TWI287040B - CMP slurry and polishing method for substrate - Google Patents

CMP slurry and polishing method for substrate Download PDF

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Publication number
TWI287040B
TWI287040B TW094124651A TW94124651A TWI287040B TW I287040 B TWI287040 B TW I287040B TW 094124651 A TW094124651 A TW 094124651A TW 94124651 A TW94124651 A TW 94124651A TW I287040 B TWI287040 B TW I287040B
Authority
TW
Taiwan
Prior art keywords
honing
weight
water
cmp
agent
Prior art date
Application number
TW094124651A
Other languages
English (en)
Chinese (zh)
Other versions
TW200609337A (en
Inventor
Masato Fukasawa
Naoyuki Koyama
Yasushi Kurata
Kouji Haga
Toshiaki Akutsu
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of TW200609337A publication Critical patent/TW200609337A/zh
Application granted granted Critical
Publication of TWI287040B publication Critical patent/TWI287040B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/06—Planarisation of inorganic insulating materials
    • H10P95/062—Planarisation of inorganic insulating materials involving a dielectric removal step
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW094124651A 2004-07-23 2005-07-21 CMP slurry and polishing method for substrate TWI287040B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004216039 2004-07-23

Publications (2)

Publication Number Publication Date
TW200609337A TW200609337A (en) 2006-03-16
TWI287040B true TWI287040B (en) 2007-09-21

Family

ID=35785268

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094124651A TWI287040B (en) 2004-07-23 2005-07-21 CMP slurry and polishing method for substrate

Country Status (7)

Country Link
US (1) US9293344B2 (https=)
EP (1) EP1796152B1 (https=)
JP (3) JPWO2006009160A1 (https=)
KR (1) KR100856171B1 (https=)
CN (3) CN101311205A (https=)
TW (1) TWI287040B (https=)
WO (1) WO2006009160A1 (https=)

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KR102239131B1 (ko) * 2013-09-30 2021-04-12 가부시키가이샤 후지미인코퍼레이티드 연마용 조성물 및 그 제조 방법
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CN111014695A (zh) * 2019-11-21 2020-04-17 苏州新锐合金工具股份有限公司 硬质合金混合料的制备方法

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Also Published As

Publication number Publication date
KR100856171B1 (ko) 2008-09-03
US9293344B2 (en) 2016-03-22
CN1985361A (zh) 2007-06-20
CN102585765A (zh) 2012-07-18
JP5655879B2 (ja) 2015-01-21
TW200609337A (en) 2006-03-16
EP1796152A1 (en) 2007-06-13
CN102585765B (zh) 2015-01-21
WO2006009160A1 (ja) 2006-01-26
EP1796152B1 (en) 2019-02-27
JPWO2006009160A1 (ja) 2008-05-01
KR20070026843A (ko) 2007-03-08
US20080003925A1 (en) 2008-01-03
EP1796152A4 (en) 2008-12-03
JP2011103498A (ja) 2011-05-26
JP2013149992A (ja) 2013-08-01
CN101311205A (zh) 2008-11-26
JP5509114B2 (ja) 2014-06-04

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