KR100900180B1 - 과립 형태의 핫 멜트 접착제 - Google Patents

과립 형태의 핫 멜트 접착제 Download PDF

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Publication number
KR100900180B1
KR100900180B1 KR1020037014541A KR20037014541A KR100900180B1 KR 100900180 B1 KR100900180 B1 KR 100900180B1 KR 1020037014541 A KR1020037014541 A KR 1020037014541A KR 20037014541 A KR20037014541 A KR 20037014541A KR 100900180 B1 KR100900180 B1 KR 100900180B1
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KR
South Korea
Prior art keywords
hot melt
granules
melt adhesive
moisture
reactive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020037014541A
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English (en)
Korean (ko)
Other versions
KR20040029974A (ko
Inventor
프림케하르트무트
페트리게랄트
닉슨앤드류
콜슈타트한스-페터
쉐플러인골프
비헬하우스위르겐
크레브스미하엘
루돌프미하엘
Original Assignee
헨켈 아게 운트 코. 카게아아
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Publication of KR20040029974A publication Critical patent/KR20040029974A/ko
Application granted granted Critical
Publication of KR100900180B1 publication Critical patent/KR100900180B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
    • B29B9/00—Making granules
    • B29B9/10—Making granules by moulding the material, i.e. treating it in the molten state
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/08—Processes
    • C08G18/10—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
    • C08G18/12—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step using two or more compounds having active hydrogen in the first polymerisation step
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/4009—Two or more macromolecular compounds not provided for in one single group of groups C08G18/42 - C08G18/64
    • C08G18/4018—Mixtures of compounds of group C08G18/42 with compounds of group C08G18/48
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/12—Powdering or granulating
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L29/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal or ketal radical; Compositions of hydrolysed polymers of esters of unsaturated alcohols with saturated carboxylic acids; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C09J201/02—Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
    • B29K2105/0097—Glues or adhesives, e.g. hot melts or thermofusible adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2170/00—Compositions for adhesives
    • C08G2170/20—Compositions for hot melt adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2367/00—Characterised by the use of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Derivatives of such polymers
    • C08J2367/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
    • Y10T428/31562—Next to polyamide [nylon, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
    • Y10T428/31565—Next to polyester [polyethylene terephthalate, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
    • Y10T428/31573—Next to addition polymer of ethylenically unsaturated monomer
    • Y10T428/3158—Halide monomer type [polyvinyl chloride, etc.]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Glass Compositions (AREA)
  • Processes Of Treating Macromolecular Substances (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
KR1020037014541A 2001-05-09 2002-04-30 과립 형태의 핫 멜트 접착제 Expired - Fee Related KR100900180B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10122437.0 2001-05-09
DE10122437A DE10122437A1 (de) 2001-05-09 2001-05-09 Schmelzklebstoff in Form eines Granulates
PCT/EP2002/004729 WO2002090454A1 (de) 2001-05-09 2002-04-30 Schmelzklebstoff in form eines granulates

Publications (2)

Publication Number Publication Date
KR20040029974A KR20040029974A (ko) 2004-04-08
KR100900180B1 true KR100900180B1 (ko) 2009-06-02

Family

ID=7684099

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020037014541A Expired - Fee Related KR100900180B1 (ko) 2001-05-09 2002-04-30 과립 형태의 핫 멜트 접착제

Country Status (12)

Country Link
US (1) US7267878B2 (https=)
EP (1) EP1397455B1 (https=)
JP (1) JP2004531610A (https=)
KR (1) KR100900180B1 (https=)
AT (1) ATE332343T1 (https=)
BR (1) BR0210059B1 (https=)
CA (1) CA2446919C (https=)
CZ (1) CZ20033038A3 (https=)
DE (2) DE10122437A1 (https=)
ES (1) ES2268051T3 (https=)
PL (1) PL216739B1 (https=)
WO (1) WO2002090454A1 (https=)

Families Citing this family (58)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10149474A1 (de) * 2001-10-08 2003-04-17 Buehler Ag Steuerung der Kristallisation von Polyestern durch deren Wassergehalt
DE10261972B4 (de) * 2002-02-19 2008-08-21 Jowat Ag Reaktives Einkomponenten-Beschichtungs- und/oder Klebstoffgranulat, Verfahren zu seiner Herstellung sowie seine Verwendung
DE10210082A1 (de) * 2002-03-08 2003-09-25 Henkel Kgaa Verfahren zum Verbinden von transparenten Kunststoffsubstraten
DE10254600B4 (de) * 2002-11-22 2007-12-27 Bayer Materialscience Ag Verfahren zur Herstellung von thermoplastischen, nicht klebenden Polyurethanen
GB0304276D0 (en) * 2003-02-25 2003-03-26 Dow Benelux Reactive hot melt adhesive
DE20321146U1 (de) 2003-08-25 2006-03-09 Technische Universität Braunschweig Carolo-Wilhelmina Mikrosystembauelement
WO2005044901A1 (de) 2003-10-17 2005-05-19 Bkg Bruckmann & Kreyenborg Granuliertechnik Gmbh Verfahren zur thermischen behandlung von polyesterpellets
KR20060126674A (ko) * 2003-11-27 2006-12-08 제이에스알 가부시끼가이샤 핫멜트형 접착제 조성물
ATE515325T1 (de) * 2003-12-12 2011-07-15 Becton Dickinson Co Verfahren zur befestigung einer membran mittels heissschmelzen ohne klebstoff
JP2005239962A (ja) * 2004-02-27 2005-09-08 Three M Innovative Properties Co 多層構造を有する熱硬化性成形材料用ペレット
DE102004057988A1 (de) * 2004-12-01 2006-06-08 Klebchemie M.G. Becker Gmbh +Co.Kg Primerlose Verklebung von Profilen
DE102004062653A1 (de) * 2004-12-24 2006-07-06 Bayer Materialscience Ag Feuchthärtende Zusammensetzung und Schmelzklebstoff
DE102005028056A1 (de) * 2005-06-16 2006-12-21 Basf Ag Thermoplastisches Polyurethan enthaltend Isocyanat
DE102005036366C5 (de) * 2005-07-29 2018-09-06 Mann+Hummel Gmbh Verfahren zur Stabilisierung von gefalteten Filtermedien sowie ein durch dieses Verfahren stabilisiertes Filtermedium
EP1801138A1 (de) * 2005-12-23 2007-06-27 Sika Technology AG Feuchtigkeitshärtende Heissschmelzklebstoffe umfassend mindestens ein silanfunktionelles Polyurethanprepolymer
US8677722B2 (en) * 2006-08-23 2014-03-25 Illinois Tool Works Inc. Hot melt adhesive systems for zipper assemblies on large bag constructions of various substrates
US20090067761A1 (en) * 2006-08-23 2009-03-12 Illinois Tool Works Inc. High burst closure assembly for large packages
WO2008093398A1 (ja) * 2007-01-30 2008-08-07 Asics Corporation シューズの製造方法、及びシューズ
JP5315620B2 (ja) * 2007-03-14 2013-10-16 株式会社リコー 保護剤塗布装置、プロセスカートリッジ及び画像形成装置
US7914895B2 (en) * 2007-05-24 2011-03-29 H.B. Fuller Company Moisture curable hot melt adhesive composition
KR100889249B1 (ko) * 2007-10-30 2009-03-17 주식회사 한스물산 통기성필름과 부직포를 적층시킨 하우스랩용 필름
US20090159206A1 (en) * 2007-12-20 2009-06-25 National Starch And Chemical Investment Holding Corporation Moisture curable hot melt adhesive
JP2010105385A (ja) * 2008-09-30 2010-05-13 Toyoda Gosei Co Ltd 化粧シート及び化粧成形品
ATE532806T1 (de) * 2009-03-31 2011-11-15 Sika Technology Ag Heisshärtende oder hitzeaktivierbare zusammensetzung enthaltend ein oberflächendesaktiviertes polyisocyanat
EP2267051A1 (de) * 2009-05-27 2010-12-29 Sika Technology AG Silanfunktionelle Polyester in feuchtigkeitshärtenden Zusammensetzungen auf Basis silanfunktioneller Polymere
EP2267052A1 (de) * 2009-05-27 2010-12-29 Sika Technology AG Feuchtigkeitshärtende Zusammensetzung mit verbesserter Anfangsfestigkeit
DE102009026026A1 (de) * 2009-06-24 2010-12-30 Malibu Gmbh & Co. Kg Photovoltaikmodul und Verfahren zu dessen Herstellung
DE102009038799B4 (de) 2009-08-25 2011-07-28 Grenzebach Maschinenbau GmbH, 86663 Verfahren und Vorrichtung zum blasenfreien Verkleben großflächiger Glasplatten
DE202009011548U1 (de) 2009-08-25 2009-12-31 Grenzebach Maschinenbau Gmbh Vorrichtung zum blasenfreien Verkleben großflächiger Glasplatten
ES2374490T3 (es) 2009-09-02 2012-02-17 Rhein Chemie Rheinau Gmbh Uso de carbodiimidas como estabilizador de color en adhesivos termofusibles.
EP2292712A1 (de) * 2009-09-02 2011-03-09 Rhein Chemie Rheinau GmbH Verwendung von Carbodiimiden als Farbstabilisator in Schmelzklebstoffen
KR101108546B1 (ko) * 2009-10-07 2012-01-31 한국신발피혁연구소 백카운터용 핫멜트 접착제 조성물
TW201137071A (en) * 2010-03-05 2011-11-01 Fuller H B Co Thermally resistant hot melt moisture cure polyurethane adhesive composition, methods of using the same, and solar panel assembly including the same
US9133377B2 (en) 2010-05-20 2015-09-15 A. Raymond Et Cie Adhesive polyurethane powder capable of being activated by heat
DE102010039781A1 (de) * 2010-08-26 2012-03-01 Robert Bosch Gmbh Optimierte Pelletgeometrie
DE202011005156U1 (de) * 2011-04-12 2014-07-30 Rwr Patentverwaltung Gbr (Vertreten Durch Josef Und Michael Rothen, Harald Wallner) Hotmeltklebstoff-Gebinde sowie Vorrichtung zum Herstellen desselben
JP2013116993A (ja) * 2011-12-05 2013-06-13 Henkel Japan Ltd 湿気硬化型ホットメルト接着剤
US9364985B2 (en) * 2012-05-24 2016-06-14 Henkel IP & Holding GmbH Process for preparing flowable amorphous poly-alpha olefin adhesive pellets
DE102012013370B4 (de) * 2012-07-04 2017-11-23 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Montagevorrichtung und Verfahren zum Fixieren einer Nadel in einem Nadelhalter einer Ausstoßvorrichtung zum Abheben eines Chips von einem Trägermaterial
BR112015004928B1 (pt) * 2012-09-26 2021-03-02 Dow Global Technologies Llc vedante a base de poliuretano e unidade isolada
DE102013206639A1 (de) * 2013-04-15 2014-10-16 Harry Löster Artikel und Verfahren zur Herstellung desselben
TWI476260B (zh) * 2013-05-13 2015-03-11 Chi Mei Corp 光硬化可剝離型黏著劑組成物及其應用
WO2014194087A2 (en) * 2013-05-29 2014-12-04 H.B. Fuller Company Packaged hot-melt pressure sensitive adhesive
EP3006478B1 (en) * 2013-06-07 2019-09-04 Kaneka Corporation Curable resin composition, structural adhesive produced using same, coating material or fiber reinforced composite material, foam body produced by foaming same, laminated body produced by curing same, and cured product thereof
US9776211B2 (en) * 2013-09-25 2017-10-03 Andersen Corporation Methods of filling wood voids and reducing waste in production of coated wood products
PT2954995T (pt) * 2014-06-12 2017-04-07 Organik Kimya Sanayi Ve Tic A S Processo para preparar adesivo de fusão a quente sensível à pressão (hmpsa) possuindo um revestimento sem carácter pegajoso
WO2016002391A1 (ja) * 2014-07-02 2016-01-07 横浜ゴム株式会社 反応性ホットメルト接着剤組成物
US10034519B2 (en) 2016-06-16 2018-07-31 Adidas Ag UV curable lattice microstructure for footwear
CN106750119B (zh) * 2016-12-05 2019-04-16 上海东大聚氨酯有限公司 一种组合聚醚、聚氨酯胶粘剂原料组合物及其应用
CN110582396A (zh) 2017-04-24 2019-12-17 耐克创新有限合伙公司 具有uv辐射可固化材料的服装和运动装备及其制造方法
EP3576919B1 (en) 2017-04-24 2020-06-17 NIKE Innovate C.V. Transparent tooling mold and process for uv radiation curable rubber
US11136475B2 (en) * 2017-04-24 2021-10-05 Nike, Inc. Articles and components with UV radiation curable elastomeric materials and methods of making the same
US11122847B2 (en) 2017-04-24 2021-09-21 Nike, Inc. Article with UV radiation curable material adhered to textile and method of making the same
WO2019014005A1 (en) 2017-07-14 2019-01-17 Dow Global Technologies Llc POLYMERIZATION AND ISOLATION OF LOW VISCOSITY POLYMERS USING PASTILLAGE TECHNOLOGY
AU2019257331C1 (en) * 2018-04-17 2022-05-05 Henkel Ag & Co. Kgaa Contact adhesives and uses thereof
US12070876B2 (en) 2018-08-30 2024-08-27 Dow Global Technologies Llc Apparatus and method for granulating low viscosity materials
CN109705309A (zh) * 2018-12-07 2019-05-03 旭川化学（苏州）有限公司 一种尼丝纺织物层压用耐水洗湿气反应型聚氨酯树脂及其制备方法
CN114616304B (zh) * 2019-10-30 2024-08-20 汉高股份有限及两合公司 用于低温施加的聚氨酯热熔粘合剂

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11228833A (ja) * 1998-02-16 1999-08-24 Sanyo Chem Ind Ltd 湿気架橋性ポリウレタン樹脂組成物
WO2000047687A1 (de) * 1999-02-11 2000-08-17 Jowat Lobers Und Frank Gmbh & Co. Kg Mehrkomponenten beschichtungs- und klebstoffmaterial

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USRE32325E (en) 1981-05-26 1987-01-06 E. I. Du Pont De Nemours And Company Tack-free polymer pellets
US4384083A (en) * 1981-07-22 1983-05-17 Applied Polymer Technology, Incorporated Thermoplastic adhesive
JPS61218631A (ja) * 1985-03-25 1986-09-29 Agency Of Ind Science & Technol 架橋性ホットメルト接着剤の製造方法
JPS6295371A (ja) * 1985-10-22 1987-05-01 Agency Of Ind Science & Technol 粉末状吸湿架橋性ホツトメルト接着剤の製造方法
DD280540A1 (de) 1989-03-20 1990-07-11 Leuna Werke Veb Verfahren zur erzeugung von klebeverbindungen mittels schmelzklebstoffen
JP2818909B2 (ja) * 1990-11-30 1998-10-30 サンスター技研株式会社 紫外線架橋性ホットメルト型接着剤組成物
US5710215A (en) 1992-06-15 1998-01-20 Ebnother Ag Method and material mixture for manufacture of reactive hotmelts
CA2114842C (en) 1992-06-15 2003-08-05 Thomas Abend Method and material mixture for manufacture of reactive hotmelts
US5472785A (en) 1994-04-12 1995-12-05 Minnesota Mining And Manufacturing Company Reactive wax-containing moisture curable hot melt composition
DE4446027A1 (de) 1994-12-23 1996-07-04 Henkel Kgaa Formteile aus PU-Schmelzklebstoffen
DE19541923C2 (de) 1995-11-10 2001-07-12 Sika Werke Gmbh Reaktiver thermoplastischer Heißschmelzklebstoff
BR9611968A (pt) 1995-11-16 1999-07-13 Fuller H B Licensing Financ Composição polimérica em forma granular
JPH09328668A (ja) * 1996-06-10 1997-12-22 Sekisui Chem Co Ltd 室温硬化型樹脂組成物、室温硬化型接着剤、反応性ホットメルト型接着剤及び室温硬化型粘着剤
JP3160230B2 (ja) 1996-09-25 2001-04-25 三洋化成工業株式会社 熱溶融性改良剤および熱溶融性樹脂組成物
JPH11279515A (ja) * 1998-03-30 1999-10-12 Sekisui Chem Co Ltd 反応性ホットメルト接着剤組成物及び接着方法
JPH11320805A (ja) * 1998-05-21 1999-11-24 Sekisui Chem Co Ltd 化粧シート被覆材の製造方法
JP2000248249A (ja) * 1999-02-26 2000-09-12 Japan Gore Tex Inc 反応性ホットメルト接着剤およびその用途
DE10030909A1 (de) 1999-07-09 2001-03-01 Henkel Kgaa Schmelz-Haftklebstoff in Form eines Granulates
WO2001027188A1 (de) 1999-10-11 2001-04-19 Henkel Kommanditgesellschaft Auf Aktien Schmelz-haftklebstoff in form eines granulates
DE19952089C1 (de) 1999-10-29 2001-04-05 Henkel Kgaa Verwendung von thermoplastischen Polymerzusammensetzungen als Trockenmittel
KR100830384B1 (ko) 1999-11-29 2008-05-20 헨켈 코만디트게젤샤프트 아우프 악티엔 단량체가 없는 반응성 폴리우레탄을 위한 접착 촉진제
DE10015290A1 (de) * 2000-03-28 2001-10-11 Henkel Teroson Gmbh Reaktives Schmelzstoff-Granulat für Isoliergals

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11228833A (ja) * 1998-02-16 1999-08-24 Sanyo Chem Ind Ltd 湿気架橋性ポリウレタン樹脂組成物
WO2000047687A1 (de) * 1999-02-11 2000-08-17 Jowat Lobers Und Frank Gmbh & Co. Kg Mehrkomponenten beschichtungs- und klebstoffmaterial

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DE10122437A1 (de) 2002-11-28
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DE50207444D1 (de) 2006-08-17
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EP1397455A1 (de) 2004-03-17
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