KR100786890B1 - 감방사선성 수지 조성물 - Google Patents
감방사선성 수지 조성물 Download PDFInfo
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- KR100786890B1 KR100786890B1 KR1020010031902A KR20010031902A KR100786890B1 KR 100786890 B1 KR100786890 B1 KR 100786890B1 KR 1020010031902 A KR1020010031902 A KR 1020010031902A KR 20010031902 A KR20010031902 A KR 20010031902A KR 100786890 B1 KR100786890 B1 KR 100786890B1
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- VPORMEKWMNMAAS-UHFFFAOYSA-N CC(C)(C(C1)CC2C1C1CC2CC1)OC(C)=O Chemical compound CC(C)(C(C1)CC2C1C1CC2CC1)OC(C)=O VPORMEKWMNMAAS-UHFFFAOYSA-N 0.000 description 1
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- PLHYWWFOKSTPGE-UHFFFAOYSA-N CC(C)(C(CC1C2)C2C(C(C2)C3)C1C2C3O)OC(C)=O Chemical compound CC(C)(C(CC1C2)C2C(C(C2)C3)C1C2C3O)OC(C)=O PLHYWWFOKSTPGE-UHFFFAOYSA-N 0.000 description 1
- MRKXAJMKJOVWFH-UHFFFAOYSA-N CC(C)(C1C(C2)C(CC(C3)C#N)C3C2C1)OC(C)=O Chemical compound CC(C)(C1C(C2)C(CC(C3)C#N)C3C2C1)OC(C)=O MRKXAJMKJOVWFH-UHFFFAOYSA-N 0.000 description 1
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- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
- C08F220/28—Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety
- C08F220/283—Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety and containing one or more carboxylic moiety in the chain, e.g. acetoacetoxyethyl(meth)acrylate
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- C08F232/00—Copolymers of cyclic compounds containing no unsaturated aliphatic radicals in a side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic ring system
- C08F232/02—Copolymers of cyclic compounds containing no unsaturated aliphatic radicals in a side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic ring system having no condensed rings
- C08F232/04—Copolymers of cyclic compounds containing no unsaturated aliphatic radicals in a side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic ring system having no condensed rings having one carbon-to-carbon double bond
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- C08F232/00—Copolymers of cyclic compounds containing no unsaturated aliphatic radicals in a side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic ring system
- C08F232/08—Copolymers of cyclic compounds containing no unsaturated aliphatic radicals in a side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic ring system having condensed rings
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- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
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- G03F7/0382—Macromolecular compounds which are rendered insoluble or differentially wettable the macromolecular compound being present in a chemically amplified negative photoresist composition
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- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
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- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
- G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
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- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/091—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers characterised by antireflection means or light filtering or absorbing means, e.g. anti-halation, contrast enhancement
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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10S430/1055—Radiation sensitive composition or product or process of making
- Y10S430/106—Binder containing
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
- Y10S430/1055—Radiation sensitive composition or product or process of making
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Abstract
Description
Claims (19)
- 제2항에 있어서, (A) 성분인 수지가 주쇄, 측쇄 또는 이들 모두에 지환식 탄화수소 골격을 갖는 1종 이상의 다른 반복 단위를 추가로 포함하며, 1종 이상의 다른 반복 단위가 하기 화학식 8의 반복 단위, 하기 화학식 9의 반복 단위 및 하기 화학식 10의 반복 단위로 이루어진 군으로부터 선택되는 것인 감방사선성 수지 조성물.<화학식 8>(식 중, 각 R4는 서로 독립적으로 탄소수 1 내지 4의 직쇄상 또는 분지상 알킬기 또는 노르보르난, 트리시클로데칸, 테트라시클로도데칸, 아다만탄, 시클로부탄, 시클로펜탄, 시클로헥산, 시클로헵탄, 시클로옥탄으로부터 선택되는 기, 또는 이들 기가 메틸기, 에틸기, n-프로필기, i-프로필기, n-부틸기, 2-메틸프로필기, 1-메틸프로필기, t-부틸기, 히드록실기, 카르복실기, 히드록시메틸기, 시아노기, 시아노메틸기로 치환된 기를 나타내거나, 어느 두 개의 R4가 서로 결합하여 각각이 결합하고 있는 탄소 원자와 함께 노르보르난, 트리시클로데칸, 테트라시클로도데칸, 아다만탄, 시클로부탄, 시클로펜탄, 시클로헥산, 시클로헵탄, 시클로옥탄으로부터 선택되는 기, 또는 이들 기가 메틸기, 에틸기, n-프로필기, i-프로필기, n-부틸기, 2-메틸프로필기, 1-메틸프로필기, t-부틸기, 히드록실기, 카르복실기, 히드록시메틸기, 시아노기, 시아노메틸기로 치환된 기를 형성하고, 나머지 R4는 탄소수 1 내지 4의 직쇄상 또는 분지상 알킬기 또는 노르보르난, 트리시클로데칸, 테트라시클로도데칸, 아다만탄, 시클로부탄, 시클로펜탄, 시클로헥산, 시클로헵탄, 시클로옥탄으로부터 선택되는 기, 또는 이들 기가 메틸기, 에틸기, n-프로필기, i-프로필기, n-부틸기, 2-메틸프로필기, 1-메틸프로필기, t-부틸기, 히드록실기, 카르복실기, 히드록시메틸기, 시아노기, 시아노메틸기로 치환된 기이고, R6은 수소 원자 또는 메틸기이다.)<화학식 9>(식 중, R5는 주쇄 탄소수 1 내지 4의 직쇄상 또는 분지상의 2가 탄화수소기 또는 탄소수 3 내지 15의 2가 지환식 탄화수소기를 나타내고, R7은 수소 원자 또는 메틸기이다.)<화학식 10>(식 중, A 및 B는 서로 독립적으로 수소 원자 또는 산의 존재하에 해리되어 산성 관능기를 발생시키는 탄소수 20 이하의 산해리성기를 나타내고, 또한 A 및 B의 적어도 하나가 산해리성기이며, X 및 Y는 서로 독립적으로 수소 원자 또는 탄소수가 1 내지 4인 직쇄상 또는 분지상의 1가 알킬기를 나타내고, m은 0 내지 2의 정수이다.)
- 제5항에 있어서, (A) 성분인 수지가 주쇄, 측쇄 또는 이들 모두에 지환식 탄화수소 골격을 갖는 1종 이상의 다른 반복 단위를 추가로 포함하며, 1종 이상의 다른 반복 단위가 하기 화학식 8의 반복 단위, 하기 화학식 9의 반복 단위 및 하기 화학식 10의 반복 단위로 이루어진 군으로부터 선택되는 것인 감방사선성 수지 조성물.<화학식 8>(식 중, 각 R4는 서로 독립적으로 탄소수 1 내지 4의 직쇄상 또는 분지상의 알킬기 또는 노르보르난, 트리시클로데칸, 테트라시클로도데칸, 아다만탄, 시클로부탄, 시클로펜탄, 시클로헥산, 시클로헵탄, 시클로옥탄으로부터 선택되는 기, 또는 이들 기가 메틸기, 에틸기, n-프로필기, i-프로필기, n-부틸기, 2-메틸프로필기, 1-메틸프로필기, t-부틸기, 히드록실기, 카르복실기, 히드록시메틸기, 시아노기, 시아노메틸기로 치환된 기를 나타내거나, 어느 두 개의 R4가 서로 결합하여 각각이 결합하고 있는 탄소 원자와 함께 노르보르난, 트리시클로데칸, 테트라시클로도데칸, 아다만탄, 시클로부탄, 시클로펜탄, 시클로헥산, 시클로헵탄, 시클로옥탄으로부터 선택되는 기, 또는 이들 기가 메틸기, 에틸기, n-프로필기, i-프로필기, n-부틸기, 2-메틸프로필기, 1-메틸프로필기, t-부틸기, 히드록실기, 카르복실기, 히드록시메틸기, 시아노기, 시아노메틸기로 치환된 기를 형성하고, 나머지 R4는 탄소수 1 내지 4의 직쇄상 또는 분지상 알킬기 또는 노르보르난, 트리시클로데칸, 테트라시클로도데칸, 아다만탄, 시클로부탄, 시클로펜탄, 시클로헥산, 시클로헵탄, 시클로옥탄으로부터 선택되는 기, 또는 이들 기가 메틸기, 에틸기, n-프로필기, i-프로필기, n-부틸기, 2-메틸프로필기, 1-메틸프로필기, t-부틸기, 히드록실기, 카르복실기, 히드록시메틸기, 시아노기, 시아노메틸기로 치환된 기이고, R6은 수소 원자 또는 메틸기이다.)<화학식 9>(식 중, R5는 주쇄 탄소수 1 내지 4의 직쇄상 또는 분지상의 2가 탄화수소기 또는 탄소수 3 내지 15의 2가 지환식 탄화수소기를 나타내고, R7은 수소 원자 또는 메틸기이다.)<화학식 10>(식 중, A 및 B는 서로 독립적으로 수소 원자 또는 산의 존재하에 해리되어 산성 관능기를 발생시키는 탄소수 20 이하의 산해리성기를 나타내고, 또한 A 및 B의 적어도 하나가 산해리성기이며, X 및 Y는 서로 독립적으로 수소 원자 또는 탄소수가 1 내지 4인 직쇄상 또는 분지상의 1가 알킬기를 나타내고, m은 0 내지 2의 정수이다.)
- 제1항에 있어서, 산확산 제어제를 추가로 포함하는 감방사선성 수지 조성물.
- 제7항에 있어서, 산확산 제어제가 함질소 유기 화합물인 감방사선성 수지 조성물.
- 제1항에 있어서, 1-아다만탄카르복실산 t-부틸, 3-아다만탄카르복실산 t-부틸, 1,3-아다만탄디카르복실산 디-t-부틸, 1-아다만탄아세트산 t-부틸, 3-아다만탄아세트산 t-부틸, 1,3-아다만탄디아세트산 디-t-부틸, 2,5-디메틸-2,5-디(아다만틸카르보닐옥시)헥산; 데옥시콜산 t-부틸, 데옥시콜산 t-부톡시카르보닐메틸, 데옥시콜산 2-에톡시에틸, 데옥시콜산 2-시클로헥실옥시에틸, 데옥시콜산 3-옥소시클로헥실, 데옥시콜산 테트라히드로피라닐, 데옥시콜산 메발로노락톤에스테르; 리토콜산 t-부틸, 리토콜산 t-부톡시카르보닐메틸, 리토콜산 2-에톡시에틸, 리토콜산 2-시클로헥실옥시에틸, 리토콜산 3-옥소시클로헥실, 리토콜산 테트라히드로피라닐, 리토콜산 메발로노락톤에스테르로부터 선택되는, 산해리성 유기기를 갖는 지환족 첨가제를 추가로 포함하는 감방사선성 수지 조성물.
- 제1항에 있어서, 직쇄상 또는 분지상의 케톤류, 환상의 케톤류, 프로필렌 글리콜 모노알킬 에테르아세테이트류, 2-히드록시프로피온산 알킬류 및 3-알콕시프로피온산 알킬류로 이루어진 군으로부터 선택되는 1종 이상의 용매를 추가로 포함하는 감방사선성 수지 조성물.
- 제1항에 있어서, (A) 성분인 수지의 겔 투과 크로마토그래피에 의한 폴리스티렌 환산 중량평균 분자량이 5,000 내지 100,000인 감방사선성 수지 조성물.
- 제1항에 있어서, (B) 성분인 감방사선성 산발생제가 오늄염 화합물, 할로겐 함유 화합물, 디아조케톤 화합물, 술폰 화합물 및 술폰산 화합물로 이루어진 군으로부터 선택되는 1종 이상의 화합물인 감방사선성 수지 조성물.
- 제1항에 있어서, (A) 성분인 수지가 주쇄, 측쇄 또는 이들 모두에 지환식 탄화수소 골격을 갖는 1종 이상의 다른 반복 단위를 추가로 포함하는 것인 감방사선성 수지 조성물.
- 제2항에 있어서, (A) 성분인 수지에서 상기 화학식 2의 반복 단위의 함유율이 10 내지 70 몰%인 감방사선성 수지 조성물.
- 제4항에 있어서, (A) 성분인 수지에서 상기 화학식 8 내지 10의 반복 단위의 총 함유율이 5 내지 70 몰%인 감방사선성 수지 조성물.
- 제2항에 있어서, (A) 성분인 수지가 주쇄, 측쇄 또는 이들 모두에 지환식 탄화수소 골격을 갖는 1종 이상의 다른 반복 단위를 추가로 포함하는 것인 감방사선성 수지 조성물.
- 제5항에 있어서, (A) 성분인 수지에서 상기 화학식 3의 반복 단위의 함유율이 10 내지 70 몰%인 감방사선성 수지 조성물.
- 제6항에 있어서, (A) 성분인 수지에서 상기 화학식 8 내지 10의 반복 단위의 총 함유율이 5 내지 70 몰%인 감방사선성 수지 조성물.
- 제5항에 있어서, (A) 성분인 수지가 주쇄, 측쇄 또는 이들 모두에 지환식 탄화수소 골격을 갖는 1종 이상의 다른 반복 단위를 추가로 포함하는 감방사선성 수지 조성물.
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- 2001-06-07 EP EP01113944A patent/EP1162506A1/en not_active Withdrawn
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TWI246634B (en) | 2006-01-01 |
US20020009667A1 (en) | 2002-01-24 |
EP1162506A1 (en) | 2001-12-12 |
JP2002062657A (ja) | 2002-02-28 |
US6753124B2 (en) | 2004-06-22 |
KR20010112583A (ko) | 2001-12-20 |
JP4576737B2 (ja) | 2010-11-10 |
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