CN101311205A - Cmp研磨剂以及衬底的研磨方法 - Google Patents

Cmp研磨剂以及衬底的研磨方法 Download PDF

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Publication number
CN101311205A
CN101311205A CNA2008101292389A CN200810129238A CN101311205A CN 101311205 A CN101311205 A CN 101311205A CN A2008101292389 A CNA2008101292389 A CN A2008101292389A CN 200810129238 A CN200810129238 A CN 200810129238A CN 101311205 A CN101311205 A CN 101311205A
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CN
China
Prior art keywords
water
cmp abrasive
weight
cerium oxide
cmp
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2008101292389A
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English (en)
Chinese (zh)
Inventor
深泽正人
小山直之
仓田靖
芳贺浩二
阿久津利明
大槻裕人
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of CN101311205A publication Critical patent/CN101311205A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/06—Planarisation of inorganic insulating materials
    • H10P95/062—Planarisation of inorganic insulating materials involving a dielectric removal step
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
CNA2008101292389A 2004-07-23 2005-07-20 Cmp研磨剂以及衬底的研磨方法 Pending CN101311205A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004216039 2004-07-23
JP2004216039 2004-07-23

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CNA2005800235561A Division CN1985361A (zh) 2004-07-23 2005-07-20 Cmp研磨剂以及衬底的研磨方法

Publications (1)

Publication Number Publication Date
CN101311205A true CN101311205A (zh) 2008-11-26

Family

ID=35785268

Family Applications (3)

Application Number Title Priority Date Filing Date
CNA2008101292389A Pending CN101311205A (zh) 2004-07-23 2005-07-20 Cmp研磨剂以及衬底的研磨方法
CNA2005800235561A Pending CN1985361A (zh) 2004-07-23 2005-07-20 Cmp研磨剂以及衬底的研磨方法
CN201110430594.6A Expired - Lifetime CN102585765B (zh) 2004-07-23 2005-07-20 Cmp研磨剂以及衬底的研磨方法

Family Applications After (2)

Application Number Title Priority Date Filing Date
CNA2005800235561A Pending CN1985361A (zh) 2004-07-23 2005-07-20 Cmp研磨剂以及衬底的研磨方法
CN201110430594.6A Expired - Lifetime CN102585765B (zh) 2004-07-23 2005-07-20 Cmp研磨剂以及衬底的研磨方法

Country Status (7)

Country Link
US (1) US9293344B2 (https=)
EP (1) EP1796152B1 (https=)
JP (3) JPWO2006009160A1 (https=)
KR (1) KR100856171B1 (https=)
CN (3) CN101311205A (https=)
TW (1) TWI287040B (https=)
WO (1) WO2006009160A1 (https=)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104170065A (zh) * 2012-03-14 2014-11-26 日立化成株式会社 研磨方法
CN104987839A (zh) * 2015-06-30 2015-10-21 安徽德诺化工有限公司 Led用蓝宝石衬底研磨液
CN105593330A (zh) * 2013-09-30 2016-05-18 福吉米株式会社 研磨用组合物及其制造方法
CN111014695A (zh) * 2019-11-21 2020-04-17 苏州新锐合金工具股份有限公司 硬质合金混合料的制备方法

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KR101126124B1 (ko) * 2005-05-30 2012-03-30 주식회사 동진쎄미켐 연마 평탄도를 향상시킨 산화 세륨 슬러리 조성물
KR101194881B1 (ko) * 2006-01-31 2012-10-25 히다치 가세고교 가부시끼가이샤 절연막 연마용 ｃｍｐ 연마제, 연마 방법, 상기 연마 방법으로 연마된 반도체 전자 부품
MD3809C2 (ro) * 2008-06-26 2009-08-31 Акционерное Общество "Azurit" Procedeu de prelucrare de finisare a plăcilor pentru acoperire din calcar hemogen
TW201038690A (en) * 2008-09-26 2010-11-01 Rhodia Operations Abrasive compositions for chemical mechanical polishing and methods for using same
DE112012004431B4 (de) * 2011-10-24 2025-12-31 Fujimi Incorporated Zusammensetzung zu Polierzwecken, Polierverfahren unter Verwendung derselben und Verfahren zur Herstellung eines Substrates
US8703004B2 (en) * 2011-11-14 2014-04-22 Kabushiki Kaisha Toshiba Method for chemical planarization and chemical planarization apparatus
EP2826827B1 (en) * 2013-07-18 2019-06-12 Basf Se CMP composition comprising abrasive particles containing ceria
JP2016175948A (ja) * 2013-08-09 2016-10-06 コニカミノルタ株式会社 Ｃｍｐ用研磨液
JP5920840B2 (ja) * 2013-09-30 2016-05-18 株式会社フジミインコーポレーテッド 研磨用組成物およびその製造方法
CN104356950B (zh) * 2014-10-21 2017-01-18 李金平 一种蓝宝石晶片抛光液
JP6206388B2 (ja) * 2014-12-15 2017-10-04 信越半導体株式会社 シリコンウェーハの研磨方法
US11649377B2 (en) * 2017-08-14 2023-05-16 Resonac Corporation Polishing liquid, polishing liquid set and polishing method
KR102846745B1 (ko) 2017-09-29 2025-08-13 가부시끼가이샤 레조낙 연마액, 연마액 세트 및 연마 방법
JP6837958B2 (ja) * 2017-12-28 2021-03-03 花王株式会社 酸化珪素膜用研磨液組成物
US11718767B2 (en) 2018-08-09 2023-08-08 Versum Materials Us, Llc Chemical mechanical planarization composition for polishing oxide materials and method of use thereof
WO2020170331A1 (ja) 2019-02-19 2020-08-27 日立化成株式会社 研磨液及び研磨方法

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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104170065A (zh) * 2012-03-14 2014-11-26 日立化成株式会社 研磨方法
US9299573B2 (en) 2012-03-14 2016-03-29 Hitachi Chemical Company, Ltd. Polishing method
CN105593330A (zh) * 2013-09-30 2016-05-18 福吉米株式会社 研磨用组合物及其制造方法
CN105593330B (zh) * 2013-09-30 2018-06-19 福吉米株式会社 研磨用组合物及其制造方法
US10227518B2 (en) 2013-09-30 2019-03-12 Fujimi Incorporated Polishing composition and method for producing same
CN104987839A (zh) * 2015-06-30 2015-10-21 安徽德诺化工有限公司 Led用蓝宝石衬底研磨液
CN111014695A (zh) * 2019-11-21 2020-04-17 苏州新锐合金工具股份有限公司 硬质合金混合料的制备方法

Also Published As

Publication number Publication date
KR100856171B1 (ko) 2008-09-03
US9293344B2 (en) 2016-03-22
CN1985361A (zh) 2007-06-20
CN102585765A (zh) 2012-07-18
JP5655879B2 (ja) 2015-01-21
TW200609337A (en) 2006-03-16
EP1796152A1 (en) 2007-06-13
CN102585765B (zh) 2015-01-21
WO2006009160A1 (ja) 2006-01-26
EP1796152B1 (en) 2019-02-27
JPWO2006009160A1 (ja) 2008-05-01
TWI287040B (en) 2007-09-21
KR20070026843A (ko) 2007-03-08
US20080003925A1 (en) 2008-01-03
EP1796152A4 (en) 2008-12-03
JP2011103498A (ja) 2011-05-26
JP2013149992A (ja) 2013-08-01
JP5509114B2 (ja) 2014-06-04

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Application publication date: 20081126