JP2005320455A - 接着剤組成物、回路接続材料、回路部材の接続構造及び半導体装置 - Google Patents

接着剤組成物、回路接続材料、回路部材の接続構造及び半導体装置 Download PDF

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Publication number
JP2005320455A
JP2005320455A JP2004140181A JP2004140181A JP2005320455A JP 2005320455 A JP2005320455 A JP 2005320455A JP 2004140181 A JP2004140181 A JP 2004140181A JP 2004140181 A JP2004140181 A JP 2004140181A JP 2005320455 A JP2005320455 A JP 2005320455A
Authority
JP
Japan
Prior art keywords
circuit
adhesive composition
radical polymerization
polymerization initiator
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2004140181A
Other languages
English (en)
Japanese (ja)
Inventor
Shigeki Katogi
茂樹 加藤木
Tomoko Sudo
朋子 須藤
Hiroyuki Izawa
弘行 伊澤
Masami Yusa
正己 湯佐
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co Ltd
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP2004140181A priority Critical patent/JP2005320455A/ja
Priority to TW094106487A priority patent/TWI265191B/zh
Priority to TW095141736A priority patent/TW200718765A/zh
Priority to TW095100333A priority patent/TWI277642B/zh
Priority to KR1020050025411A priority patent/KR100698916B1/ko
Priority to CN2006101468870A priority patent/CN1970673B/zh
Priority to CNB2005100694795A priority patent/CN1304517C/zh
Publication of JP2005320455A publication Critical patent/JP2005320455A/ja
Priority to KR1020060121896A priority patent/KR100832625B1/ko
Withdrawn legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16H—GEARING
    • F16H3/00—Toothed gearings for conveying rotary motion with variable gear ratio or for reversing rotary motion
    • F16H3/44—Toothed gearings for conveying rotary motion with variable gear ratio or for reversing rotary motion using gears having orbital motion
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16H—GEARING
    • F16H55/00—Elements with teeth or friction surfaces for conveying motion; Worms, pulleys or sheaves for gearing mechanisms
    • F16H55/02—Toothed members; Worms
    • F16H55/08—Profiling
    • F16H55/0806—Involute profile
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16H—GEARING
    • F16H55/00—Elements with teeth or friction surfaces for conveying motion; Worms, pulleys or sheaves for gearing mechanisms
    • F16H55/02—Toothed members; Worms
    • F16H55/08—Profiling
    • F16H2055/0866—Profiles for improving radial engagement of gears, e.g. chamfers on the tips of the teeth
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
  • Wire Bonding (AREA)
  • Adhesive Tapes (AREA)
JP2004140181A 2004-05-10 2004-05-10 接着剤組成物、回路接続材料、回路部材の接続構造及び半導体装置 Withdrawn JP2005320455A (ja)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP2004140181A JP2005320455A (ja) 2004-05-10 2004-05-10 接着剤組成物、回路接続材料、回路部材の接続構造及び半導体装置
TW094106487A TWI265191B (en) 2004-05-10 2005-03-03 Adhesive composition, material for connecting circuit, connecting structure of circuit member and semiconductor device
TW095141736A TW200718765A (en) 2004-05-10 2005-03-03 Adhesive composition, material for connecting circuit, connecting structure of circuit member and semiconductor device
TW095100333A TWI277642B (en) 2004-05-10 2005-03-03 Semiconductor devices containing adhesive composition
KR1020050025411A KR100698916B1 (ko) 2004-05-10 2005-03-28 접착제 조성물, 회로접속재료, 회로부재의 접속구조체 및 반도체장치
CN2006101468870A CN1970673B (zh) 2004-05-10 2005-05-09 电路连接材料
CNB2005100694795A CN1304517C (zh) 2004-05-10 2005-05-09 胶粘剂组合物、电路连接材料、电路部件的连接结构及半导体装置
KR1020060121896A KR100832625B1 (ko) 2004-05-10 2006-12-05 회로접속재료

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004140181A JP2005320455A (ja) 2004-05-10 2004-05-10 接着剤組成物、回路接続材料、回路部材の接続構造及び半導体装置

Publications (1)

Publication Number Publication Date
JP2005320455A true JP2005320455A (ja) 2005-11-17

Family

ID=35349130

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004140181A Withdrawn JP2005320455A (ja) 2004-05-10 2004-05-10 接着剤組成物、回路接続材料、回路部材の接続構造及び半導体装置

Country Status (4)

Country Link
JP (1) JP2005320455A (zh)
KR (2) KR100698916B1 (zh)
CN (2) CN1304517C (zh)
TW (3) TWI265191B (zh)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100727741B1 (ko) 2005-12-30 2007-06-13 제일모직주식회사 초속경화용 이방도전성 접착제 및 이를 이용한 이방도전성필름상 접속 부재
JP2008019327A (ja) * 2006-07-12 2008-01-31 Asahi Kasei Electronics Co Ltd 熱硬化性コーティング組成物
JP2009074027A (ja) * 2007-08-30 2009-04-09 Hitachi Chem Co Ltd 接着剤、及び回路部材の接続構造体
JPWO2007129711A1 (ja) * 2006-05-09 2009-09-17 日立化成工業株式会社 接着シート、これを用いた回路部材の接続構造及び半導体装置
WO2010038753A1 (ja) * 2008-09-30 2010-04-08 ソニーケミカル＆インフォメーションデバイス株式会社 異方性導電接着剤及びそれを用いた接続構造体の製造方法
JP2010528153A (ja) * 2007-05-23 2010-08-19 ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェン 防食接着剤組成物
JP2011061241A (ja) * 2006-04-26 2011-03-24 Hitachi Chem Co Ltd 接着剤
US20110110066A1 (en) * 2008-07-11 2011-05-12 Sony Chemical & Information Device Corporation Anisotropic conductive film
JP2011243786A (ja) * 2010-05-19 2011-12-01 Sony Chemical & Information Device Corp 接続構造体の製造方法

Families Citing this family (14)

* Cited by examiner, † Cited by third party
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KR101063602B1 (ko) * 2006-08-22 2011-09-07 히다치 가세고교 가부시끼가이샤 회로 접속 재료, 회로 부재의 접속 구조 및 회로 부재의 접속 구조의 제조 방법
CN101617267B (zh) * 2007-02-20 2012-08-15 三井化学株式会社 液晶密封用固化性树脂组合物及使用该组合物的液晶显示面板的制造方法
US8124232B2 (en) * 2007-10-22 2012-02-28 Nippon Chemical Industrial Co., Ltd. Coated conductive powder and conductive adhesive using the same
TWI382225B (zh) * 2008-08-06 2013-01-11 Au Optronics Corp 液晶顯示器及其封裝方法
WO2010125965A1 (ja) * 2009-04-28 2010-11-04 日立化成工業株式会社 回路接続材料、これを用いたフィルム状回路接続材料、回路部材の接続構造及び回路部材の接続方法
JP5293779B2 (ja) * 2010-07-20 2013-09-18 日立化成株式会社 接着剤組成物、回路接続構造体、半導体装置及び太陽電池モジュール
KR20120068751A (ko) * 2010-07-26 2012-06-27 히다치 가세고교 가부시끼가이샤 접착제 조성물, 접속 구조체, 접속 구조체의 제조 방법 및 접착제 조성물의 용도
KR101293788B1 (ko) * 2010-11-24 2013-08-06 제일모직주식회사 이방 전도성 필름용 조성물 및 이를 이용한 이방 전도성 필름
KR20120076187A (ko) * 2010-12-29 2012-07-09 제일모직주식회사 이방 도전성 필름
WO2013035164A1 (ja) * 2011-09-06 2013-03-14 日立化成株式会社 接着剤組成物及び接続体
JP5844588B2 (ja) * 2011-09-21 2016-01-20 デクセリアルズ株式会社 回路接続材料及びそれを用いた接続方法並びに接続構造体
TWI591151B (zh) 2013-05-24 2017-07-11 明基材料股份有限公司 一種用於電子元件間電性導通的黏著劑
CN103360956B (zh) * 2013-06-18 2015-06-03 明基材料有限公司 一种用于电子元件间电性导通的粘着剂
JP6398570B2 (ja) * 2013-10-09 2018-10-03 日立化成株式会社 回路接続材料、回路部材の接続構造体、及び回路部材の接続構造体の製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002201456A (ja) * 2000-12-28 2002-07-19 Hitachi Chem Co Ltd 接着剤組成物、それを用いた回路端子の接続方法及び回路端子の接続構造
JP2003282637A (ja) * 2002-03-27 2003-10-03 Hitachi Chem Co Ltd 回路接続用接着剤組成物及びそれを用いた回路接続構造体
JP2004067908A (ja) * 2002-08-07 2004-03-04 Sumitomo Bakelite Co Ltd 異方導電性接着剤

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JP3749032B2 (ja) * 1999-01-14 2006-02-22 株式会社フジクラ 導波路型光デバイスと光ファイバの接続切換方法
WO2000046315A1 (fr) * 1999-02-08 2000-08-10 Hitachi Chemical Co., Ltd. Adhesif, structure de connexion d'electrodes, et procede de connexion d'electrodes
JP2001323246A (ja) * 2000-03-07 2001-11-22 Sony Chem Corp 電極接続用接着剤及びこれを用いた接着方法
JP2001262078A (ja) * 2000-03-17 2001-09-26 Sony Chem Corp 接続材料
CN1214455C (zh) * 2000-04-25 2005-08-10 日立化成工业株式会社 电路连接用粘接剂、使用其的电路连接方法及电路连接结构体
JP4599666B2 (ja) * 2000-06-29 2010-12-15 日立化成工業株式会社 導電性樹脂ペースト組成物及びこれを用いた半導体装置
JP2002184487A (ja) * 2000-12-15 2002-06-28 Sony Chem Corp 異方性導電接着剤
JP4590732B2 (ja) * 2000-12-28 2010-12-01 日立化成工業株式会社 回路接続材料及びそれを用いた回路板の製造方法、回路板
TWI334880B (en) * 2000-12-28 2010-12-21 Hitachi Chemical Co Ltd Circuit connecting adhesive with anisotropic conductivity connecting method of circuit board and circuit connecting construction by using the adhesive

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002201456A (ja) * 2000-12-28 2002-07-19 Hitachi Chem Co Ltd 接着剤組成物、それを用いた回路端子の接続方法及び回路端子の接続構造
JP2003282637A (ja) * 2002-03-27 2003-10-03 Hitachi Chem Co Ltd 回路接続用接着剤組成物及びそれを用いた回路接続構造体
JP2004067908A (ja) * 2002-08-07 2004-03-04 Sumitomo Bakelite Co Ltd 異方導電性接着剤

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100727741B1 (ko) 2005-12-30 2007-06-13 제일모직주식회사 초속경화용 이방도전성 접착제 및 이를 이용한 이방도전성필름상 접속 부재
JP2011061241A (ja) * 2006-04-26 2011-03-24 Hitachi Chem Co Ltd 接着剤
US8969707B2 (en) 2006-04-26 2015-03-03 Hitachi Chemical Company, Ltd. Adhesive tape and solar cell module using the same
JP2012216843A (ja) * 2006-04-26 2012-11-08 Hitachi Chem Co Ltd 接着テープ及びそれを用いた太陽電池モジュール
US8969706B2 (en) 2006-04-26 2015-03-03 Hitachi Chemical Company, Ltd. Adhesive tape and solar cell module using the same
JP2011066448A (ja) * 2006-04-26 2011-03-31 Hitachi Chem Co Ltd 接着テープ及びそれを用いた太陽電池モジュール
JPWO2007129711A1 (ja) * 2006-05-09 2009-09-17 日立化成工業株式会社 接着シート、これを用いた回路部材の接続構造及び半導体装置
KR101081263B1 (ko) * 2006-05-09 2011-11-08 히다치 가세고교 가부시끼가이샤 접착 시트, 이를 이용한 회로 부재의 접속 구조 및 반도체 장치
JP2011256391A (ja) * 2006-05-09 2011-12-22 Hitachi Chem Co Ltd 回路接続用接着シート及びこれを用いた回路接続材料の基板への固定方法
JP4905352B2 (ja) * 2006-05-09 2012-03-28 日立化成工業株式会社 接着シート、これを用いた回路部材の接続構造及び半導体装置
JP2008019327A (ja) * 2006-07-12 2008-01-31 Asahi Kasei Electronics Co Ltd 熱硬化性コーティング組成物
JP2010528153A (ja) * 2007-05-23 2010-08-19 ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェン 防食接着剤組成物
JP2009074027A (ja) * 2007-08-30 2009-04-09 Hitachi Chem Co Ltd 接着剤、及び回路部材の接続構造体
US20110110066A1 (en) * 2008-07-11 2011-05-12 Sony Chemical & Information Device Corporation Anisotropic conductive film
US8715833B2 (en) * 2008-07-11 2014-05-06 Sony Chemical & Information Device Corporation Anisotropic conductive film
WO2010038753A1 (ja) * 2008-09-30 2010-04-08 ソニーケミカル＆インフォメーションデバイス株式会社 異方性導電接着剤及びそれを用いた接続構造体の製造方法
JP2011243786A (ja) * 2010-05-19 2011-12-01 Sony Chemical & Information Device Corp 接続構造体の製造方法

Also Published As

Publication number Publication date
TW200718765A (en) 2007-05-16
CN1970673A (zh) 2007-05-30
CN1696234A (zh) 2005-11-16
TWI343408B (zh) 2011-06-11
KR20070001854A (ko) 2007-01-04
KR100698916B1 (ko) 2007-03-23
CN1304517C (zh) 2007-03-14
KR20060044832A (ko) 2006-05-16
TW200619342A (en) 2006-06-16
CN1970673B (zh) 2012-03-28
TWI277642B (en) 2007-04-01
KR100832625B1 (ko) 2008-05-27
TW200536921A (en) 2005-11-16
TWI265191B (en) 2006-11-01

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