KR100745331B1 - 감방사선성 조성물, 절연막 및 유기 ｅｌ 표시 소자 - Google Patents

감방사선성 조성물, 절연막 및 유기 ｅｌ 표시 소자 Download PDF

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Publication number
KR100745331B1
KR100745331B1 KR1020027003009A KR20027003009A KR100745331B1 KR 100745331 B1 KR100745331 B1 KR 100745331B1 KR 1020027003009 A KR1020027003009 A KR 1020027003009A KR 20027003009 A KR20027003009 A KR 20027003009A KR 100745331 B1 KR100745331 B1 KR 100745331B1
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South Korea
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organic
resin
compound
insulating film
composition
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Expired - Lifetime
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KR1020027003009A
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English (en)
Korean (ko)
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KR20020072529A (ko
Inventor
마사요시 스즈끼
히로후미 사사끼
이사오 니시무라
후미꼬 요네자와
마사유끼 엔도
가즈아끼 니와
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제이에스알 가부시끼가이샤
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Priority claimed from JP2000226468A external-priority patent/JP3909552B2/ja
Priority claimed from JP2000370381A external-priority patent/JP3915402B2/ja
Priority claimed from JP2000379680A external-priority patent/JP2002182380A/ja
Application filed by 제이에스알 가부시끼가이샤 filed Critical 제이에스알 가부시끼가이샤
Publication of KR20020072529A publication Critical patent/KR20020072529A/ko
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
    • G03F7/0236—Condensation products of carbonyl compounds and phenolic compounds, e.g. novolak resins
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
    • G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/0226—Quinonediazides characterised by the non-macromolecular additives
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0382—Macromolecular compounds which are rendered insoluble or differentially wettable the macromolecular compound being present in a chemically amplified negative photoresist composition
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0755—Non-macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations

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  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Materials For Photolithography (AREA)
  • Electroluminescent Light Sources (AREA)
KR1020027003009A 2000-07-27 2001-07-26 감방사선성 조성물, 절연막 및 유기 ｅｌ 표시 소자 Expired - Lifetime KR100745331B1 (ko)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2000226468A JP3909552B2 (ja) 2000-07-27 2000-07-27 感放射線性樹脂組成物および有機ｅｌ素子の絶縁膜
JPJP-P-2000-00226468 2000-07-27
JPJP-P-2000-00370381 2000-12-05
JP2000370381A JP3915402B2 (ja) 2000-12-05 2000-12-05 有機ｅｌ表示素子の絶縁膜形成用感放射線性樹脂組成物、それから形成された絶縁膜、および有機ｅｌ表示素子
JP2000379680A JP2002182380A (ja) 2000-12-14 2000-12-14 有機ｅｌ表示素子の絶縁膜形成用感放射線性樹脂組成物、それから形成された絶縁膜、および有機ｅｌ表示素子
JPJP-P-2000-00379680 2000-12-14

Publications (2)

Publication Number Publication Date
KR20020072529A KR20020072529A (ko) 2002-09-16
KR100745331B1 true KR100745331B1 (ko) 2007-08-02

Family

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KR1020027003009A Expired - Lifetime KR100745331B1 (ko) 2000-07-27 2001-07-26 감방사선성 조성물, 절연막 및 유기 ｅｌ 표시 소자

Country Status (5)

Country Link
US (1) US6797450B2 (enExample)
EP (1) EP1312982A4 (enExample)
KR (1) KR100745331B1 (enExample)
TW (1) TWI297104B (enExample)
WO (1) WO2002010859A1 (enExample)

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JP4524944B2 (ja) * 2001-03-28 2010-08-18 Ｊｓｒ株式会社 感放射線性樹脂組成物、その層間絶縁膜およびマイクロレンズの形成への使用、ならびに層間絶縁膜およびマイクロレンズ
US6984476B2 (en) * 2002-04-15 2006-01-10 Sharp Kabushiki Kaisha Radiation-sensitive resin composition, forming process for forming patterned insulation film, active matrix board and flat-panel display device equipped with the same, and process for producing flat-panel display device
DE60336216D1 (de) * 2002-04-18 2011-04-14 Nissan Chemical Ind Ltd Positiv lichtempfindliche harzzusammensetzung und verfahren zur strukturausbildung
JP4232527B2 (ja) * 2003-05-09 2009-03-04 Ｊｓｒ株式会社 垂直配向型液晶表示素子用の突起および垂直配向型液晶表示素子用のスペーサーの形成方法
US7221095B2 (en) * 2003-06-16 2007-05-22 Semiconductor Energy Laboratory Co., Ltd. Light emitting device and method for fabricating light emitting device
KR100571721B1 (ko) * 2004-02-10 2006-04-17 삼성전자주식회사 신너 조성물 및 이를 이용한 포토레지스트의 제거 방법
JP4993119B2 (ja) 2005-04-19 2012-08-08 日産化学工業株式会社 光架橋硬化のレジスト下層膜を形成するためのレジスト下層膜形成組成物
JP5048754B2 (ja) * 2006-04-13 2012-10-17 コーロン インダストリーズ インク ポジティブ型フォトレジスト用組成物およびこれから製造されたポジティブ型フォトレジストフィルム
JP2008077057A (ja) * 2006-08-21 2008-04-03 Jsr Corp 感光性絶縁樹脂組成物及びその硬化物並びにそれを備える電子部品
KR101249992B1 (ko) * 2007-07-03 2013-04-02 주식회사 엘지화학 유기 절연막용 감광성 수지 조성물 및 이로부터 제조된유기 절연막
JP5240380B1 (ja) * 2011-07-05 2013-07-17 Ｊｓｒ株式会社 樹脂組成物、重合体、硬化膜および電子部品
CN103988127B (zh) 2011-12-09 2019-04-19 旭化成株式会社 感光性树脂组合物、固化浮雕图案的制造方法、半导体装置及显示体装置
KR101413078B1 (ko) * 2011-12-30 2014-07-02 제일모직 주식회사 포지티브형 감광성 수지 조성물
KR101249997B1 (ko) * 2012-02-29 2013-04-03 주식회사 엘지화학 유기 절연막용 감광성 수지 조성물 및 이로부터 제조된 유기 절연막
JP6155823B2 (ja) * 2012-07-12 2017-07-05 Jsr株式会社 有機ｅｌ素子、感放射線性樹脂組成物および硬化膜
JP6247014B2 (ja) * 2013-04-04 2017-12-13 東京応化工業株式会社 感光性樹脂組成物
JP6621233B2 (ja) * 2014-07-25 2019-12-18 東京応化工業株式会社 有機ｅｌ表示素子における絶縁膜形成用の感光性樹脂組成物
CN109426070A (zh) * 2017-08-25 2019-03-05 京东方科技集团股份有限公司 光刻胶组合物、金属图案以及阵列基板的制备方法
CN111138616B (zh) * 2018-11-02 2022-03-08 万华化学（北京）有限公司 一种胺扩链剂及其制备方法，及聚氨酯泡沫

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JPS59184337A (ja) 1983-04-04 1984-10-19 Hitachi Ltd 感光性耐熱材料
JPH0284654A (ja) * 1988-06-30 1990-03-26 Fuji Photo Film Co Ltd ポジ型フオトレジスト組成物
JPH10270173A (ja) * 1997-03-27 1998-10-09 Junji Kido 有機エレクトロルミネッセント素子及びその製造方法
JPH1152560A (ja) 1997-08-06 1999-02-26 Jsr Corp 感放射線性樹脂組成物
JPH11223948A (ja) 1998-11-27 1999-08-17 Jsr Corp ネガ型感放射線性樹脂組成物
JPH11233259A (ja) 1997-10-15 1999-08-27 Siemens Ag 有機系エレクトロルミネセンスデバイスの製造方法

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US5691101A (en) * 1994-03-15 1997-11-25 Kabushiki Kaisha Toshiba Photosensitive composition
JP3024695B2 (ja) * 1994-06-08 2000-03-21 東京応化工業株式会社 ポジ型ホトレジスト組成物
US6168908B1 (en) 1997-10-09 2001-01-02 Jsr Corporation Process for forming a cured film of a thermoplastic resin
JPH11237737A (ja) * 1997-12-19 1999-08-31 Kansai Shingijutsu Kenkyusho:Kk 感光性樹脂組成物およびその製造方法
US5985507A (en) * 1998-02-18 1999-11-16 Olin Microelectronic Chemicals, Inc. Selected high thermal novolaks and positive-working radiation-sensitive compositions
KR100668244B1 (ko) * 1999-02-15 2007-01-17 에이제토 엘렉토로닉 마티리알즈 가부시키가이샤 감광성 수지 조성물
JP2000347397A (ja) * 1999-06-04 2000-12-15 Jsr Corp 感放射線性樹脂組成物およびその層間絶縁膜への使用
WO2002001922A1 (en) * 2000-06-28 2002-01-03 Toray Industries, Inc. Display

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59184337A (ja) 1983-04-04 1984-10-19 Hitachi Ltd 感光性耐熱材料
JPH0284654A (ja) * 1988-06-30 1990-03-26 Fuji Photo Film Co Ltd ポジ型フオトレジスト組成物
JPH10270173A (ja) * 1997-03-27 1998-10-09 Junji Kido 有機エレクトロルミネッセント素子及びその製造方法
JPH1152560A (ja) 1997-08-06 1999-02-26 Jsr Corp 感放射線性樹脂組成物
JPH11233259A (ja) 1997-10-15 1999-08-27 Siemens Ag 有機系エレクトロルミネセンスデバイスの製造方法
JPH11223948A (ja) 1998-11-27 1999-08-17 Jsr Corp ネガ型感放射線性樹脂組成物

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Publication number Publication date
US20030054284A1 (en) 2003-03-20
KR20020072529A (ko) 2002-09-16
TWI297104B (enExample) 2008-05-21
EP1312982A4 (en) 2007-11-07
EP1312982A1 (en) 2003-05-21
WO2002010859A1 (en) 2002-02-07
US6797450B2 (en) 2004-09-28

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