KR100933243B1 - 무전해 금 도금 공정 및 금층 형성 공정 - Google Patents

무전해 금 도금 공정 및 금층 형성 공정 Download PDF

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Publication number
KR100933243B1
KR100933243B1 KR1020050086154A KR20050086154A KR100933243B1 KR 100933243 B1 KR100933243 B1 KR 100933243B1 KR 1020050086154 A KR1020050086154 A KR 1020050086154A KR 20050086154 A KR20050086154 A KR 20050086154A KR 100933243 B1 KR100933243 B1 KR 100933243B1
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South Korea
Prior art keywords
gold
plating solution
layer
electroless
gold plating
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Expired - Fee Related
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KR1020050086154A
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English (en)
Korean (ko)
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KR20060051327A (ko
Inventor
마사키 사나다
마사오 나카자와
게이 이마후지
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신꼬오덴기 고교 가부시키가이샤
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Publication of KR20060051327A publication Critical patent/KR20060051327A/ko
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/54—Contact plating, i.e. electroless electrochemical plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands

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  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Chemically Coating (AREA)
KR1020050086154A 2004-09-17 2005-09-15 무전해 금 도금 공정 및 금층 형성 공정 Expired - Fee Related KR100933243B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2004271112 2004-09-17
JPJP-P-2004-00271112 2004-09-17
JP2005005266A JP2006111960A (ja) 2004-09-17 2005-01-12 非シアン無電解金めっき液及び無電解金めっき方法
JPJP-P-2005-00005266 2005-01-12

Publications (2)

Publication Number Publication Date
KR20060051327A KR20060051327A (ko) 2006-05-19
KR100933243B1 true KR100933243B1 (ko) 2009-12-22

Family

ID=36074357

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020050086154A Expired - Fee Related KR100933243B1 (ko) 2004-09-17 2005-09-15 무전해 금 도금 공정 및 금층 형성 공정

Country Status (4)

Country Link
US (1) US7264848B2 (enExample)
JP (1) JP2006111960A (enExample)
KR (1) KR100933243B1 (enExample)
TW (1) TW200619420A (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4759416B2 (ja) * 2006-03-20 2011-08-31 新光電気工業株式会社 非シアン無電解金めっき液及び無電解金めっき方法
CN102260892B (zh) * 2010-05-31 2014-10-08 比亚迪股份有限公司 一种钛及钛合金预镀液和电镀方法
KR20130037238A (ko) * 2010-06-24 2013-04-15 메르크 파텐트 게엠베하 유기 전자 디바이스에서 전극들을 개질하는 방법
JP2014013795A (ja) * 2012-07-03 2014-01-23 Seiko Epson Corp ベース基板、電子デバイスおよび電子機器
JP6043996B2 (ja) * 2012-07-13 2016-12-14 学校法人関東学院 ノーシアン無電解金めっき浴
JP6203825B2 (ja) * 2013-04-05 2017-09-27 メタローテクノロジーズジャパン株式会社 無電解白金めっき液、及び同めっき液を用いる無電解白金めっき方法
DE112018000876T5 (de) * 2017-02-15 2019-11-07 Mitsubishi Electric Corporation Halbleiterelement und verfahren zur herstellung desselben
CN113046736B (zh) * 2021-03-02 2021-09-28 深圳市创智成功科技有限公司 一种用于显示面板领域的无氰化学沉金溶液及其工艺

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5470381A (en) 1992-11-25 1995-11-28 Kanto Kagaku Kabushiki Kaisha Electroless gold plating solution
JP2000026977A (ja) * 1998-07-13 2000-01-25 Daiwa Kasei Kenkyusho:Kk 貴金属を化学的還元析出によって得るための水溶液
KR20040050887A (ko) * 2002-12-10 2004-06-17 간토 가가꾸 가부시키가이샤 무전해 금도금 용액

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3227505B2 (ja) * 1993-07-16 2001-11-12 奥野製薬工業株式会社 置換型無電解金めっき液
US5338343A (en) * 1993-07-23 1994-08-16 Technic Incorporated Catalytic electroless gold plating baths
DE19629658C2 (de) 1996-07-23 1999-01-14 Degussa Cyanidfreies galvanisches Bad zur Abscheidung von Gold und Goldlegierungen
JP3566498B2 (ja) * 1997-05-14 2004-09-15 株式会社大和化成研究所 置換金めっき浴
JP2000252380A (ja) * 1999-02-25 2000-09-14 Mitsui Chemicals Inc はんだ接続用パッドおよびそのはんだ接続用パッドを用いた半導体搭載用基板
JP2002348680A (ja) * 2001-05-22 2002-12-04 Sharp Corp 金属膜パターンおよびその製造方法
JP3482402B2 (ja) * 2001-06-29 2003-12-22 日本エレクトロプレイテイング・エンジニヤース株式会社 置換金メッキ液
JP2003268559A (ja) * 2002-03-15 2003-09-25 Hitachi Chem Co Ltd 無電解金めっき液及び無電解金めっき方法
JP2003342742A (ja) * 2002-05-23 2003-12-03 Risho Kogyo Co Ltd 無電解金めっき液
JP4221556B2 (ja) * 2002-08-08 2009-02-12 セイコーエプソン株式会社 金の水系分散液の製造方法
US20050092616A1 (en) * 2003-11-03 2005-05-05 Semitool, Inc. Baths, methods, and tools for superconformal deposition of conductive materials other than copper

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5470381A (en) 1992-11-25 1995-11-28 Kanto Kagaku Kabushiki Kaisha Electroless gold plating solution
JP2000026977A (ja) * 1998-07-13 2000-01-25 Daiwa Kasei Kenkyusho:Kk 貴金属を化学的還元析出によって得るための水溶液
US6235093B1 (en) 1998-07-13 2001-05-22 Daiwa Fine Chemicals Co., Ltd. Aqueous solutions for obtaining noble metals by chemical reductive deposition
KR20040050887A (ko) * 2002-12-10 2004-06-17 간토 가가꾸 가부시키가이샤 무전해 금도금 용액

Also Published As

Publication number Publication date
US7264848B2 (en) 2007-09-04
JP2006111960A (ja) 2006-04-27
US20060062927A1 (en) 2006-03-23
KR20060051327A (ko) 2006-05-19
TW200619420A (en) 2006-06-16

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