KR100698916B1 - 접착제 조성물, 회로접속재료, 회로부재의 접속구조체 및 반도체장치 - Google Patents

접착제 조성물, 회로접속재료, 회로부재의 접속구조체 및 반도체장치 Download PDF

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Publication number
KR100698916B1
KR100698916B1 KR1020050025411A KR20050025411A KR100698916B1 KR 100698916 B1 KR100698916 B1 KR 100698916B1 KR 1020050025411 A KR1020050025411 A KR 1020050025411A KR 20050025411 A KR20050025411 A KR 20050025411A KR 100698916 B1 KR100698916 B1 KR 100698916B1
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KR
South Korea
Prior art keywords
circuit
adhesive composition
radical polymerization
semiconductor element
polymerization initiator
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KR1020050025411A
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English (en)
Korean (ko)
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KR20060044832A (ko
Inventor
시게키 카토기
호코 스토
히로유키 이자와
마사미 유사
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히다치 가세고교 가부시끼가이샤
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Publication of KR20060044832A publication Critical patent/KR20060044832A/ko
Application granted granted Critical
Publication of KR100698916B1 publication Critical patent/KR100698916B1/ko

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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16HGEARING
    • F16H3/00Toothed gearings for conveying rotary motion with variable gear ratio or for reversing rotary motion
    • F16H3/44Toothed gearings for conveying rotary motion with variable gear ratio or for reversing rotary motion using gears having orbital motion
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16HGEARING
    • F16H55/00Elements with teeth or friction surfaces for conveying motion; Worms, pulleys or sheaves for gearing mechanisms
    • F16H55/02Toothed members; Worms
    • F16H55/08Profiling
    • F16H55/0806Involute profile
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16HGEARING
    • F16H55/00Elements with teeth or friction surfaces for conveying motion; Worms, pulleys or sheaves for gearing mechanisms
    • F16H55/02Toothed members; Worms
    • F16H55/08Profiling
    • F16H2055/0866Profiles for improving radial engagement of gears, e.g. chamfers on the tips of the teeth
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/15Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01079Gold [Au]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06Polymers
    • H01L2924/078Adhesive characteristics other than chemical
    • H01L2924/0781Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H01L2924/07811Extrinsic, i.e. with electrical conductive fillers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701Low temperature co-fired ceramic [LTCC]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/102Material of the semiconductor or solid state bodies
    • H01L2924/1025Semiconducting materials
    • H01L2924/10251Elemental semiconductors, i.e. Group IV
    • H01L2924/10253Silicon [Si]

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
  • Wire Bonding (AREA)
  • Adhesive Tapes (AREA)
KR1020050025411A 2004-05-10 2005-03-28 접착제 조성물, 회로접속재료, 회로부재의 접속구조체 및 반도체장치 KR100698916B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004140181A JP2005320455A (ja) 2004-05-10 2004-05-10 接着剤組成物、回路接続材料、回路部材の接続構造及び半導体装置
JPJP-P-2004-00140181 2004-05-10

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020060121896A Division KR100832625B1 (ko) 2004-05-10 2006-12-05 회로접속재료

Publications (2)

Publication Number Publication Date
KR20060044832A KR20060044832A (ko) 2006-05-16
KR100698916B1 true KR100698916B1 (ko) 2007-03-23

Family

ID=35349130

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020050025411A KR100698916B1 (ko) 2004-05-10 2005-03-28 접착제 조성물, 회로접속재료, 회로부재의 접속구조체 및 반도체장치
KR1020060121896A KR100832625B1 (ko) 2004-05-10 2006-12-05 회로접속재료

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020060121896A KR100832625B1 (ko) 2004-05-10 2006-12-05 회로접속재료

Country Status (4)

Country Link
JP (1) JP2005320455A (zh)
KR (2) KR100698916B1 (zh)
CN (2) CN1304517C (zh)
TW (3) TWI265191B (zh)

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KR100727741B1 (ko) 2005-12-30 2007-06-13 제일모직주식회사 초속경화용 이방도전성 접착제 및 이를 이용한 이방도전성필름상 접속 부재
CN102174300B (zh) 2006-04-26 2015-05-13 日立化成株式会社 粘接带及使用其的太阳能电池模块
WO2007129711A1 (ja) * 2006-05-09 2007-11-15 Hitachi Chemical Company, Ltd. 接着シート、これを用いた回路部材の接続構造及び半導体装置
JP5137347B2 (ja) * 2006-07-12 2013-02-06 旭化成イーマテリアルズ株式会社 熱硬化性コーティング組成物
KR101063602B1 (ko) * 2006-08-22 2011-09-07 히다치 가세고교 가부시끼가이샤 회로 접속 재료, 회로 부재의 접속 구조 및 회로 부재의 접속 구조의 제조 방법
CN101617267B (zh) * 2007-02-20 2012-08-15 三井化学株式会社 液晶密封用固化性树脂组合物及使用该组合物的液晶显示面板的制造方法
US20080292801A1 (en) * 2007-05-23 2008-11-27 National Starch And Chemical Investment Holding Corporation Corrosion-Preventive Adhesive Compositions
JP5292838B2 (ja) * 2007-08-30 2013-09-18 日立化成株式会社 接着剤、及び回路部材の接続構造体
US8124232B2 (en) * 2007-10-22 2012-02-28 Nippon Chemical Industrial Co., Ltd. Coated conductive powder and conductive adhesive using the same
CN102090154B (zh) * 2008-07-11 2014-11-05 迪睿合电子材料有限公司 各向异性导电薄膜
TWI382225B (zh) * 2008-08-06 2013-01-11 Au Optronics Corp 液晶顯示器及其封裝方法
KR101683312B1 (ko) * 2008-09-30 2016-12-06 데쿠세리아루즈 가부시키가이샤 이방성 도전 접착제 및 그것을 사용한 접속 구조체의 제조 방법
WO2010125965A1 (ja) * 2009-04-28 2010-11-04 日立化成工業株式会社 回路接続材料、これを用いたフィルム状回路接続材料、回路部材の接続構造及び回路部材の接続方法
JP5621320B2 (ja) * 2010-05-19 2014-11-12 デクセリアルズ株式会社 接続構造体の製造方法
JP5293779B2 (ja) * 2010-07-20 2013-09-18 日立化成株式会社 接着剤組成物、回路接続構造体、半導体装置及び太陽電池モジュール
KR20120068751A (ko) * 2010-07-26 2012-06-27 히다치 가세고교 가부시끼가이샤 접착제 조성물, 접속 구조체, 접속 구조체의 제조 방법 및 접착제 조성물의 용도
KR101293788B1 (ko) * 2010-11-24 2013-08-06 제일모직주식회사 이방 전도성 필름용 조성물 및 이를 이용한 이방 전도성 필름
KR20120076187A (ko) * 2010-12-29 2012-07-09 제일모직주식회사 이방 도전성 필름
WO2013035164A1 (ja) * 2011-09-06 2013-03-14 日立化成株式会社 接着剤組成物及び接続体
JP5844588B2 (ja) * 2011-09-21 2016-01-20 デクセリアルズ株式会社 回路接続材料及びそれを用いた接続方法並びに接続構造体
TWI591151B (zh) 2013-05-24 2017-07-11 明基材料股份有限公司 一種用於電子元件間電性導通的黏著劑
CN103360956B (zh) * 2013-06-18 2015-06-03 明基材料有限公司 一种用于电子元件间电性导通的粘着剂
JP6398570B2 (ja) * 2013-10-09 2018-10-03 日立化成株式会社 回路接続材料、回路部材の接続構造体、及び回路部材の接続構造体の製造方法

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JP3749032B2 (ja) * 1999-01-14 2006-02-22 株式会社フジクラ 導波路型光デバイスと光ファイバの接続切換方法
WO2000046315A1 (fr) * 1999-02-08 2000-08-10 Hitachi Chemical Co., Ltd. Adhesif, structure de connexion d'electrodes, et procede de connexion d'electrodes
JP2001323246A (ja) * 2000-03-07 2001-11-22 Sony Chem Corp 電極接続用接着剤及びこれを用いた接着方法
JP2001262078A (ja) * 2000-03-17 2001-09-26 Sony Chem Corp 接続材料
CN1214455C (zh) * 2000-04-25 2005-08-10 日立化成工业株式会社 电路连接用粘接剂、使用其的电路连接方法及电路连接结构体
JP4599666B2 (ja) * 2000-06-29 2010-12-15 日立化成工業株式会社 導電性樹脂ペースト組成物及びこれを用いた半導体装置
JP2002184487A (ja) * 2000-12-15 2002-06-28 Sony Chem Corp 異方性導電接着剤
JP4590732B2 (ja) * 2000-12-28 2010-12-01 日立化成工業株式会社 回路接続材料及びそれを用いた回路板の製造方法、回路板
JP2002201456A (ja) * 2000-12-28 2002-07-19 Hitachi Chem Co Ltd 接着剤組成物、それを用いた回路端子の接続方法及び回路端子の接続構造
TWI334880B (en) * 2000-12-28 2010-12-21 Hitachi Chemical Co Ltd Circuit connecting adhesive with anisotropic conductivity connecting method of circuit board and circuit connecting construction by using the adhesive
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JP2004067908A (ja) * 2002-08-07 2004-03-04 Sumitomo Bakelite Co Ltd 異方導電性接着剤

Also Published As

Publication number Publication date
TW200718765A (en) 2007-05-16
CN1970673A (zh) 2007-05-30
CN1696234A (zh) 2005-11-16
TWI343408B (zh) 2011-06-11
KR20070001854A (ko) 2007-01-04
CN1304517C (zh) 2007-03-14
KR20060044832A (ko) 2006-05-16
TW200619342A (en) 2006-06-16
CN1970673B (zh) 2012-03-28
TWI277642B (en) 2007-04-01
KR100832625B1 (ko) 2008-05-27
JP2005320455A (ja) 2005-11-17
TW200536921A (en) 2005-11-16
TWI265191B (en) 2006-11-01

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