APC 데이터베이스 관리 지원 어플리케이션; APC 데이터 수집 지원 어플리케이션; APC 이벤트 관리 지원 어플리케이션; 프로브 인터페이스 어플리케이션; APC 처리 챔버 지원 어플리케이션; APC 전략 선택 어플리케이션; 툴 인터페이스 어플리케이션; 웨이퍼 데이터 어플리케이션; 및 APC 플랜 실행자(PE) 어플리케이션 중 하나 이상을 포함하는 복수의 어플리케이션을 제공하는 것인 어드밴스트 프로세스 제어 시스템.
- 제 19항에 있어서,상기 툴 APC 마스터 어플리케이션은, 셧 다운 올(shut down all) 방법, 초기화(initialization) 방법, 로직 매니저 부스트(logic manager boost) 방법, 로드 구성(load configuration) 방법, 로드 상태(load state) 방법, 저장 구성(save configuration) 방법 및 업데이트 GUI 시간(update GUI time) 방법 중 하나 이상을 포함하는 복수의 함수를 수행하는 것인 어드밴스트 프로세스 제어 시스템.
- 제 19항에 있어서,상기 APC 이벤트 관리 지원 어플리케이션은, 상기 에이전트 클라이언트가 상기 툴 에이전트로부터 수신한 이벤트들에 기초한 방법들을 디스패칭하도록 구성되는 것인 어드밴스트 프로세스 제어 시스템.
- 제 19항에 있어서,상기 APC 이벤트 관리 지원 어플리케이션은, 액티브 이벤트(active event) 방법, 파일 레디(file ready) 방법, 알람(alarm) 방법, 로트 엔드(lot end) 방법, 로트 스타트(lot start) 방법, 레시피 엔드(recipe end) 방법, 레시피 스타트(recipe start) 방법, RF(radio frequency) 오프(RF off) 방법, RF 온(RF on) 방법, 웨이퍼 인(wafer in) 방법, 및 웨이퍼 아웃(wafer out) 방법 중 하나 이상을 포함하는 복수의 방법을 수행하는 것인 어드밴스트 프로세스 제어 시스템.
- 제 19항에 있어서,상기 APC 데이터 수집 지원 어플리케이션은, 겟 로트 데이터(get lot data) 함수, 겟 웨이퍼 데이터(get wafer data) 함수, 셋업 센서(setup sensors) 함수, 스타트 센서(start sensors) 함수, 스톱 센서(stop sensors) 함수, 및 로드 디폴트 플랜(load default plans) 함수 중 하나 이상을 포함하는 다수의 방법들을 수행하는 것인 어드밴스트 프로세스 제어 시스템.
- 제 19항에 있어서,상기 툴 인터페이스 어플리케이션은, 툴 인터페이스, 파일 이송 및 상태(status)를 관리하도록 구성되는 것인 어드밴스트 프로세스 제어 시스템.
- 제 19항에 있어서,상기 툴 인터페이스 어플리케이션은, 체인지 이벤트(change event) 방법, 디바이스 실패(device failed) 방법, 디바이스 복원(device recovery) 방법, 액티브 이벤트(active event) 방법, 체크 액티브(check active) 방법, 이벤트 디스패처(event dispatcher) 방법, 이벤트 리시버(event receiver) 방법, 겟 트레이스 데이터(get trace data) 방법, 스타트 에이전트(start agent) 방법, 및 스톱 에이전트(stop agent) 방법 중 하나 이상을 포함하는 복수의 방법들을 수행하는 것인 어드밴스트 프로세스 제어 시스템.
- 제 19항에 있어서,상기 APC PE 어플리케이션은, 어떤 전략이 러닝될 것인지를 결정하도록 구성되고, 상기 전략은 임의의 주어진 시간에 활성화되는 한 세트의 플랜들을 지정하는 것인 어드밴스트 프로세스 제어 시스템.
- 제 19항에 있어서,상기 APC PE 어플리케이션은, 어떤 전략이 러닝될 것인지를 결정하기 위하여, 콘텍스트(context) 정보를 사용하도록 구성되는 것인 어드밴스트 프로세스 제어 시스템.
- 제 1항에 있어서,상기 데이터베이스는, 구성요소 테이블, 속성 테이블, 런 속성 테이블, 연관 테이블, 프로세스 런 테이블, 디바이스 런 테이블, 원래의 런 데이터 테이블, 모델 데이터 테이블, 런 요약 테이블, 및 알람 테이블 중 하나 이상을 포함하는 복수의 테이블을 포함하고,상기 구성요소 테이블은 APC 시스템의 구성요소들을 구성하는데 사용되며, 상기 구성요소 테이블 내의 각 구성요소는 상기 속성 테이블내의 다중 연관 리코드(multiple associated record)들을 가질 수 있는 것인 어드밴스트 프로세스 제어 시스템.
- 제 28항에 있어서,상기 프로세스 런 테이블은, 스타트 타임, 웨이퍼의 재료 타입을 포함하는 콘텍스트 아이템들을 포함하는 것인 어드밴스트 프로세스 제어 시스템.
- 제 28항에 있어서,상기 디바이스 런 테이블은, 센서에 대한 셋업 및 작동 파라미터들을 포함하는 것인 어드밴스트 프로세스 제어 시스템.
- 제 28항에 있어서,상기 원래의 런 데이터 테이블은 원래의 관측 데이터를 포함하는 것인 어드밴스트 프로세스 제어 시스템.
- 제 28항에 있어서,상기 모델 데이터 테이블은, 모델 분석을 위한 입력 및 출력 데이터를 홀딩하기 위한, 동적으로 생성된 테이블일 수 있는 것인 어드밴스트 프로세스 제어 시스템.
- 제 28항에 있어서,상기 런 요약 테이블은, 런 ID, 런 타입, 값 이름, 시작 단계, 종료 단계, 값 최소, 및 값 최대를 포함하는 런 요약 정보를 포함하는 것인 어드밴스트 프로세스 제어 시스템.
- 반도체 처리 환경에서 처리 툴을 제어하기 위한 어드밴스트 프로세스 제어(APC) 시스템을 이용하는 방법에 있어서,복수의 APC 관련 어플리케이션들을 제공하는 APC 서버를 제공하는 단계;상기 APC 서버에 커플링된 인터페이스 서버(IS)를 제공하는 단계;상기 IS 및 APC 서버에 커플링된 데이터베이스를 제공하는 단계; 및상기 APC 서버에 커플링된 그래픽 사용자 인터페이스(GUI) 구성요소를 제공하는 단계를 포함하고,상기 IS는, 복수의 프로세스 모듈에 커플링하기 위한 수단, 복수의 센서에 커플링하기 위한 수단, 및 처리 툴에 툴 에이전트를 포함하는 처리 툴과 APC 시스템의 에이전트 클라이언트에 커플링하기 위한 수단을 포함하며, 상기 에이전트 클라이언트는 에이전트 클라이언트 통신 클래스와 드라이버를 포함하는 것인 어드밴스트 프로세스 제어 시스템 이용 방법.
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20180034168A (ko) * | 2016-09-26 | 2018-04-04 | 가부시키가이샤 히다치 고쿠사이 덴키 | 반도체 장치의 제조 방법, 기판 처리 장치 및 기록 매체 |
KR20200141527A (ko) * | 2018-05-09 | 2020-12-18 | 어플라이드 머티어리얼스, 인코포레이티드 | 시즈닝 프로세스의 엔드포인트를 검출하기 위한 방법들 및 장치 |
Families Citing this family (180)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9785140B2 (en) * | 2000-02-01 | 2017-10-10 | Peer Intellectual Property Inc. | Multi-protocol multi-client equipment server |
US7672747B2 (en) * | 2000-03-30 | 2010-03-02 | Lam Research Corporation | Recipe-and-component control module and methods thereof |
EP1602015A2 (en) * | 2003-02-18 | 2005-12-07 | Tokyo Electron Limited | Method for automatic configuration of a processing system |
US7010374B2 (en) * | 2003-03-04 | 2006-03-07 | Hitachi High-Technologies Corporation | Method for controlling semiconductor processing apparatus |
TWI283817B (en) * | 2003-05-30 | 2007-07-11 | Tokyo Electron Ltd | Method of operating a process control system and method of operating an advanced process control system |
US7228257B1 (en) * | 2003-06-13 | 2007-06-05 | Lam Research Corporation | Architecture for general purpose programmable semiconductor processing system and methods therefor |
DE10342769A1 (de) * | 2003-09-16 | 2005-04-21 | Voith Paper Patent Gmbh | System zur computergestützten Messung von Qualitäts- und/oder Prozessdaten |
US7113890B2 (en) * | 2003-10-16 | 2006-09-26 | Abb Inc. | Method and apparatus for detecting faults in steam generator system components and other continuous processes |
US8639489B2 (en) | 2003-11-10 | 2014-01-28 | Brooks Automation, Inc. | Methods and systems for controlling a semiconductor fabrication process |
US8639365B2 (en) | 2003-11-10 | 2014-01-28 | Brooks Automation, Inc. | Methods and systems for controlling a semiconductor fabrication process |
US20070282480A1 (en) | 2003-11-10 | 2007-12-06 | Pannese Patrick D | Methods and systems for controlling a semiconductor fabrication process |
US7822826B1 (en) | 2003-12-30 | 2010-10-26 | Sap Ag | Deployment of a web service |
IN266758B (ko) * | 2004-01-14 | 2015-05-29 | Abb Inc | |
US7369913B2 (en) * | 2004-04-02 | 2008-05-06 | Siemens Medical Solutions Usa, Inc. | Recipe editor and controller |
US9219729B2 (en) | 2004-05-19 | 2015-12-22 | Philip Drope | Multimedia network system with content importation, content exportation, and integrated content management |
MXPA06013545A (es) | 2004-05-24 | 2007-01-26 | Panduit Corp | Herramienta automatica con interfaz de datos. |
US20060004786A1 (en) * | 2004-06-07 | 2006-01-05 | Taiwan Semiconductor Manufacturing Company Ltd. | Design mechanism for semiconductor fab-wide data warehouse application |
US7346883B2 (en) * | 2004-07-09 | 2008-03-18 | Kla-Tencor Technologies Corporation | System and method for integrated data transfer, archiving and purging of semiconductor wafer data |
US8108470B2 (en) * | 2004-07-22 | 2012-01-31 | Taiwan Semiconductor Manufacturing Co., Ltd. | Message management system and method |
US7153709B1 (en) * | 2004-08-31 | 2006-12-26 | Advanced Micro Devices, Inc. | Method and apparatus for calibrating degradable components using process state data |
JP4384093B2 (ja) * | 2004-09-03 | 2009-12-16 | 株式会社東芝 | プロセス状態管理システム、管理サーバ、プロセス状態管理方法及びプロセス状態管理用プログラム |
KR100639676B1 (ko) * | 2004-09-21 | 2006-10-30 | 삼성전자주식회사 | 반도체 제조용 포토리소그라피 설비 제어시스템 및 그제어방법 |
US7254513B2 (en) * | 2004-09-22 | 2007-08-07 | Taiwan Semiconductor Manufacturing Co., Ltd. | Fault detection and classification (FDC) specification management apparatus and method thereof |
US7296103B1 (en) * | 2004-10-05 | 2007-11-13 | Advanced Micro Devices, Inc. | Method and system for dynamically selecting wafer lots for metrology processing |
US7142938B2 (en) * | 2004-10-13 | 2006-11-28 | Taiwan Semiconductor Manufacturing Co., Ltd. | Manufacturing management system and method |
US7242995B1 (en) | 2004-10-25 | 2007-07-10 | Rockwell Automation Technologies, Inc. | E-manufacturing in semiconductor and microelectronics processes |
US8676538B2 (en) * | 2004-11-02 | 2014-03-18 | Advanced Micro Devices, Inc. | Adjusting weighting of a parameter relating to fault detection based on a detected fault |
TWI257538B (en) * | 2004-11-26 | 2006-07-01 | Ind Tech Res Inst | On-line quality control information system and method |
US8145748B2 (en) | 2004-12-13 | 2012-03-27 | American Power Conversion Corporation | Remote monitoring system |
US20060143244A1 (en) * | 2004-12-28 | 2006-06-29 | Taiwan Semiconductor Manufacturing Co., Ltd. | Semiconductor data archiving management systems and methods |
US7248939B1 (en) * | 2005-01-13 | 2007-07-24 | Advanced Micro Devices, Inc. | Method and apparatus for multivariate fault detection and classification |
US7606630B2 (en) * | 2005-02-28 | 2009-10-20 | Siemens Aktiengesellschaft | Method for electronically operating two machine tools |
US7291285B2 (en) * | 2005-05-10 | 2007-11-06 | International Business Machines Corporation | Method and system for line-dimension control of an etch process |
US8078919B2 (en) * | 2005-06-14 | 2011-12-13 | Hitachi Global Storage Technologies Netherlands B.V. | Method, apparatus and program storage device for managing multiple step processes triggered by a signal |
US7457675B2 (en) * | 2005-08-15 | 2008-11-25 | Abb Inc. | External status asset monitor |
US20070067384A1 (en) * | 2005-09-21 | 2007-03-22 | Angelov Dimitar V | System and method for web services configuration creation and validation |
US20070067388A1 (en) * | 2005-09-21 | 2007-03-22 | Angelov Dimitar V | System and method for configuration to web services descriptor |
US8078671B2 (en) | 2005-09-21 | 2011-12-13 | Sap Ag | System and method for dynamic web services descriptor generation using templates |
US7673028B2 (en) | 2005-09-28 | 2010-03-02 | Sap Ag | Method and system for container-managed configuration and administration |
US7200523B1 (en) * | 2005-11-30 | 2007-04-03 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method and system for filtering statistical process data to enhance process performance |
CN100429745C (zh) * | 2005-12-08 | 2008-10-29 | 北京圆合电子技术有限责任公司 | 半导体制造设备控制系统及其方法 |
US8024425B2 (en) * | 2005-12-30 | 2011-09-20 | Sap Ag | Web services deployment |
US8010695B2 (en) * | 2005-12-30 | 2011-08-30 | Sap Ag | Web services archive |
US7814060B2 (en) * | 2005-12-30 | 2010-10-12 | Sap Ag | Apparatus and method for web service client deployment |
KR100668103B1 (ko) * | 2006-01-17 | 2007-01-11 | (주)스마트에이시스템 | 반도체 세정 장비의 모니터링 방법 |
KR100989149B1 (ko) * | 2006-01-27 | 2010-10-20 | 가부시키가이샤 히다치 고쿠사이 덴키 | 기판 처리 장치 |
DE102006004408B4 (de) * | 2006-01-31 | 2010-03-18 | Advanced Micro Devices, Inc., Sunnyvale | Verfahren und System zum Analysieren von standardmäßigen Anlagennachrichten in einer Fertigungsumgebung |
US20070199655A1 (en) * | 2006-02-28 | 2007-08-30 | Tokyo Electron Limited | Substrate processing apparatus, method for modifying substrate processing conditions and storage medium |
JP4874678B2 (ja) * | 2006-03-07 | 2012-02-15 | 株式会社東芝 | 半導体製造装置の制御方法、および半導体製造装置の制御システム |
JP5114009B2 (ja) * | 2006-03-10 | 2013-01-09 | 株式会社日立国際電気 | 基板処理システム、サーバ及びデータ処理方法 |
US20070238201A1 (en) * | 2006-03-28 | 2007-10-11 | Merritt Funk | Dynamic metrology sampling with wafer uniformity control |
US7567700B2 (en) * | 2006-03-28 | 2009-07-28 | Tokyo Electron Limited | Dynamic metrology sampling with wafer uniformity control |
US7502709B2 (en) * | 2006-03-28 | 2009-03-10 | Tokyo Electron, Ltd. | Dynamic metrology sampling for a dual damascene process |
US8037522B2 (en) * | 2006-03-30 | 2011-10-11 | Nokia Corporation | Security level establishment under generic bootstrapping architecture |
JP5177958B2 (ja) * | 2006-03-31 | 2013-04-10 | Hoya株式会社 | 処理データ管理システム、磁気ディスク製造装置用の処理システム、および、磁気ディスク製造装置のデータ管理方法 |
US20070244592A1 (en) * | 2006-04-17 | 2007-10-18 | Chartered Semiconductor Manufacturing Ltd. | Manufacturing system with active failover |
US7813817B2 (en) * | 2006-05-19 | 2010-10-12 | Westinghouse Electric Co Llc | Computerized procedures system |
US7829468B2 (en) * | 2006-06-07 | 2010-11-09 | Lam Research Corporation | Method and apparatus to detect fault conditions of plasma processing reactor |
JP2008078630A (ja) * | 2006-08-24 | 2008-04-03 | Hitachi Kokusai Electric Inc | 基板処理システム |
US7565220B2 (en) | 2006-09-28 | 2009-07-21 | Lam Research Corporation | Targeted data collection architecture |
US7814046B2 (en) * | 2006-09-29 | 2010-10-12 | Lam Research Corporation | Dynamic component-tracking system and methods therefor |
PL2097794T5 (pl) | 2006-11-03 | 2018-01-31 | Air Prod & Chem | System i sposób monitorowania procesu |
DE102006061962A1 (de) | 2006-11-13 | 2008-05-15 | Abb Technology Ag | Echtzeit Prozesshistorien-Server |
US7882076B2 (en) * | 2006-12-14 | 2011-02-01 | Lam Research Corporation | Primary server architectural networking arrangement and methods therefor |
GB2449518B (en) * | 2007-03-08 | 2011-08-03 | American Power Conv Corp | Remote monitoring system |
WO2008121955A2 (en) * | 2007-03-30 | 2008-10-09 | Tokyo Electron Limited | In-line lithography and etch system |
US7531368B2 (en) * | 2007-03-30 | 2009-05-12 | Tokyo Electron Limited | In-line lithography and etch system |
US7813828B2 (en) * | 2007-04-02 | 2010-10-12 | Hitachi Kokusai Electric Inc. | Substrate processing system and group management system |
DE102007037247A1 (de) * | 2007-08-07 | 2009-02-19 | Abb Ag | System und Verfahren zur Instandhaltungsunterstützung |
US7793162B2 (en) * | 2007-08-16 | 2010-09-07 | International Business Machines Corporation | Method for reporting the status and drill-down of a control application in an automated manufacturing environment |
US7835814B2 (en) * | 2007-08-16 | 2010-11-16 | International Business Machines Corporation | Tool for reporting the status and drill-down of a control application in an automated manufacturing environment |
US7805639B2 (en) * | 2007-08-16 | 2010-09-28 | International Business Machines Corporation | Tool to report the status and drill-down of an application in an automated manufacturing environment |
JP5138322B2 (ja) * | 2007-09-14 | 2013-02-06 | 東京エレクトロン株式会社 | 処理システムの制御装置、処理システムの制御方法および制御プログラムを記憶した記憶媒体 |
DE102007046848A1 (de) * | 2007-09-29 | 2009-04-02 | Advanced Micro Devices, Inc., Sunnyvale | Verfahren und System zum Steuern der Transportsequenzen in einer Prozessanlage mittels eines vorausschauenden Modus |
US8825189B2 (en) * | 2007-11-13 | 2014-09-02 | Fisher Rosemount Systems, Inc. | Methods and apparatus to execute an auxiliary recipe and a batch recipe associated with a process control system |
EP2071580A1 (en) * | 2007-12-13 | 2009-06-17 | Siemens Aktiengesellschaft | Controlling the closing of a plant application |
JP4975656B2 (ja) | 2008-02-01 | 2012-07-11 | 東京エレクトロン株式会社 | 情報処理装置、情報処理方法、およびプログラム |
JP4550908B2 (ja) * | 2008-02-05 | 2010-09-22 | 東京エレクトロン株式会社 | 製造装置、情報処理方法、及びプログラム |
JP2009224374A (ja) * | 2008-03-13 | 2009-10-01 | Oki Semiconductor Co Ltd | Peb装置及びその制御方法 |
TWI380390B (en) * | 2008-04-08 | 2012-12-21 | Inotera Memories Inc | Method and system for detecting tool errors to stop a process recipe for a single chamber |
JP5294681B2 (ja) * | 2008-04-28 | 2013-09-18 | 東京エレクトロン株式会社 | 基板処理装置及びその基板搬送方法 |
US20090326704A1 (en) * | 2008-06-25 | 2009-12-31 | International Business Machines Corporation | Processing lots through a cluster tool having multiple processing chambers |
US20100063610A1 (en) * | 2008-09-08 | 2010-03-11 | David Angell | Method of process modules performance matching |
JP5200970B2 (ja) * | 2009-02-04 | 2013-06-05 | 富士ゼロックス株式会社 | 品質管理システムおよび品質管理装置および品質管理プログラム |
US8285414B2 (en) * | 2009-03-31 | 2012-10-09 | International Business Machines Corporation | Method and system for evaluating a machine tool operating characteristics |
JP5207310B2 (ja) | 2009-04-08 | 2013-06-12 | 株式会社日立製作所 | プラント監視制御システム用の制御装置 |
JP5629770B2 (ja) * | 2009-06-30 | 2014-11-26 | ラム リサーチ コーポレーションLam Research Corporation | プラズマチャンバ検証用のエッチング速度均一性を予測する方法、装置、及び、プログラム記憶媒体 |
US8618807B2 (en) * | 2009-06-30 | 2013-12-31 | Lam Research Corporation | Arrangement for identifying uncontrolled events at the process module level and methods thereof |
US8983631B2 (en) * | 2009-06-30 | 2015-03-17 | Lam Research Corporation | Arrangement for identifying uncontrolled events at the process module level and methods thereof |
US8538572B2 (en) * | 2009-06-30 | 2013-09-17 | Lam Research Corporation | Methods for constructing an optimal endpoint algorithm |
US8271121B2 (en) * | 2009-06-30 | 2012-09-18 | Lam Research Corporation | Methods and arrangements for in-situ process monitoring and control for plasma processing tools |
US8295966B2 (en) * | 2009-06-30 | 2012-10-23 | Lam Research Corporation | Methods and apparatus to predict etch rate uniformity for qualification of a plasma chamber |
US8655472B2 (en) * | 2010-01-12 | 2014-02-18 | Ebara Corporation | Scheduler, substrate processing apparatus, and method of transferring substrates in substrate processing apparatus |
EP2365410B1 (en) * | 2010-03-09 | 2018-06-27 | Siemens Aktiengesellschaft | Controlling a manufacturing process |
JP5381831B2 (ja) * | 2010-03-16 | 2014-01-08 | 東京エレクトロン株式会社 | 半導体製造システム |
US20110282866A1 (en) * | 2010-05-17 | 2011-11-17 | Invensys Systems, Inc. | System And Method For Retrieving And Processing Information From A Supervisory Control Manufacturing/Production Database |
EP2390743A1 (de) * | 2010-05-31 | 2011-11-30 | Siemens Aktiengesellschaft | Verfahren zur Überwachung des Ablaufs eines Steuerrezeptes eines Chargenprozesses |
US9052709B2 (en) | 2010-07-30 | 2015-06-09 | Kla-Tencor Corporation | Method and system for providing process tool correctables |
CN103229148B (zh) * | 2010-09-28 | 2016-08-31 | 西门子公司 | 运输车辆的适应性远程维护 |
TW201234464A (en) * | 2011-02-14 | 2012-08-16 | Horng Terng Automation Co Ltd | Breaking point height detection method of wafer breaking |
TWI448927B (zh) | 2011-06-24 | 2014-08-11 | Ind Tech Res Inst | 具相對位置認知之控制系統及控制方法 |
US10295993B2 (en) * | 2011-09-01 | 2019-05-21 | Kla-Tencor Corporation | Method and system for detecting and correcting problematic advanced process control parameters |
TW201316425A (zh) * | 2011-10-12 | 2013-04-16 | Horng Terng Automation Co Ltd | 晶圓劈裂檢知方法 |
US9594367B2 (en) * | 2011-10-31 | 2017-03-14 | Rockwell Automation Technologies, Inc. | Systems and methods for process control including process-initiated workflow |
US9250619B2 (en) | 2011-12-06 | 2016-02-02 | Taiwan Semiconductor Manufacturing Co., Ltd. | Systems and methods of automatic boundary control for semiconductor processes |
CN103199036B (zh) * | 2012-01-06 | 2015-09-09 | 沈阳新松机器人自动化股份有限公司 | 集成调度系统的efem及其调度方法 |
JP5992706B2 (ja) * | 2012-03-26 | 2016-09-14 | 東京エレクトロン株式会社 | 半導体製造装置の障害監視システム及び障害監視方法 |
US9229446B2 (en) | 2012-05-08 | 2016-01-05 | International Business Machines Corporation | Production line quality processes |
US9740182B2 (en) * | 2012-06-08 | 2017-08-22 | Applied Materials, Inc. | Integrated controller solution for monitoring and controlling manufacturing equipment |
JP5617060B2 (ja) * | 2012-06-26 | 2014-10-29 | 東芝三菱電機産業システム株式会社 | データ管理装置、データ管理方法、及びデータ管理プログラム |
US20140006338A1 (en) * | 2012-06-29 | 2014-01-02 | Applied Materials, Inc. | Big data analytics system |
JP5783975B2 (ja) * | 2012-08-29 | 2015-09-24 | 株式会社東芝 | 半導体製造処理システムおよび方法 |
US8990375B2 (en) * | 2012-08-31 | 2015-03-24 | Facebook, Inc. | Subscription groups in publish-subscribe system |
US9727045B2 (en) | 2012-12-31 | 2017-08-08 | Sunedison Semiconductor Limited (Uen201334164H) | Method and system for a meta-recipe control software architecture |
US10649449B2 (en) | 2013-03-04 | 2020-05-12 | Fisher-Rosemount Systems, Inc. | Distributed industrial performance monitoring and analytics |
US10909137B2 (en) | 2014-10-06 | 2021-02-02 | Fisher-Rosemount Systems, Inc. | Streaming data for analytics in process control systems |
US10866952B2 (en) | 2013-03-04 | 2020-12-15 | Fisher-Rosemount Systems, Inc. | Source-independent queries in distributed industrial system |
US9823626B2 (en) | 2014-10-06 | 2017-11-21 | Fisher-Rosemount Systems, Inc. | Regional big data in process control systems |
US10678225B2 (en) | 2013-03-04 | 2020-06-09 | Fisher-Rosemount Systems, Inc. | Data analytic services for distributed industrial performance monitoring |
US10386827B2 (en) | 2013-03-04 | 2019-08-20 | Fisher-Rosemount Systems, Inc. | Distributed industrial performance monitoring and analytics platform |
US9665088B2 (en) | 2014-01-31 | 2017-05-30 | Fisher-Rosemount Systems, Inc. | Managing big data in process control systems |
US10282676B2 (en) | 2014-10-06 | 2019-05-07 | Fisher-Rosemount Systems, Inc. | Automatic signal processing-based learning in a process plant |
US9397836B2 (en) | 2014-08-11 | 2016-07-19 | Fisher-Rosemount Systems, Inc. | Securing devices to process control systems |
US10649424B2 (en) | 2013-03-04 | 2020-05-12 | Fisher-Rosemount Systems, Inc. | Distributed industrial performance monitoring and analytics |
US10223327B2 (en) | 2013-03-14 | 2019-03-05 | Fisher-Rosemount Systems, Inc. | Collecting and delivering data to a big data machine in a process control system |
US9804588B2 (en) | 2014-03-14 | 2017-10-31 | Fisher-Rosemount Systems, Inc. | Determining associations and alignments of process elements and measurements in a process |
US9558220B2 (en) | 2013-03-04 | 2017-01-31 | Fisher-Rosemount Systems, Inc. | Big data in process control systems |
US9739274B2 (en) * | 2013-03-15 | 2017-08-22 | Integrated Designs, L.P. | Pump system and method having a quick change motor drive |
EP3200131A1 (en) | 2013-03-15 | 2017-08-02 | Fisher-Rosemount Systems, Inc. | Data modeling studio |
US9678484B2 (en) | 2013-03-15 | 2017-06-13 | Fisher-Rosemount Systems, Inc. | Method and apparatus for seamless state transfer between user interface devices in a mobile control room |
JP5518266B1 (ja) * | 2013-05-17 | 2014-06-11 | 三菱電機株式会社 | プログラマブルコントローラとその周辺装置、およびプログラマブルコントローラのテーブルデータアクセスプログラム |
US10642255B2 (en) * | 2013-08-30 | 2020-05-05 | Taiwan Semiconductor Manufacturing Company, Ltd. | Component control in semiconductor performance processing with stable product offsets |
US10168691B2 (en) | 2014-10-06 | 2019-01-01 | Fisher-Rosemount Systems, Inc. | Data pipeline for process control system analytics |
US20190354096A1 (en) * | 2014-11-18 | 2019-11-21 | Machinesense, Llc | System for rule management, predictive maintenance and quality assurance of a process and machine using reconfigurable sensor networks and big data machine learning |
US11042128B2 (en) * | 2015-03-18 | 2021-06-22 | Accenture Global Services Limited | Method and system for predicting equipment failure |
US9971478B2 (en) | 2015-04-10 | 2018-05-15 | Asml Netherlands B.V. | Method and apparatus for inspection and metrology |
DE102015214054A1 (de) * | 2015-07-24 | 2017-01-26 | Siemens Aktiengesellschaft | Verfahren zum Betreiben einer Automatisierungskomponente |
US10481597B2 (en) * | 2015-12-08 | 2019-11-19 | Sight Machine, Inc. | System and method for monitoring manufacturing |
US10325792B2 (en) * | 2015-12-17 | 2019-06-18 | Applied Materials, Inc. | Methods and apparatus for interactively and dynamically updating a schematic overlay |
US10503483B2 (en) | 2016-02-12 | 2019-12-10 | Fisher-Rosemount Systems, Inc. | Rule builder in a process control network |
CN107203196B (zh) * | 2016-03-17 | 2021-03-02 | 深圳智造谷工业互联网创新中心有限公司 | 工业设备检测系统及方法 |
US10901407B2 (en) * | 2016-05-31 | 2021-01-26 | Applied Materials, Inc. | Semiconductor device search and classification |
US10896282B2 (en) | 2016-07-12 | 2021-01-19 | Asml Netherlands B.V. | Visualization performance metrics of computational analyses of design layouts |
US11061795B2 (en) * | 2016-08-22 | 2021-07-13 | Optimal Plus Ltd. | Methods of smart pairing |
US10768076B1 (en) | 2016-09-30 | 2020-09-08 | Sight Machine, Inc. | System and method for monitoring manufacturing |
JP2018067626A (ja) * | 2016-10-19 | 2018-04-26 | 東京エレクトロン株式会社 | 半導体システム及びデータ編集支援方法 |
US10606253B2 (en) * | 2017-02-08 | 2020-03-31 | United Microelectronics Corp. | Method of monitoring processing system for processing substrate |
US11068478B2 (en) | 2017-03-15 | 2021-07-20 | Optimal Plus Ltd. | Augmenting reliability models for manufactured products |
US11675347B2 (en) | 2017-06-01 | 2023-06-13 | LeClaire Manufacturing Company | Industrial machine monitoring device |
EP3415988A1 (en) * | 2017-06-14 | 2018-12-19 | ASML Netherlands B.V. | Device manufacturing methods |
TWI670952B (zh) * | 2017-08-14 | 2019-09-01 | 艾普仕股份有限公司 | 網路切換控制系統 |
US10389659B2 (en) * | 2017-09-27 | 2019-08-20 | Lam Research Corporation | Universal multiprotocol industrial data logger |
CN108181891B (zh) * | 2017-12-13 | 2020-05-05 | 东北大学 | 基于智能核主元分析的工业大数据故障诊断方法 |
TWI647553B (zh) * | 2018-01-19 | 2019-01-11 | 上銀科技股份有限公司 | Multi-machine synchronous cooperative control method and system |
US11610273B2 (en) | 2018-04-26 | 2023-03-21 | InfinityQS International, Inc. | Enterprise-wide process stream analysis and grading engine with interactive user interface method, system, and computer program product |
CN108375390A (zh) * | 2018-04-28 | 2018-08-07 | 深圳远征技术有限公司 | 可配置数据集中采集方法、装置及设备 |
US10867823B2 (en) | 2018-05-29 | 2020-12-15 | Taiwan Semiconductor Manufacturing Co., Ltd. | Fault detection method in semiconductor fabrication |
US10698392B2 (en) * | 2018-06-22 | 2020-06-30 | Applied Materials, Inc. | Using graphics processing unit for substrate routing and throughput modeling |
JP6851348B2 (ja) * | 2018-08-15 | 2021-03-31 | 日本電子株式会社 | 真空装置及び復旧支援方法 |
US11568198B2 (en) * | 2018-09-12 | 2023-01-31 | Applied Materials, Inc. | Deep auto-encoder for equipment health monitoring and fault detection in semiconductor and display process equipment tools |
KR102268279B1 (ko) * | 2018-10-18 | 2021-06-22 | 세메스 주식회사 | 기판 처리 장치, 이의 제어 방법 및 기억 매체 |
EP3654103A1 (en) * | 2018-11-14 | 2020-05-20 | ASML Netherlands B.V. | Method for obtaining training data for training a model of a semicondcutor manufacturing process |
WO2020108862A1 (en) * | 2018-11-26 | 2020-06-04 | Asml Netherlands B.V. | Method for determining root causes of events of a semiconductor manufacturing process and for monitoring a semiconductor manufacturing process |
US20200174444A1 (en) * | 2018-11-30 | 2020-06-04 | Lear Corporation | Assembly line tool test carrier and method of using |
DE102019209110A1 (de) * | 2019-06-24 | 2020-12-24 | Sms Group Gmbh | Industrielle Anlage, insbesondere Anlage der metallerzeugenden Industrie oder der Aluminium- oder Stahlindustrie und Verfahren zum Betreiben einer industriellen Anlage, insbesondere einer Anlage der metallerzeugenden Industrie oder der Aluminium- oder Stahlindustrie |
US11856706B2 (en) * | 2019-12-03 | 2023-12-26 | Applied Materials, Inc. | Method and system for improving the operation of semiconductor processing |
CN115039040A (zh) * | 2020-02-21 | 2022-09-09 | 纳米电子成像有限公司 | 制造过程的系统、方法和介质 |
US11302545B2 (en) * | 2020-03-20 | 2022-04-12 | Nanya Technology Corporation | System and method for controlling semiconductor manufacturing equipment |
US11675340B2 (en) | 2020-04-08 | 2023-06-13 | Nanya Technology Corporation | System and method for controlling semiconductor manufacturing apparatus |
US11688616B2 (en) * | 2020-07-22 | 2023-06-27 | Applied Materials, Inc. | Integrated substrate measurement system to improve manufacturing process performance |
USD977504S1 (en) | 2020-07-22 | 2023-02-07 | Applied Materials, Inc. | Portion of a display panel with a graphical user interface |
EP4162396A4 (en) * | 2020-07-23 | 2024-03-20 | Pdf Solutions Inc | AUTOMATIC WINDOW GENERATION FOR PROCESSING TRACE |
CN115803858A (zh) * | 2020-11-12 | 2023-03-14 | 朗姆研究公司 | 半导体制造设备的预测性维护 |
US11483412B2 (en) * | 2020-12-30 | 2022-10-25 | Blackberry Limited | Method for marshalling events in a publish-subscribe system |
CN114609980A (zh) * | 2021-05-13 | 2022-06-10 | 苏州蓝桥智能科技有限公司 | 一种生物医药生产环境管理系统 |
CN115599620A (zh) * | 2021-06-28 | 2023-01-13 | 深圳富桂精密工业有限公司(Cn) | 监控告警方法及终端设备 |
US11874649B2 (en) | 2021-11-09 | 2024-01-16 | Applied Materials, Inc. | Methods and systems for cleaning process sequence management |
CN114218197A (zh) * | 2021-12-17 | 2022-03-22 | 上海繁易信息科技股份有限公司 | 基于面向对象的工业物联网数据建模方法与系统 |
US20230298872A1 (en) * | 2022-03-16 | 2023-09-21 | Applied Materials, Inc. | Process characterization and correction using optical wall process sensor (owps) |
CN115951893B (zh) * | 2022-12-02 | 2024-02-23 | 深圳微迅信息科技有限公司 | 一种半导体加工脚本获取方法、系统、设备及存储介质 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2002087229A1 (en) | 2001-04-19 | 2002-10-31 | Gentor.Com Inc. | Method for data-broadcasting based on electronic program guide, and a system for performing the same |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5864773A (en) * | 1995-11-03 | 1999-01-26 | Texas Instruments Incorporated | Virtual sensor based monitoring and fault detection/classification system and method for semiconductor processing equipment |
US6088689A (en) * | 1995-11-29 | 2000-07-11 | Hynomics Corporation | Multiple-agent hybrid control architecture for intelligent real-time control of distributed nonlinear processes |
US6263255B1 (en) * | 1998-05-18 | 2001-07-17 | Advanced Micro Devices, Inc. | Advanced process control for semiconductor manufacturing |
JP3998372B2 (ja) * | 1999-06-30 | 2007-10-24 | 株式会社東芝 | 半導体処理工程制御システム、半導体処理工程制御方法、及び、そのための処理を記録した記録媒体 |
US6571285B1 (en) * | 1999-12-23 | 2003-05-27 | Accenture Llp | Providing an integrated service assurance environment for a network |
US6480854B1 (en) * | 2000-03-27 | 2002-11-12 | Advanced Micro Devices, Inc. | Method and apparatus for increasing database availability |
US6725402B1 (en) * | 2000-07-31 | 2004-04-20 | Advanced Micro Devices, Inc. | Method and apparatus for fault detection of a processing tool and control thereof using an advanced process control (APC) framework |
US6819963B2 (en) * | 2000-12-06 | 2004-11-16 | Advanced Micro Devices, Inc. | Run-to-run control method for proportional-integral-derivative (PID) controller tuning for rapid thermal processing (RTP) |
US20020087229A1 (en) | 2001-01-02 | 2002-07-04 | Pasadyn Alexander J. | Use of endpoint system to match individual processing stations wirhin a tool |
US6801817B1 (en) * | 2001-02-20 | 2004-10-05 | Advanced Micro Devices, Inc. | Method and apparatus for integrating multiple process controllers |
JP4270872B2 (ja) * | 2001-03-16 | 2009-06-03 | 東京エレクトロン株式会社 | インピーダンスをモニターするシステム並びに方法 |
US6630362B1 (en) * | 2001-06-13 | 2003-10-07 | Advanced Micro Devices, Inc. | Method and apparatus for performing trench depth analysis |
US7305421B2 (en) * | 2001-07-16 | 2007-12-04 | Sap Ag | Parallelized redo-only logging and recovery for highly available main memory database systems |
US6674459B2 (en) * | 2001-10-24 | 2004-01-06 | Microsoft Corporation | Network conference recording system and method including post-conference processing |
US6842660B2 (en) * | 2001-10-31 | 2005-01-11 | Brooks Automation, Inc. | Device and method for communicating data in a process control system |
TWI233141B (en) * | 2001-12-26 | 2005-05-21 | Nat Science Council | Method of equipment management |
-
2003
- 2003-09-25 AU AU2003270866A patent/AU2003270866A1/en not_active Abandoned
- 2003-09-25 WO PCT/US2003/029980 patent/WO2004031875A1/en active Application Filing
- 2003-09-25 EP EP03752579A patent/EP1546827A1/en not_active Withdrawn
- 2003-09-25 JP JP2004541624A patent/JP4694843B2/ja not_active Expired - Fee Related
- 2003-09-25 CN CN038219700A patent/CN100407215C/zh not_active Expired - Lifetime
- 2003-09-25 KR KR1020057005460A patent/KR101025527B1/ko active IP Right Grant
- 2003-09-25 TW TW092126521A patent/TWI233008B/zh not_active IP Right Cessation
-
2005
- 2005-03-23 US US11/087,071 patent/US7123980B2/en not_active Expired - Lifetime
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2002087229A1 (en) | 2001-04-19 | 2002-10-31 | Gentor.Com Inc. | Method for data-broadcasting based on electronic program guide, and a system for performing the same |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20180034168A (ko) * | 2016-09-26 | 2018-04-04 | 가부시키가이샤 히다치 고쿠사이 덴키 | 반도체 장치의 제조 방법, 기판 처리 장치 및 기록 매체 |
KR101916394B1 (ko) | 2016-09-26 | 2018-11-13 | 가부시키가이샤 코쿠사이 엘렉트릭 | 반도체 장치의 제조 방법, 기판 처리 장치 및 기록 매체 |
KR20200141527A (ko) * | 2018-05-09 | 2020-12-18 | 어플라이드 머티어리얼스, 인코포레이티드 | 시즈닝 프로세스의 엔드포인트를 검출하기 위한 방법들 및 장치 |
KR102477573B1 (ko) * | 2018-05-09 | 2022-12-13 | 어플라이드 머티어리얼스, 인코포레이티드 | 시즈닝 프로세스의 엔드포인트를 검출하기 위한 방법들 및 장치 |
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JP4694843B2 (ja) | 2011-06-08 |
EP1546827A1 (en) | 2005-06-29 |
AU2003270866A1 (en) | 2004-04-23 |
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