JP2010528153A - 防食接着剤組成物 - Google Patents
防食接着剤組成物 Download PDFInfo
- Publication number
- JP2010528153A JP2010528153A JP2010509435A JP2010509435A JP2010528153A JP 2010528153 A JP2010528153 A JP 2010528153A JP 2010509435 A JP2010509435 A JP 2010509435A JP 2010509435 A JP2010509435 A JP 2010509435A JP 2010528153 A JP2010528153 A JP 2010528153A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive composition
- anticorrosive adhesive
- composition according
- azobis
- anticorrosive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82B—NANOSTRUCTURES FORMED BY MANIPULATION OF INDIVIDUAL ATOMS, MOLECULES, OR LIMITED COLLECTIONS OF ATOMS OR MOLECULES AS DISCRETE UNITS; MANUFACTURE OR TREATMENT THEREOF
- B82B3/00—Manufacture or treatment of nanostructures by manipulation of individual atoms or molecules, or limited collections of atoms or molecules as discrete units
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
- C08K3/041—Carbon nanotubes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/22—Compounds containing nitrogen bound to another nitrogen atom
- C08K5/23—Azo-compounds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
Abstract
Description
Claims (17)
- (a)ラジカル硬化性樹脂、(b)フィラー、および(c)アゾ化合物を含む、防食接着剤組成物。
- 前記アゾ化合物がアゾ開始剤である、請求項1に記載の防食接着剤組成物。
- 前記アゾ化合物が、2,2’−アゾビス(2,4−ジメチルバレロニトリル)、2,2’−アゾビス(4−メトキシ−2,4−ジメチルバレロニトリル)、2,2’−アゾビス(2−アミジノプロパン)二塩酸塩、2,2’−アゾビス(イソブチロニトリル)、2,2’−アゾビス−2−メチルブチロニトリル、1,1−アゾビス(1−シクロヘキサンカルボニトリル)、2,2’−アゾビス(2−シクロプロピルプロピオニトリル)、および2,2’−アゾビス(メチルイソブチレート)からなる群より選択される、請求項2に記載の防食接着剤組成物。
- 前記アゾ化合物が、2,2’−アゾビス(2,4−ジメチルバレロニトリル)である、請求項3に記載の防食接着剤組成物。
- 前記フィラーが、導電性フィラーである、請求項1に記載の防食接着剤組成物。
- 前記導電性フィラーが、透明導電性フィラーである、請求項5に記載の防食接着剤組成物。
- 前記透明導電性フィラーが、インジウム・スズ酸化物はんだである、請求項6に記載の防食接着剤組成物。
- 前記導電性フィラーが、銀、銅、ニッケル、金、スズ、亜鉛、白金、パラジウム、鉄、タングステン、モリブデン、カーボンブラック、炭素繊維、アルミニウム、ビスマス、スズ、ビスマス−スズ合金、カーボンナノチューブ、銀被覆ガラス、グラファイト、導電性ポリマー、金属被覆ポリマー、およびこれらの混合物からなる群より選択される、請求項5に記載の防食接着剤組成物。
- ラジカル開始剤をさらに含む、請求項1に記載の防食接着剤組成物。
- 前記ラジカル開始剤が、パーオキサイド開始剤である、請求項9に記載の防食接着剤組成物。
- 約5重量%〜約95重量%のラジカル硬化性樹脂、約2重量%〜約95重量%のフィラー、および約0.1重量%〜約10重量%のアゾ化合物を含む、請求項1に記載の防食接着剤組成物。
- 約10重量%〜約60重量%のラジカル硬化性樹脂、約5重量%〜約85重量%のフィラー、および約0.2重量%〜約5重量%のアゾ化合物を含む、請求項11に記載の防食接着剤組成物。
- 前記ラジカル硬化性樹脂は、アクリル樹脂、メタクリル樹脂、マレイミド樹脂、ビスマレイミド樹脂、ビニルエステル樹脂、ポリブタジエン樹脂、およびポリエステル樹脂からなる群より選択される、請求項1に記載の防食接着剤組成物。
- 前記ラジカル硬化性樹脂が、アクリル樹脂である、請求項13に記載の防食接着剤組成物。
- 腐食を防止するために金属基板をコーティングする方法であって、
a)請求項1に記載の防食接着剤組成物を準備するステップと、
b)この防食接着剤組成物を金属基板に塗布するステップと
を含む方法。 - 防食接着剤組成物を硬化する追加のステップを含む、請求項15に記載の金属基板をコーティングする方法。
- 請求項1に記載の防食接着剤組成物を含む、消費製品。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/752,591 US20080292801A1 (en) | 2007-05-23 | 2007-05-23 | Corrosion-Preventive Adhesive Compositions |
PCT/US2008/063493 WO2008147683A1 (en) | 2007-05-23 | 2008-05-13 | Corrosion-preventive adhesive compositions |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010528153A true JP2010528153A (ja) | 2010-08-19 |
JP2010528153A5 JP2010528153A5 (ja) | 2013-07-18 |
Family
ID=40072659
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010509435A Pending JP2010528153A (ja) | 2007-05-23 | 2008-05-13 | 防食接着剤組成物 |
Country Status (7)
Country | Link |
---|---|
US (1) | US20080292801A1 (ja) |
EP (1) | EP2152830A4 (ja) |
JP (1) | JP2010528153A (ja) |
KR (1) | KR20100031111A (ja) |
CN (1) | CN101711271A (ja) |
TW (1) | TWI447204B (ja) |
WO (1) | WO2008147683A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020059831A (ja) * | 2018-10-12 | 2020-04-16 | 積水化学工業株式会社 | 防食用粘着剤、防食用粘着剤層及び防食用粘着テープ |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
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US9303171B2 (en) | 2011-03-18 | 2016-04-05 | Tesla Nanocoatings, Inc. | Self-healing polymer compositions |
WO2013033562A2 (en) | 2011-08-31 | 2013-03-07 | Jorma Virtanen | Composition for corrosion prevention |
US10570296B2 (en) | 2012-03-19 | 2020-02-25 | Tesla Nanocoatings, Inc. | Self-healing polymer compositions |
GB2504957A (en) | 2012-08-14 | 2014-02-19 | Henkel Ag & Co Kgaa | Curable compositions comprising composite particles |
CN103013330A (zh) * | 2012-12-10 | 2013-04-03 | 青岛汉河药业有限公司 | 金属结构无芳烃防腐方法 |
CN102942857A (zh) * | 2012-12-10 | 2013-02-27 | 青岛天鹅针织有限公司 | 金属结构无芳烃防腐工艺 |
CN102942866A (zh) * | 2012-12-10 | 2013-02-27 | 青岛中科英泰商用系统有限公司 | 一种金属结构的无芳烃防腐方法 |
CN102942855A (zh) * | 2012-12-10 | 2013-02-27 | 青岛博益特生物材料有限公司 | 一种金属结构防腐工艺 |
CN102942847A (zh) * | 2012-12-13 | 2013-02-27 | 青岛天鹅针织有限公司 | 金属结构的防腐流程 |
CN102965002A (zh) * | 2012-12-13 | 2013-03-13 | 青岛森淼实业有限公司 | 金属结构防腐流程 |
CN102965008A (zh) * | 2012-12-14 | 2013-03-13 | 青岛天鹅针织有限公司 | 金属结构的防腐方案 |
CN102993957A (zh) * | 2012-12-14 | 2013-03-27 | 青岛中科润美润滑材料技术有限公司 | 一种金属结构的无芳烃防腐方案 |
CN103146300A (zh) * | 2013-04-02 | 2013-06-12 | 深圳市景江化工有限公司 | 一种脱硫烟囱防腐涂料的制备方法 |
CN103242768B (zh) * | 2013-05-20 | 2014-08-20 | 黑龙江省科学院石油化学研究院 | 一种高韧性双马来酰亚胺树脂载体结构胶膜及其制备方法 |
KR20180099045A (ko) | 2017-02-28 | 2018-09-05 | 동우 화인켐 주식회사 | 터치 센서 |
CN107760277A (zh) * | 2017-11-10 | 2018-03-06 | 苏州胜晓化工有限公司 | 一种蓝树提取液及其制备方法和一种载冷剂及其制备方法 |
CN112063345B (zh) * | 2020-08-18 | 2022-07-19 | 湖南创瑾科技有限公司 | 一种纳米导电导热胶及其应用 |
CN115074044B (zh) * | 2022-07-05 | 2023-03-21 | 海南大学 | 可快速替换的海洋平台用光固化防腐胶带及其制备方法 |
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Also Published As
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KR20100031111A (ko) | 2010-03-19 |
US20080292801A1 (en) | 2008-11-27 |
EP2152830A1 (en) | 2010-02-17 |
EP2152830A4 (en) | 2014-05-14 |
CN101711271A (zh) | 2010-05-19 |
WO2008147683A1 (en) | 2008-12-04 |
TW200911957A (en) | 2009-03-16 |
TWI447204B (zh) | 2014-08-01 |
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