KR100793129B1 - 박리성 재료 및 박리제 - Google Patents
박리성 재료 및 박리제 Download PDFInfo
- Publication number
- KR100793129B1 KR100793129B1 KR1020047011950A KR20047011950A KR100793129B1 KR 100793129 B1 KR100793129 B1 KR 100793129B1 KR 1020047011950 A KR1020047011950 A KR 1020047011950A KR 20047011950 A KR20047011950 A KR 20047011950A KR 100793129 B1 KR100793129 B1 KR 100793129B1
- Authority
- KR
- South Korea
- Prior art keywords
- silicone
- layer
- peeling
- base material
- peeling layer
- Prior art date
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Abstract
Description
조성ㆍ도포량 | 평가 결과 | |||||
실리콘 수평균 입자경 ㎚ | 실리콘 함유율* 질량% | 실리콘 도포량** g/㎡ | 박리성 | 박리 강도의 경시 변화 | 잔류 접착률 | |
실시예 1 | 440 | 20 | 1.4 | △ | × | △ |
실시예 2 | 100 | 10 | 0.5 | ○ | ○ | ○ |
실시예 3 | 100 | 20 | 1.3 | ○ | ○ | ○ |
실시예 3 | 100 | 10 | 0.5 | ○ | ○ | ○ |
실시예 4 | 180 | 10 | 0.5 | ○ | △ | △ |
실시예 5 | 100 | 10 | 0.4 | ○ | ○ | ○ |
실시예 6 | 100 | 10 | 0.5 | ○ | ○ | ○ |
비교예 1 | 440 | 10 | 3.0 | × | × | × |
비교예 2 | 440 | 10 | 0.7 | × | × | × |
* 실리콘 함유율 = 실리콘 질량 (g) / (실리콘 질량 (g) + 수지 질량 (g)) ×100 (단, 질량은 전부 고형분 기준) ** 실리콘 도포량 = 전체 도포량 (g/㎡) ×실리콘 함유율 (질량%) / 100 |
박리층 조성 | 평가 결과 | ||||||
실리콘 함유율* 질량% | 표층 규소 원자 농도 원자% | 박리성 | 박리 강도의 경시 변화 | 잔류 접착률 | 필기성 | 인자성 | |
실시예 7 | 10 | 22 | ○ | ○ | ○ | ○ | ○ |
실시예 8 | 20 | 24 | ○ | ○ | ○ | ○ | ○ |
실시예 9 | 5 | 13 | △ | △ | △ | ○ | ○ |
실시예 10 | 50 | 25 | ○ | ○ | ○ | △ | △ |
실시예 11 | 20 | 20 | ○ | ○ | ○ | ○ | ○ |
실시예 12 | 10 | 23 | ○ | ○ | ○ | ○ | ○ |
실시예 13 | 10 | 22 | ○ | ○ | ○ | ○ | ○ |
실시예 14 | 10 | 16 | ○ | △ | △ | ○ | ○ |
비교예 3 | 100 | 25 | ○ | ○ | ○ | × | × |
비교예 4 | - | 0 | × | × | × | ○ | ○ |
* 실리콘 함유율 = 실리콘 질량 (g) / (실리콘 질량 (g) + (수지 질량 (g)) ×100 (단, 질량은 전부 고형분 기준) |
Claims (40)
- 기재 및 이 기재상의 박리층을 포함하고, 이 박리층이, 카르복실산염의 기를 5~80 질량% 함유하는 폴리머와, 실리콘을 함유하며, 이 박리층의 표층부가 두께 1∼100 ㎚ 의 실리콘층을 갖는 박리성 재료.
- 제 1 항에 있어서, 이 박리층의 표층부의 실리콘층의 두께가 1∼50 ㎚ 인 박리성 재료.
- 기재 및 이 기재상의 박리층을 포함하고, 이 박리층이 카르복실산염의 기를 갖는 폴리머 및 실리콘을 함유하는 박리성 재료.
- 기재 및 이 기재상의 박리층을 포함하고, 이 박리층이,(A) 불포화 카르복실산 모노머를 5∼80 질량% 함유하는 단량체 조성물의 에멀젼 공중합체와 염기성 물질의 중화 반응에 의해 얻어지는 수지 중화물, 및(B) 실리콘 에멀젼, 실리콘 분산체, 또는 실리콘 에멀젼 및 실리콘 분산체를 사용하여 제조되는 박리성 재료.
- 제 4 항에 있어서, 이 (B) 실리콘 에멀젼, 실리콘 분산체, 또는 실리콘 에멀젼 및 실리콘 분산체의 동적 광산란법에 의해 측정되는 수평균 입자경이 200 ㎚ 이하인 박리성 재료.
- 제 4 항 또는 제 5 항에 있어서, 수지 중화물이 수용성인 박리성 재료.
- 제 4 항 또는 제 5 항에 있어서, 불포화 카르복실산 모노머가 아크릴산, 메타크릴산, 또는 아크릴산 및 메타크릴산인 박리성 재료.
- 제 4 항 또는 제 5 항에 있어서, 염기성 물질이 암모니아인 박리성 재료.
- 제 4 항 또는 제 5 항에 있어서, 수지 중화물의 pH 가 3∼13 인 박리성 재료.
- 제 4 항 또는 제 5 항에 있어서, 이 박리층이 두께 1∼100 ㎚ 인 표층부의 실리콘층을 갖는 박리성 재료.
- 제 10 항에 있어서, 이 박리층이 두께 1∼50 ㎚ 인 표층부의 실리콘층을 갖는 박리성 재료.
- 기재 및 이 기재상의 박리층을 포함하고, XPS (X 선 광전자 분광 장치) 에 의해 측정되는 이 박리층의 표층 규소 원자 농도가 10∼30 원자% 인 박리성 재료.
- 제 1 항 내지 제 5 항 중 어느 한 항에 있어서, XPS (X 선 광전자 분광 장치) 에 의해 측정되는 박리층의 표층 규소 원자 농도가 10∼30 원자% 인 박리성 재료.
- 제 12 항에 있어서, 박리층 중의 실리콘의 함유율이 1∼90 질량% 인 박리성 재료.
- 제 14 항에 있어서, 박리층 중의 실리콘의 함유율이 1∼50 질량% 인 박리성 재료.
- 기재 및 이 기재상의 박리층을 포함하고, XPS (X 선 광전자 분광 장치) 에 의해 측정되는 이 박리층의 표층 규소 원자 농도가 이 박리층 중의 실리콘 함유율로부터 계산되는 박리층 중의 평균 규소 원자 농도의 5 배 이상인 박리성 재료.
- 제 1 항 내지 제 5 항, 제 12 항, 제 14 항, 제 15 항 또는 제 16 항 중 어느 한 항에 있어서, XPS (X 선 광전자 분광 장치) 에 의해 측정되는 이 박리층의 표층 규소 원자 농도가 이 박리층 중의 실리콘 함유율로부터 계산되는 박리층 중의 평균 규소 원자 농도의 5 배 이상인 박리성 재료.
- 제 16 항에 있어서, 이 박리층 중의 실리콘 함유율로부터 계산되는 박리층 중의 평균 규소 원자 농도가 0.2∼4 원자% 인 박리성 재료.
- 제 1 항 내지 제 5 항, 제 12 항, 제 14 항 내지 제 16 항 또는 제 18 항 중 어느 한 항에 있어서, 이 박리층 중의 실리콘이 경화성 실리콘인 박리성 재료.
- 제 1 항 내지 제 5 항, 제 12 항, 제 14 항 내지 제 16 항 또는 제 18 항 중 어느 한 항에 있어서, 이 박리층 중의 실리콘이 실질적으로 Si-H 기 함유 실리콘 및 비닐실리콘으로부터 얻어지는 경화물로 이루어지는 박리성 재료.
- 제 1 항 내지 제 5 항, 제 12 항, 제 14 항 내지 제 16 항 또는 제 18 항 중 어느 한 항에 있어서, 기재가 종이, 천, 수지 라미네이트지, 수지 코팅지, 수지 필름, 수지 테이프 및 수지 시트로 이루어지는 군에서 선택되는 박리성 재료.
- 제 21 항에 있어서, 기재가 종이 또는 천 중 어느 하나인 박리성 재료.
- 카르복실산염의 기를 갖는 폴리머 및 실리콘을 함유하는 박리제.
- 제 23 항에 있어서, 실리콘이 실리콘 에멀젼, 실리콘 분산체, 또는 실리콘 에멀젼 및 실리콘 분산체의 상태에 있는 실리콘을 함유하는 박리제.
- (A) 불포화 카르복실산 모노머를 5∼80 질량% 함유하는 단량체 조성물의 에멀젼 공중합체와 염기성 물질의 중화 반응에 의해 얻어지는 수지 중화물; 및(B) 실리콘 에멀젼, 실리콘 분산체, 또는 실리콘 에멀젼 및 실리콘 분산체;를 함유하는 박리제.
- 제 24 항 또는 제 25 항에 있어서, (B) 실리콘 에멀젼, 실리콘 분산체, 또는 실리콘 에멀젼 및 실리콘 분산체의 동적 광산란법에 의해 측정되는 수평균 입자경이 200 ㎚ 이하인 박리제.
- 제 23 항 내지 제 25 항 중 어느 한 항에 있어서, 박리제 중의 전체 고형분에 대한 실리콘의 함유율이 1∼90 질량% 인 박리제.
- 제 27 항에 있어서, 박리제 중의 전체 고형분에 대한 실리콘의 함유율이 1∼50 질량% 인 박리제.
- 제 25 항에 있어서, 수지 중화물이 수용성인 박리제.
- 제 25 항에 있어서, (C) (가) 불포화 카르복실산 모노머를 5∼80 질량% 함유하는 단량체 조성물의 에멀젼 공중합체와 염기성 물질의 중화 반응에 의해 얻어지는 수지 중화물, 및 (나) 비닐실리콘을 함유하는 실리콘 에멀젼, 실리콘 분산체, 또는 실리콘 에멀젼 및 실리콘 분산체 및 VIII 족 금속 화합물로 이루어지는 박리제 원액 C, 및 (D) Si-H 기 함유 실리콘을 함유하는 실리콘 에멀젼, 실리콘 분산체, 또는 실리콘 에멀젼 및 실리콘 분산체로 이루어지는 박리제 원액 D 를 혼합함으로써 제조되는 박리제.
- 제 23 항 내지 제 25 항, 제 29 항 또는 제 30 항 중 어느 한 항에 기재된 박리제를 기재상에 도포하고, 건조시키는 것을 포함하는 박리성 재료의 제조 방법.
- 제 31 항에 있어서, 건조를 100∼250 ℃ 온도에서 실행하는 박리성 재료의 제조 방법.
- 제 31 항에 있어서, 기재가 종이, 천, 수지 라미네이트지, 수지 코팅지, 수지 필름, 수지 테이프 및 수지 시트로 이루어지는 군에서 선택되는 박리성 재료의 제조 방법.
- 제 33 항에 있어서, 기재가 종이 또는 천 중 어느 하나인 박리성 재료의 제조 방법.
- 기재, 이 기재의 편면 상의 박리층, 및 그 반대면 상의 점착제층을 포함하고, 이 기재 및 이 박리층이 제 1 항 내지 제 5 항, 제 12 항, 제 14 항 내지 제 16 항 또는 제 18 항 중 어느 한 항에 기재된 박리성 재료를 구성하는 점착 테이프.
- 기재, 이 기재의 편면 상의 박리층, 및 그 반대면 상의 점착제층을 포함하는 점착 테이프의 제조 방법에 있어서, 이 박리층 및 이 기재를 포함하는 박리성 재료가 제 31 항에 기재된 박리성 재료의 제조 방법에 의해 제조되는 점착 테이프의 제조 방법.
- 제 35 항에 있어서, 점착제층이 수용성 또는 수분산성 점착제, 또는 알칼리 용해성 또는 알칼리 분산성 점착제인 점착 테이프.
- 박리 기재, 이 박리 기재상의 박리층, 그리고 이 박리층 상에 순서대로 적층된 점착제층 및 표면 기재를 포함하고, 이 박리층 및 이 박리 기재가 제 1 항 내지 제 5 항, 제 12 항, 제 14 항 내지 제 16 항 또는 제 18 항 중 어느 한 항에 기재된 박리성 재료를 구성하는 점착 시트.
- 박리 기재, 이 박리 기재상의 박리층, 그리고 이 박리층 상에 순서대로 적층된 점착제층 및 표면 기재를 포함하는 점착 시트의 제조 방법에 있어서, 이 박리층 및 이 박리 기재를 포함하는 박리성 재료가 제 31 항에 기재된 박리성 재료의 제조 방법에 의해 제조되는 점착 시트의 제조 방법.
- 제 36 항에 있어서, 점착제층이 수용성 또는 수분산성 점착제, 또는 알칼리 용해성 또는 알칼리 분산성 점착제인 점착 테이프의 제조 방법.
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PCT/JP2003/001129 WO2003066327A1 (fr) | 2002-02-04 | 2003-02-04 | Materiau de separation et agent de separation |
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EP (1) | EP1473150B1 (ko) |
JP (1) | JP4386734B2 (ko) |
KR (1) | KR100793129B1 (ko) |
CN (2) | CN101381585A (ko) |
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US20120082791A1 (en) * | 2010-10-04 | 2012-04-05 | Robert Richard Liversage | Coating Composition Amenable to Elastomeric Substrates |
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KR20040086329A (ko) | 2004-10-08 |
CN1628029B (zh) | 2012-12-12 |
EP1473150B1 (en) | 2012-08-08 |
US7579060B2 (en) | 2009-08-25 |
EP1473150A1 (en) | 2004-11-03 |
EP1473150A4 (en) | 2006-05-24 |
AU2003207202A1 (en) | 2003-09-02 |
CN1628029A (zh) | 2005-06-15 |
JPWO2003066327A1 (ja) | 2005-05-26 |
WO2003066327A1 (fr) | 2003-08-14 |
JP4386734B2 (ja) | 2009-12-16 |
CN101381585A (zh) | 2009-03-11 |
US20050123704A1 (en) | 2005-06-09 |
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