KR100927514B1 - 4-메틸-1-펜텐계 중합체를 포함하는 적층체 및 이것으로이루어진 이형 필름 - Google Patents
4-메틸-1-펜텐계 중합체를 포함하는 적층체 및 이것으로이루어진 이형 필름 Download PDFInfo
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- C09J123/18—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms
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- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
- C09J123/18—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/24—All layers being polymeric
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/306—Resistant to heat
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/40—Properties of the layers or laminate having particular optical properties
- B32B2307/402—Coloured
- B32B2307/4023—Coloured on the layer surface, e.g. ink
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- B32—LAYERED PRODUCTS
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- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/538—Roughness
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/546—Flexural strength; Flexion stiffness
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- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/56—Damping, energy absorption
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/748—Releasability
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
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- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
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Abstract
Description
Claims (11)
- 적어도 표면층(A), 접착층(B) 및 쿠션층(C)을 포함하고, 상기 표면층(A)과 쿠션층(C) 사이에 접착층(B)을 갖는 적층체로서,상기 표면층(A)이 4-메틸-1-펜텐계 중합체를 80 내지 100질량% 포함하고,상기 접착층(B)이, 4-메틸-1-펜텐계 중합체(b1) 20 내지 50질량% 및 탄소원자수 2 내지 4의 올레핀을 포함하는 중합체(b2) 50 내지 80질량%를 포함하고, 또한 하중 2.16kg, 온도 230℃에서 측정되는 용융 유량(MFR1)이 0.4g/10분 미만이며,상기 쿠션층(C)이, 융점 190 내지 250℃의 내열성 수지(c1) 10 내지 50질량%, 및 융점 70 내지 170℃의 연질 수지(c2) 50 내지 90질량%를 포함하고, 또한 하중 2.16kg, 온도 230℃에서 측정되는 용융 유량(MFR1)이 0.4 내지 10g/10분인 적층체.
- 삭제
- 제 1 항에 있어서,상기 접착층(B)이, 4-메틸-1-펜텐계 중합체(b1) 20 내지 50질량%, 에틸렌·뷰텐 공중합체(b2-1) 1 내지 40질량%, 및 1-뷰텐계 중합체(b2-2) 30 내지 60질량%를 포함하는 적층체.
- 제 1 항에 있어서,상기 쿠션층(C)의 내열성 수지(c1)가, 4-메틸-1-펜텐계 중합체 및 폴리아마이드 수지로부터 선택되는 적어도 1종이며, 연질 수지(c2)가, 저밀도 폴리에틸렌, 직쇄상 저밀도 폴리에틸렌, 고밀도 폴리에틸렌, 프로필렌의 호모중합체, 에틸렌·프로필렌 공중합체, 에틸렌·프로필렌·뷰텐 공중합체, 뷰텐의 호모중합체, 에틸렌·뷰텐 공중합체, 프로필렌·뷰텐 공중합체, 및 그들의 무수 말레산 변성 중합체로부터 선택되는 적어도 1종인 적층체.
- 제 1 항에 있어서,상기 표면층(A)이, 4-메틸-1-펜텐의 단독중합체, 또는 4-메틸-1-펜텐과 4-메틸-1-펜텐 이외의 탄소원자수 2 내지 20의 올레핀과의 공중합체를 포함하는 적층체.
- 제 1 항에 있어서,적층체의 적어도 한쪽의 최외층이 표면층(A)이고, 상기 표면층(A)의 두께가 적층체 전체의 두께의 5 내지 50%인 적층체.
- 제 1 항에 있어서,가열 및 가압 처리 전의 적층체의 표면층(A)과 쿠션층(C) 사이의, JIS K6854에 준거하여 측정하여 얻어지는 접착 강도가, 1 내지 20N/15mm인 적층체.
- 제 1 항에 있어서,적층체의 적어도 한쪽의 최외층이 표면층(A)이고, 상기 표면층(A)의 면조도 Ry가 0.01 내지 20㎛인 적층체.
- 삭제
- 제 1 항 또는 제 3 항 내지 제 8 항 중 어느 한 항에 있어서,이형 필름으로서 사용되는 적층체.
- 제 1 항 또는 제 3 항 내지 제 8 항 중 어느 한 항에 있어서,플렉시블 프린트 기판 제조용 이형 필름으로서 사용되는 적층체.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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JP2005141912 | 2005-05-13 | ||
JPJP-P-2005-00141912 | 2005-05-13 | ||
PCT/JP2006/309178 WO2006120983A1 (ja) | 2005-05-13 | 2006-05-02 | 4-メチル-1-ペンテン系重合体を含む積層体およびこれからなる離型フィルム |
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KR20080012356A KR20080012356A (ko) | 2008-02-11 |
KR100927514B1 true KR100927514B1 (ko) | 2009-11-17 |
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JP (1) | JP4786657B2 (ko) |
KR (1) | KR100927514B1 (ko) |
CN (1) | CN101175637B (ko) |
TW (1) | TWI294351B (ko) |
WO (1) | WO2006120983A1 (ko) |
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WO2008001682A1 (fr) * | 2006-06-27 | 2008-01-03 | Mitsui Chemicals, Inc. | Film et film de démoulage |
JP4332204B2 (ja) * | 2007-09-21 | 2009-09-16 | 積水化学工業株式会社 | 離型フィルム |
JP5270989B2 (ja) * | 2008-07-16 | 2013-08-21 | 三井化学株式会社 | プリント配線基板の製造方法 |
CN102132391B (zh) * | 2008-08-28 | 2014-03-19 | 三井化学东赛璐株式会社 | 半导体树脂封装制造用模具脱模膜、以及使用其的半导体树脂封装的制造方法 |
KR101620308B1 (ko) * | 2008-11-06 | 2016-05-12 | 다우 글로벌 테크놀로지스 엘엘씨 | 전자 디바이스 모듈용의 공압출된 다층 폴리올레핀계 백시트 |
JP5297233B2 (ja) * | 2009-03-09 | 2013-09-25 | 三井化学株式会社 | 半導体封止プロセス用離型フィルム、およびそれを用いた樹脂封止半導体の製造方法 |
US9725540B2 (en) * | 2009-11-06 | 2017-08-08 | Mitsui Chemicals, Inc. | 4-methyl-1-pentene/α-olefin copolymer, composition comprising the copolymer and 4-methyl-1-pentene copolymer composition |
KR20150058179A (ko) * | 2012-09-18 | 2015-05-28 | 스미또모 베이크라이트 가부시키가이샤 | 이형 필름 |
WO2014097964A1 (ja) * | 2012-12-18 | 2014-06-26 | 株式会社カネカ | ホットメルト接着剤用樹脂組成物およびこれを用いたホットメルト接着フィルム |
US9161452B2 (en) * | 2013-06-17 | 2015-10-13 | Microcosm Technology Co., Ltd. | Component-embedded printed circuit board and method of forming the same |
JP6223913B2 (ja) | 2013-08-05 | 2017-11-01 | 積水化学工業株式会社 | 離型フィルム |
JP6271320B2 (ja) * | 2014-03-28 | 2018-01-31 | アキレス株式会社 | 離型フィルム |
JP6503633B2 (ja) * | 2014-04-24 | 2019-04-24 | 味の素株式会社 | 回路基板の製造方法 |
JP6350303B2 (ja) * | 2015-01-23 | 2018-07-04 | 王子ホールディングス株式会社 | 剥離性フィルム |
CN109466138B (zh) * | 2017-12-27 | 2020-11-06 | 宁波长阳科技股份有限公司 | 一种离型膜及其制备方法 |
WO2022034834A1 (ja) * | 2020-08-12 | 2022-02-17 | 住友ベークライト株式会社 | 離型フィルムおよび成型品の製造方法 |
JP6870775B1 (ja) * | 2020-10-21 | 2021-05-12 | 住友ベークライト株式会社 | 離型フィルムおよび成型品の製造方法 |
CN114507486B (zh) * | 2020-11-16 | 2024-02-20 | 象山激智新材料有限公司 | 一种耐高温保护膜及其制备方法 |
CN112622312A (zh) * | 2020-12-29 | 2021-04-09 | 宁波长阳科技股份有限公司 | 脱模膜及其制备方法和应用 |
CN112793271B (zh) * | 2020-12-31 | 2023-02-24 | 苏州市新广益电子股份有限公司 | 含有4-甲基-1-戊烯聚合物的复合薄膜及由其构成的脱模膜 |
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