KR100856171B1 - Ｃｍｐ연마제 및 기판의 연마방법 - Google Patents

Ｃｍｐ연마제 및 기판의 연마방법 Download PDF

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Publication number
KR100856171B1
KR100856171B1 KR1020077001589A KR20077001589A KR100856171B1 KR 100856171 B1 KR100856171 B1 KR 100856171B1 KR 1020077001589 A KR1020077001589 A KR 1020077001589A KR 20077001589 A KR20077001589 A KR 20077001589A KR 100856171 B1 KR100856171 B1 KR 100856171B1
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KR
South Korea
Prior art keywords
polishing
water
weight
cmp
cerium oxide
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
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KR1020077001589A
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English (en)
Korean (ko)
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KR20070026843A (ko
Inventor
마사토 후카사와
나오유키 코야마
야스시 쿠라타
코우지 하가
토시아키 아쿠츠
유우토 오오츠키
Original Assignee
히다치 가세고교 가부시끼가이샤
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Publication of KR20070026843A publication Critical patent/KR20070026843A/ko
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/06—Planarisation of inorganic insulating materials
    • H10P95/062—Planarisation of inorganic insulating materials involving a dielectric removal step
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
KR1020077001589A 2004-07-23 2005-07-20 Ｃｍｐ연마제 및 기판의 연마방법 Expired - Lifetime KR100856171B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2004-00216039 2004-07-23
JP2004216039 2004-07-23

Publications (2)

Publication Number Publication Date
KR20070026843A KR20070026843A (ko) 2007-03-08
KR100856171B1 true KR100856171B1 (ko) 2008-09-03

Family

ID=35785268

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020077001589A Expired - Lifetime KR100856171B1 (ko) 2004-07-23 2005-07-20 Ｃｍｐ연마제 및 기판의 연마방법

Country Status (7)

Country Link
US (1) US9293344B2 (https=)
EP (1) EP1796152B1 (https=)
JP (3) JPWO2006009160A1 (https=)
KR (1) KR100856171B1 (https=)
CN (3) CN101311205A (https=)
TW (1) TWI287040B (https=)
WO (1) WO2006009160A1 (https=)

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KR101126124B1 (ko) * 2005-05-30 2012-03-30 주식회사 동진쎄미켐 연마 평탄도를 향상시킨 산화 세륨 슬러리 조성물
KR101194881B1 (ko) * 2006-01-31 2012-10-25 히다치 가세고교 가부시끼가이샤 절연막 연마용 ｃｍｐ 연마제, 연마 방법, 상기 연마 방법으로 연마된 반도체 전자 부품
MD3809C2 (ro) * 2008-06-26 2009-08-31 Акционерное Общество "Azurit" Procedeu de prelucrare de finisare a plăcilor pentru acoperire din calcar hemogen
TW201038690A (en) * 2008-09-26 2010-11-01 Rhodia Operations Abrasive compositions for chemical mechanical polishing and methods for using same
DE112012004431B4 (de) * 2011-10-24 2025-12-31 Fujimi Incorporated Zusammensetzung zu Polierzwecken, Polierverfahren unter Verwendung derselben und Verfahren zur Herstellung eines Substrates
US8703004B2 (en) * 2011-11-14 2014-04-22 Kabushiki Kaisha Toshiba Method for chemical planarization and chemical planarization apparatus
JPWO2013137220A1 (ja) * 2012-03-14 2015-08-03 日立化成株式会社 研磨方法
EP2826827B1 (en) * 2013-07-18 2019-06-12 Basf Se CMP composition comprising abrasive particles containing ceria
JP2016175948A (ja) * 2013-08-09 2016-10-06 コニカミノルタ株式会社 Ｃｍｐ用研磨液
JP5920840B2 (ja) * 2013-09-30 2016-05-18 株式会社フジミインコーポレーテッド 研磨用組成物およびその製造方法
KR102239131B1 (ko) * 2013-09-30 2021-04-12 가부시키가이샤 후지미인코퍼레이티드 연마용 조성물 및 그 제조 방법
CN104356950B (zh) * 2014-10-21 2017-01-18 李金平 一种蓝宝石晶片抛光液
JP6206388B2 (ja) * 2014-12-15 2017-10-04 信越半導体株式会社 シリコンウェーハの研磨方法
CN104987839A (zh) * 2015-06-30 2015-10-21 安徽德诺化工有限公司 Led用蓝宝石衬底研磨液
US11649377B2 (en) * 2017-08-14 2023-05-16 Resonac Corporation Polishing liquid, polishing liquid set and polishing method
KR102846745B1 (ko) 2017-09-29 2025-08-13 가부시끼가이샤 레조낙 연마액, 연마액 세트 및 연마 방법
JP6837958B2 (ja) * 2017-12-28 2021-03-03 花王株式会社 酸化珪素膜用研磨液組成物
US11718767B2 (en) 2018-08-09 2023-08-08 Versum Materials Us, Llc Chemical mechanical planarization composition for polishing oxide materials and method of use thereof
WO2020170331A1 (ja) 2019-02-19 2020-08-27 日立化成株式会社 研磨液及び研磨方法
CN111014695A (zh) * 2019-11-21 2020-04-17 苏州新锐合金工具股份有限公司 硬质合金混合料的制备方法

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Also Published As

Publication number Publication date
US9293344B2 (en) 2016-03-22
CN1985361A (zh) 2007-06-20
CN102585765A (zh) 2012-07-18
JP5655879B2 (ja) 2015-01-21
TW200609337A (en) 2006-03-16
EP1796152A1 (en) 2007-06-13
CN102585765B (zh) 2015-01-21
WO2006009160A1 (ja) 2006-01-26
EP1796152B1 (en) 2019-02-27
JPWO2006009160A1 (ja) 2008-05-01
TWI287040B (en) 2007-09-21
KR20070026843A (ko) 2007-03-08
US20080003925A1 (en) 2008-01-03
EP1796152A4 (en) 2008-12-03
JP2011103498A (ja) 2011-05-26
JP2013149992A (ja) 2013-08-01
CN101311205A (zh) 2008-11-26
JP5509114B2 (ja) 2014-06-04

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