KR100859624B1 - 반도체 장치의 제조 방법 - Google Patents

반도체 장치의 제조 방법 Download PDF

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Publication number
KR100859624B1
KR100859624B1 KR1020010052441A KR20010052441A KR100859624B1 KR 100859624 B1 KR100859624 B1 KR 100859624B1 KR 1020010052441 A KR1020010052441 A KR 1020010052441A KR 20010052441 A KR20010052441 A KR 20010052441A KR 100859624 B1 KR100859624 B1 KR 100859624B1
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South Korea
Prior art keywords
resin
sealing body
semiconductor device
substrate
resin sealing
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Expired - Fee Related
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KR1020010052441A
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English (en)
Korean (ko)
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KR20020018103A (ko
Inventor
단노다다또시
아라이가쯔오
시미즈이찌오
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가부시키가이샤 히타치세이사쿠쇼
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Publication of KR100859624B1 publication Critical patent/KR100859624B1/ko
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/019—Manufacture or treatment using temporary auxiliary substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/014—Manufacture or treatment using batch processing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/016—Manufacture or treatment using moulds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/9415—Dispositions of bond pads relative to the surface, e.g. recessed, protruding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H10W74/142—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed the encapsulations exposing the passive side of the semiconductor body
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/726—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
KR1020010052441A 2000-08-30 2001-08-29 반도체 장치의 제조 방법 Expired - Fee Related KR100859624B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2000-00261355 2000-08-30
JP2000261355A JP2002076040A (ja) 2000-08-30 2000-08-30 半導体装置及びその製造方法

Publications (2)

Publication Number Publication Date
KR20020018103A KR20020018103A (ko) 2002-03-07
KR100859624B1 true KR100859624B1 (ko) 2008-09-23

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020010052441A Expired - Fee Related KR100859624B1 (ko) 2000-08-30 2001-08-29 반도체 장치의 제조 방법

Country Status (4)

Country Link
US (1) US6838315B2 (https=)
JP (1) JP2002076040A (https=)
KR (1) KR100859624B1 (https=)
TW (1) TW543129B (https=)

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US7026710B2 (en) * 2000-01-21 2006-04-11 Texas Instruments Incorporated Molded package for micromechanical devices and method of fabrication
JP2002118201A (ja) * 2000-10-05 2002-04-19 Hitachi Ltd 半導体装置およびその製造方法
JP3973457B2 (ja) * 2002-03-15 2007-09-12 シャープ株式会社 半導体発光装置
JP2003303919A (ja) * 2002-04-10 2003-10-24 Hitachi Ltd 半導体装置及びその製造方法
US6921975B2 (en) * 2003-04-18 2005-07-26 Freescale Semiconductor, Inc. Circuit device with at least partial packaging, exposed active surface and a voltage reference plane
DE10334576B4 (de) * 2003-07-28 2007-04-05 Infineon Technologies Ag Verfahren zum Herstellen eines Halbleiterbauelements mit einem Kunststoffgehäuse
CN100555608C (zh) * 2004-07-15 2009-10-28 大日本印刷株式会社 半导体装置与半导体装置制造用基板及它们的制造方法
JP2006073586A (ja) * 2004-08-31 2006-03-16 Renesas Technology Corp 半導体装置の製造方法
US20070111399A1 (en) * 2005-11-14 2007-05-17 Goida Thomas M Method of fabricating an exposed die package
WO2007057954A1 (ja) * 2005-11-17 2007-05-24 Fujitsu Limited 半導体装置及びその製造方法
US20070216033A1 (en) * 2006-03-20 2007-09-20 Corisis David J Carrierless chip package for integrated circuit devices, and methods of making same
JP2008016630A (ja) * 2006-07-06 2008-01-24 Matsushita Electric Ind Co Ltd プリント配線板およびその製造方法
CN101101882A (zh) * 2006-07-05 2008-01-09 阎跃军 基板树脂封装方法
CN100505246C (zh) * 2006-09-30 2009-06-24 卓恩民 半导体封装结构及其制法
DE102007034402B4 (de) * 2006-12-14 2014-06-18 Advanpack Solutions Pte. Ltd. Halbleiterpackung und Herstellungsverfahren dafür
KR100874923B1 (ko) * 2007-04-02 2008-12-19 삼성전자주식회사 멀티 스택 패키지, 이의 제조 방법 및 이를 제조하기 위한반도체 패키지 금형
JP2009123873A (ja) * 2007-11-14 2009-06-04 Wen-Gung Sung 発光ダイオード封止構造およびその製造方法
JP2012506156A (ja) * 2008-10-17 2012-03-08 オッカム ポートフォリオ リミテッド ライアビリティ カンパニー はんだを使用しないフレキシブル回路アセンブリおよび製造方法
TWI414048B (zh) * 2008-11-07 2013-11-01 先進封裝技術私人有限公司 半導體封裝件與其製造方法
TWI381496B (zh) * 2009-01-23 2013-01-01 億光電子工業股份有限公司 封裝基板結構與晶片封裝結構及其製程
US20120241926A1 (en) * 2011-03-23 2012-09-27 Zigmund Ramirez Camacho Integrated circuit packaging system with leveling standoff and method of manufacture thereof
US8420448B2 (en) * 2011-03-24 2013-04-16 Stats Chippac Ltd. Integrated circuit packaging system with pads and method of manufacture thereof
JP5798834B2 (ja) 2011-08-08 2015-10-21 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
TWI500124B (zh) 2011-11-29 2015-09-11 先進封裝技術私人有限公司 基板結構、半導體封裝元件及基板結構之製造方法
TWI476841B (zh) * 2012-03-03 2015-03-11 矽品精密工業股份有限公司 半導體封裝件及其製法
JP5919087B2 (ja) * 2012-05-10 2016-05-18 ルネサスエレクトロニクス株式会社 半導体装置の製造方法および半導体装置
TWI488275B (zh) * 2013-05-20 2015-06-11 矽品精密工業股份有限公司 半導體封裝件之製法
DE102014103942B4 (de) * 2014-03-21 2024-05-02 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zur Herstellung eines Gehäuses für ein elektronisches Bauelement und eines elektronischen Bauelements, Gehäuse für ein elektronisches Bauelement und elektronisches Bauelement
JP2015213151A (ja) * 2014-04-16 2015-11-26 株式会社村田製作所 半導体パッケージおよびこれを備える半導体モジュール
JP6986385B2 (ja) * 2016-08-22 2021-12-22 ローム株式会社 半導体装置、半導体装置の実装構造
JP6612723B2 (ja) * 2016-12-07 2019-11-27 株式会社東芝 基板装置
US9978613B1 (en) 2017-03-07 2018-05-22 Texas Instruments Incorporated Method for making lead frames for integrated circuit packages

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JPH0394460A (ja) * 1989-09-06 1991-04-19 Shinko Electric Ind Co Ltd 半導体装置およびその製造方法
JPH0399456A (ja) * 1989-09-06 1991-04-24 Motorola Inc 半導体装置およびその製造方法

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Publication number Priority date Publication date Assignee Title
JPH0394460A (ja) * 1989-09-06 1991-04-19 Shinko Electric Ind Co Ltd 半導体装置およびその製造方法
JPH0399456A (ja) * 1989-09-06 1991-04-24 Motorola Inc 半導体装置およびその製造方法

Also Published As

Publication number Publication date
KR20020018103A (ko) 2002-03-07
US20020025607A1 (en) 2002-02-28
JP2002076040A (ja) 2002-03-15
US6838315B2 (en) 2005-01-04
TW543129B (en) 2003-07-21

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