KR100820992B1 - 실리카계 피막형성용 조성물, 실리카계 피막 및 그제조방법 및 전자부품 - Google Patents

실리카계 피막형성용 조성물, 실리카계 피막 및 그제조방법 및 전자부품 Download PDF

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KR100820992B1
KR100820992B1 KR1020057015194A KR20057015194A KR100820992B1 KR 100820992 B1 KR100820992 B1 KR 100820992B1 KR 1020057015194 A KR1020057015194 A KR 1020057015194A KR 20057015194 A KR20057015194 A KR 20057015194A KR 100820992 B1 KR100820992 B1 KR 100820992B1
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silica
film
composition
component
forming
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KR20050095788A (ko
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하루아키 사쿠라이
코이치 아베
카즈히로 에노모토
시게루 노베
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히다치 가세고교 가부시끼가이샤
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/02—Polysilicates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
    • H01L23/5329—Insulating materials
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31652—Of asbestos
    • Y10T428/31663—As siloxane, silicone or silane

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Organic Chemistry (AREA)
  • Wood Science & Technology (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Formation Of Insulating Films (AREA)
  • Paints Or Removers (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Organic Insulating Materials (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Silicon Compounds (AREA)
KR1020057015194A 2002-02-27 2003-02-26 실리카계 피막형성용 조성물, 실리카계 피막 및 그제조방법 및 전자부품 Expired - Fee Related KR100820992B1 (ko)

Applications Claiming Priority (10)

Application Number Priority Date Filing Date Title
JPJP-P-2002-00052025 2002-02-27
JP2002052025 2002-02-27
JP2002060615 2002-03-06
JPJP-P-2002-00060615 2002-03-06
JPJP-P-2002-00060622 2002-03-06
JPJP-P-2002-00060620 2002-03-06
JP2002060620 2002-03-06
JP2002060622 2002-03-06
JPJP-P-2002-00127012 2002-04-26
JP2002127012 2002-04-26

Related Parent Applications (1)

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KR10-2004-7013253A Division KR20040094732A (ko) 2002-02-27 2003-02-26 실리카계 피막형성용 조성물, 실리카계 피막 및 그제조방법 및 전자부품

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KR20050095788A KR20050095788A (ko) 2005-09-30
KR100820992B1 true KR100820992B1 (ko) 2008-04-10

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KR1020057015194A Expired - Fee Related KR100820992B1 (ko) 2002-02-27 2003-02-26 실리카계 피막형성용 조성물, 실리카계 피막 및 그제조방법 및 전자부품
KR10-2004-7013253A Ceased KR20040094732A (ko) 2002-02-27 2003-02-26 실리카계 피막형성용 조성물, 실리카계 피막 및 그제조방법 및 전자부품
KR1020047019649A Expired - Fee Related KR100819226B1 (ko) 2002-02-27 2003-02-26 실리카계 피막형성용 조성물, 실리카계 피막 및 그제조방법 및 전자부품
KR1020077005209A Expired - Fee Related KR100795251B1 (ko) 2002-02-27 2003-02-26 실리카계 피막형성용 조성물, 실리카계 피막 및 그제조방법 및 전자부품

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KR10-2004-7013253A Ceased KR20040094732A (ko) 2002-02-27 2003-02-26 실리카계 피막형성용 조성물, 실리카계 피막 및 그제조방법 및 전자부품
KR1020047019649A Expired - Fee Related KR100819226B1 (ko) 2002-02-27 2003-02-26 실리카계 피막형성용 조성물, 실리카계 피막 및 그제조방법 및 전자부품
KR1020077005209A Expired - Fee Related KR100795251B1 (ko) 2002-02-27 2003-02-26 실리카계 피막형성용 조성물, 실리카계 피막 및 그제조방법 및 전자부품

Country Status (7)

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US (1) US7358300B2 (enExample)
JP (3) JP4151579B2 (enExample)
KR (4) KR100820992B1 (enExample)
CN (2) CN100491486C (enExample)
AU (1) AU2003211343A1 (enExample)
TW (3) TW200600557A (enExample)
WO (1) WO2003072668A1 (enExample)

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US9273215B2 (en) * 2012-10-30 2016-03-01 Rohm And Haas Electronic Materials Llc Adhesion promoter
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KR101506801B1 (ko) * 2013-08-19 2015-03-30 성균관대학교산학협력단 고강도 저유전 플라즈마 중합체 박막 및 그 제조 방법
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JP4151579B2 (ja) 2008-09-17
JP2008195945A (ja) 2008-08-28
CN1639283A (zh) 2005-07-13
KR20070038574A (ko) 2007-04-10
KR20050095788A (ko) 2005-09-30
KR100795251B1 (ko) 2008-01-15
TW200600557A (en) 2006-01-01
AU2003211343A1 (en) 2003-09-09
TWI304434B (enExample) 2008-12-21
JP2008297550A (ja) 2008-12-11
US7358300B2 (en) 2008-04-15
CN1320073C (zh) 2007-06-06
KR100819226B1 (ko) 2008-04-02
KR20040094732A (ko) 2004-11-10
TW200514828A (en) 2005-05-01
CN1637097A (zh) 2005-07-13
TW200400237A (en) 2004-01-01
TWI297718B (enExample) 2008-06-11
CN100491486C (zh) 2009-05-27
JPWO2003072668A1 (ja) 2005-06-23
TWI297717B (enExample) 2008-06-11
US20050119394A1 (en) 2005-06-02
KR20050008780A (ko) 2005-01-21
JP4169088B2 (ja) 2008-10-22
WO2003072668A1 (fr) 2003-09-04

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