KR100625916B1 - 전압-클램프된 게이트를 가진 파워 mosfet - Google Patents

전압-클램프된 게이트를 가진 파워 mosfet Download PDF

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Publication number
KR100625916B1
KR100625916B1 KR1020000023687A KR20000023687A KR100625916B1 KR 100625916 B1 KR100625916 B1 KR 100625916B1 KR 1020000023687 A KR1020000023687 A KR 1020000023687A KR 20000023687 A KR20000023687 A KR 20000023687A KR 100625916 B1 KR100625916 B1 KR 100625916B1
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KR
South Korea
Prior art keywords
voltage
gate
diode
source
mosfet
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Expired - Fee Related
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KR1020000023687A
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English (en)
Korean (ko)
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KR20000077143A (ko
Inventor
윌리엄스리차드케이.
Original Assignee
실리코닉스 인코퍼레이티드
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Publication of KR20000077143A publication Critical patent/KR20000077143A/ko
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Publication of KR100625916B1 publication Critical patent/KR100625916B1/ko
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Expired - Fee Related legal-status Critical Current

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    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C19/00Digital stores in which the information is moved stepwise, e.g. shift registers
    • G11C19/18Digital stores in which the information is moved stepwise, e.g. shift registers using capacitors as main elements of the stages
    • G11C19/182Digital stores in which the information is moved stepwise, e.g. shift registers using capacitors as main elements of the stages in combination with semiconductor elements, e.g. bipolar transistors, diodes
    • G11C19/184Digital stores in which the information is moved stepwise, e.g. shift registers using capacitors as main elements of the stages in combination with semiconductor elements, e.g. bipolar transistors, diodes with field-effect transistors, e.g. MOS-FET
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02MAPPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M1/00Details of apparatus for conversion
    • H02M1/32Means for protecting converters other than automatic disconnection
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03KPULSE TECHNIQUE
    • H03K17/00Electronic switching or gating, i.e. not by contact-making and –breaking
    • H03K17/04Modifications for accelerating switching
    • H03K17/041Modifications for accelerating switching without feedback from the output circuit to the control circuit
    • H03K17/0412Modifications for accelerating switching without feedback from the output circuit to the control circuit by measures taken in the control circuit
    • H03K17/04123Modifications for accelerating switching without feedback from the output circuit to the control circuit by measures taken in the control circuit in field-effect transistor switches
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03KPULSE TECHNIQUE
    • H03K17/00Electronic switching or gating, i.e. not by contact-making and –breaking
    • H03K17/08Modifications for protecting switching circuit against overcurrent or overvoltage
    • H03K17/081Modifications for protecting switching circuit against overcurrent or overvoltage without feedback from the output circuit to the control circuit
    • H03K17/0812Modifications for protecting switching circuit against overcurrent or overvoltage without feedback from the output circuit to the control circuit by measures taken in the control circuit
    • H03K17/08122Modifications for protecting switching circuit against overcurrent or overvoltage without feedback from the output circuit to the control circuit by measures taken in the control circuit in field-effect transistor switches
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03KPULSE TECHNIQUE
    • H03K17/00Electronic switching or gating, i.e. not by contact-making and –breaking
    • H03K17/16Modifications for eliminating interference voltages or currents
    • H03K17/161Modifications for eliminating interference voltages or currents in field-effect transistor switches
    • H03K17/162Modifications for eliminating interference voltages or currents in field-effect transistor switches without feedback from the output circuit to the control circuit
    • H03K17/163Soft switching
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/60Electrodes characterised by their materials
    • H10D64/605Source, drain, or gate electrodes for FETs comprising highly resistive materials
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/80Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs
    • H10D84/811Combinations of field-effect devices and one or more diodes, capacitors or resistors

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
  • Logic Circuits (AREA)
  • Electronic Switches (AREA)
KR1020000023687A 1999-05-05 2000-05-03 전압-클램프된 게이트를 가진 파워 mosfet Expired - Fee Related KR100625916B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US9/306,003 1999-05-05
US09/306,003 1999-05-05
US09/306,003 US6172383B1 (en) 1997-12-31 1999-05-05 Power MOSFET having voltage-clamped gate

Publications (2)

Publication Number Publication Date
KR20000077143A KR20000077143A (ko) 2000-12-26
KR100625916B1 true KR100625916B1 (ko) 2006-09-20

Family

ID=23183305

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020000023687A Expired - Fee Related KR100625916B1 (ko) 1999-05-05 2000-05-03 전압-클램프된 게이트를 가진 파워 mosfet

Country Status (5)

Country Link
US (1) US6172383B1 (enExample)
EP (1) EP1063757B1 (enExample)
JP (2) JP4369009B2 (enExample)
KR (1) KR100625916B1 (enExample)
DE (1) DE60009214T2 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101799017B1 (ko) 2011-08-18 2017-11-20 에스케이하이닉스 주식회사 전압 안정화 회로를 구비한 반도체 집적 회로
KR101818537B1 (ko) * 2011-07-14 2018-01-15 현대모비스 주식회사 Mosfet 보호 회로 및 방법

Families Citing this family (69)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3564958B2 (ja) 1997-08-07 2004-09-15 株式会社日立製作所 電子ビームを用いた検査方法及び検査装置
JP2000022456A (ja) * 1998-06-26 2000-01-21 Nec Ic Microcomput Syst Ltd 半導体集積回路
US6249410B1 (en) * 1999-08-23 2001-06-19 Taiwan Semiconductor Manufacturing Company ESD protection circuit without overstress gate-driven effect
KR100794151B1 (ko) * 2000-05-22 2008-01-14 소니 가부시끼 가이샤 전계 효과 트랜지스터의 보호 회로 및 반도체 장치
JP4846106B2 (ja) * 2001-02-16 2011-12-28 三菱電機株式会社 電界効果型半導体装置及びその製造方法
JP4641660B2 (ja) * 2001-05-18 2011-03-02 三菱電機株式会社 レベルシフト回路
US6798629B1 (en) * 2001-06-15 2004-09-28 Integrated Device Technology, Inc. Overvoltage protection circuits that utilize capacitively bootstrapped variable voltages
JP2003243512A (ja) * 2002-02-14 2003-08-29 Hitachi Ltd 静電破壊保護回路
US20030189215A1 (en) 2002-04-09 2003-10-09 Jong-Lam Lee Method of fabricating vertical structure leds
US7075763B2 (en) * 2002-10-31 2006-07-11 Micron Technology, Inc. Methods, circuits, and applications using a resistor and a Schottky diode
US20060170399A1 (en) * 2002-12-20 2006-08-03 Koninklijke Philips Electronics N.V. Power factor controller utilizing duel-switch configuration
US6906386B2 (en) 2002-12-20 2005-06-14 Advanced Analogic Technologies, Inc. Testable electrostatic discharge protection circuits
CN1745477A (zh) * 2002-12-20 2006-03-08 先进模拟科技公司 可测试静电放电保护电路
US6897707B2 (en) * 2003-06-11 2005-05-24 Northrop Grumman Corporation Isolated FET drive utilizing Zener diode based systems, methods and apparatus
DE502004002699D1 (de) * 2003-07-28 2007-03-08 Siemens Ag Vorrichtung zum schutz von elektronik-baugruppen in einem mehrspannungs-bordnetz gegen kurzschl sse
JP2005142363A (ja) * 2003-11-06 2005-06-02 Toshiba Corp 半導体集積回路
JP2005175054A (ja) * 2003-12-09 2005-06-30 Mitsubishi Electric Corp 半導体装置及びその製造方法
EP1624570A1 (en) * 2004-08-03 2006-02-08 Freescale Semiconductor Inc. (A Delaware Corp) A semiconductor switch arrangement
JP2007049012A (ja) * 2005-08-11 2007-02-22 Nec Electronics Corp 半導体装置
US7545614B2 (en) * 2005-09-30 2009-06-09 Renesas Technology America, Inc. Electrostatic discharge device with variable on time
JP2009527120A (ja) * 2006-02-17 2009-07-23 エヌエックスピー ビー ヴィ 集積回路における静電放電保護回路及び方法
JP2008042950A (ja) * 2006-08-01 2008-02-21 Mitsubishi Electric Corp 電力変換装置
US8476709B2 (en) * 2006-08-24 2013-07-02 Infineon Technologies Ag ESD protection device and method
US8144441B2 (en) 2006-08-30 2012-03-27 Triquint Semiconductor, Inc. Electrostatic discharge protection circuit for compound semiconductor devices and circuits
TWI496272B (zh) 2006-09-29 2015-08-11 菲爾卻德半導體公司 用於功率金氧半導體場效電晶體之雙電壓多晶矽二極體靜電放電電路
JP4427561B2 (ja) * 2007-05-29 2010-03-10 株式会社東芝 半導体装置
KR101014152B1 (ko) 2008-10-15 2011-02-14 기아자동차주식회사 차량 인버터 회로 및 그를 이용한 차량
US9142592B2 (en) 2009-04-09 2015-09-22 Infineon Technologies Ag Integrated circuit including ESD device
WO2011093472A1 (ja) 2010-01-29 2011-08-04 富士電機システムズ株式会社 半導体装置
US8614480B2 (en) * 2011-07-05 2013-12-24 Texas Instruments Incorporated Power MOSFET with integrated gate resistor and diode-connected MOSFET
DE102012014860A1 (de) 2012-07-26 2014-05-15 Infineon Technologies Ag ESD-Schutz
JP2014045004A (ja) * 2012-08-24 2014-03-13 Samsung Electro-Mechanics Co Ltd Esd保護回路及び電子機器
EP2736171A1 (en) * 2012-11-23 2014-05-28 Nxp B.V. Cascoded semiconductor devices
JP5729371B2 (ja) * 2012-12-27 2015-06-03 富士電機株式会社 半導体装置
US9966584B2 (en) 2013-03-11 2018-05-08 Atieva, Inc. Bus bar for battery packs
US10084214B2 (en) 2013-03-15 2018-09-25 Atieva, Inc. Automatic switchover from cell voltage to interconnect voltage monitoring
US10063071B2 (en) 2013-03-15 2018-08-28 Atieva, Inc. Balance resistor and low pass filter
US10901019B2 (en) 2013-03-15 2021-01-26 Atieva, Inc. Method of connecting cell voltage sensors
US9041454B2 (en) 2013-03-15 2015-05-26 Atieva, Inc. Bias circuit for a switched capacitor level shifter
CN103347330B (zh) * 2013-06-22 2015-04-08 潍坊晶兰电源技术有限公司 一种led驱动控制电路
CN103347329B (zh) * 2013-06-22 2015-04-08 潍坊晶兰电源技术有限公司 一种led驱动电路
CN103347331A (zh) * 2013-06-22 2013-10-09 潍坊晶兰电源技术有限公司 一种驱动芯片保护电路
JP2015015643A (ja) * 2013-07-05 2015-01-22 ローム株式会社 信号伝達回路
TWI502836B (zh) * 2013-08-05 2015-10-01 Ind Tech Res Inst 電壓保護傳輸裝置及包括該裝置的電壓保護裝置
JP5741666B2 (ja) * 2013-10-30 2015-07-01 富士電機株式会社 半導体装置
JP6364758B2 (ja) * 2013-12-04 2018-08-01 オムロン株式会社 全波整流回路
US9640972B2 (en) * 2014-03-26 2017-05-02 Infineon Technologies Ag Controlled switch-off of a power switch
JP6256320B2 (ja) * 2014-11-28 2018-01-10 三菱電機株式会社 Esd保護回路及びrfスイッチ
CN104505390B (zh) * 2015-01-08 2019-03-15 电子科技大学 集成式二极管链功率mos防静电保护结构
CN104538395B (zh) * 2015-01-08 2019-01-25 电子科技大学 一种功率vdmos器件二极管并联式esd防护机构
JP2016201069A (ja) * 2015-04-14 2016-12-01 富士通セミコンダクター株式会社 整流回路、電源回路及びrfidタグ
DE102015212152B4 (de) 2015-06-30 2018-03-15 TRUMPF Hüttinger GmbH + Co. KG Nicht lineare Hochfrequenzverstärkeranordnung
DE102015212247A1 (de) 2015-06-30 2017-01-05 TRUMPF Hüttinger GmbH + Co. KG Hochfrequenzverstärkeranordnung
TWI627822B (zh) * 2016-11-09 2018-06-21 致茂電子股份有限公司 鉗位控制電路
US10819320B2 (en) * 2016-12-29 2020-10-27 Scandinova Systems Ab Arrangement comprising an electrical pulse generating module
JP6643268B2 (ja) * 2017-03-24 2020-02-12 株式会社東芝 半導体装置
US10897246B2 (en) * 2017-11-10 2021-01-19 Qorvo Us, Inc. Radio frequency switching circuitry with reduced switching time
US10903696B2 (en) * 2017-11-15 2021-01-26 Mitsubishi Electric Corporation Rectifier and rectenna device
CN107834824B (zh) * 2017-12-12 2024-02-27 深圳市禾望电气股份有限公司 一种功率开关管驱动电路
JP7155534B2 (ja) * 2018-02-16 2022-10-19 富士電機株式会社 半導体装置
FR3079348B1 (fr) * 2018-03-22 2023-08-11 St Microelectronics Tours Sas Circuit de protection contre les décharges électrostatiques
TWI729538B (zh) 2018-11-21 2021-06-01 大陸商上海瀚薪科技有限公司 一種整合箝制電壓箝位電路的碳化矽半導體元件
US11387648B2 (en) * 2019-01-10 2022-07-12 Analog Devices International Unlimited Company Electrical overstress protection with low leakage current for high voltage tolerant high speed interfaces
US11579645B2 (en) 2019-06-21 2023-02-14 Wolfspeed, Inc. Device design for short-circuitry protection circuitry within transistors
US10937781B1 (en) * 2019-09-04 2021-03-02 Semiconductor Components Industries, Llc Electronic device including a protection circuit
US11410990B1 (en) 2020-08-25 2022-08-09 Semiq Incorporated Silicon carbide MOSFET with optional asymmetric gate clamp
JP7732280B2 (ja) * 2021-08-27 2025-09-02 富士電機株式会社 半導体モジュール
CN115831956A (zh) * 2021-09-17 2023-03-21 中兴光电子技术有限公司 一种静电释放保护电路、保护单元以及芯片和装置
CN113783425B (zh) * 2021-10-15 2025-07-11 上海艾为电子技术股份有限公司 一种直流变换器及其供电电源

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3967295A (en) 1975-04-03 1976-06-29 Rca Corporation Input transient protection for integrated circuit element
JPS5825264A (ja) 1981-08-07 1983-02-15 Hitachi Ltd 絶縁ゲート型半導体装置
US4757363A (en) 1984-09-14 1988-07-12 Harris Corporation ESD protection network for IGFET circuits with SCR prevention guard rings
FR2587157B1 (fr) 1985-09-06 1987-11-20 Thomson Csf Dispositif de commutation de tension
JPH0693485B2 (ja) 1985-11-29 1994-11-16 日本電装株式会社 半導体装置
JP2724146B2 (ja) 1987-05-29 1998-03-09 日産自動車株式会社 縦形mosfet
JPH02185069A (ja) 1988-12-02 1990-07-19 Motorola Inc 高エネルギー阻止能力及び温度補償された阻止電圧を具備する半導体デバイス
US5119162A (en) 1989-02-10 1992-06-02 Texas Instruments Incorporated Integrated power DMOS circuit with protection diode
US5274274A (en) 1992-03-23 1993-12-28 Power Integrations, Inc. Dual threshold differential discriminator
US5504449A (en) 1992-04-09 1996-04-02 Harris Corporation Power driver circuit
US5397914A (en) 1992-04-30 1995-03-14 Hitachi Ltd. Power transistor device including power transistors in darlington connection and zener diode which is coupled between collector and base of power transistors and which is formed in polysilicon film
US5439842A (en) 1992-09-21 1995-08-08 Siliconix Incorporated Low temperature oxide layer over field implant mask
US5525925A (en) 1992-09-25 1996-06-11 Texas Instruments Incorporated Simple power MOSFET low side driver switch-off circuit with limited di/dt and fast response
DE69329543T2 (de) 1992-12-09 2001-05-31 Compaq Computer Corp., Houston Herstellung eines Feldeffekttransistors mit integrierter Schottky-Klammerungsdiode
EP0631390B1 (en) * 1993-06-22 1999-09-01 Philips Electronics Uk Limited A power semiconductor circuit
GB9313651D0 (en) * 1993-07-01 1993-08-18 Philips Electronics Uk Ltd A semiconductor device
DE69327320T2 (de) 1993-09-30 2000-05-31 Consorzio Per La Ricerca Sulla Microelettronica Nel Mezzogiorno, Catania Integrierte aktive Klammerungsstruktur für den Schutz von Leistungsanordnungen gegen Überspannungen, und Verfahren zu ihrer Herstellung
US5510747A (en) 1993-11-30 1996-04-23 Siliconix Incorporated Gate drive technique for a bidirectional blocking lateral MOSFET
JP2792417B2 (ja) * 1993-12-17 1998-09-03 日本電気株式会社 半導体回路の入力保護回路
US5946588A (en) 1994-12-07 1999-08-31 Micron Technology, Inc. Low temperature sub-atmospheric ozone oxidation process for making thin gate oxides
JP3485655B2 (ja) * 1994-12-14 2004-01-13 株式会社ルネサステクノロジ 複合型mosfet
JPH08172188A (ja) * 1994-12-19 1996-07-02 Kawasaki Steel Corp 半導体装置
US5805123A (en) 1995-03-16 1998-09-08 Texas Instruments Incorporated Display panel driving circuit having an integrated circuit portion and a high power portion attached to the integrated circuit
US5661322A (en) 1995-06-02 1997-08-26 Siliconix Incorporated Bidirectional blocking accumulation-mode trench power MOSFET
JP2988871B2 (ja) 1995-06-02 1999-12-13 シリコニックス・インコーポレイテッド トレンチゲートパワーmosfet
US5602046A (en) 1996-04-12 1997-02-11 National Semiconductor Corporation Integrated zener diode protection structures and fabrication methods for DMOS power devices
US5818084A (en) 1996-05-15 1998-10-06 Siliconix Incorporated Pseudo-Schottky diode
US5804846A (en) 1996-05-28 1998-09-08 Harris Corporation Process for forming a self-aligned raised source/drain MOS device and device therefrom
US5811857A (en) 1996-10-22 1998-09-22 International Business Machines Corporation Silicon-on-insulator body-coupled gated diode for electrostatic discharge (ESD) and analog applications
US5923210A (en) 1997-05-07 1999-07-13 Caterpillar Inc. High side driver circuit with diagnostic output
JPH11251594A (ja) * 1997-12-31 1999-09-17 Siliconix Inc 電圧クランプされたゲ―トを有するパワ―mosfet

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101818537B1 (ko) * 2011-07-14 2018-01-15 현대모비스 주식회사 Mosfet 보호 회로 및 방법
KR101799017B1 (ko) 2011-08-18 2017-11-20 에스케이하이닉스 주식회사 전압 안정화 회로를 구비한 반도체 집적 회로

Also Published As

Publication number Publication date
EP1063757B1 (en) 2004-03-24
KR20000077143A (ko) 2000-12-26
EP1063757A3 (en) 2001-12-05
EP1063757A2 (en) 2000-12-27
DE60009214D1 (de) 2004-04-29
JP5178649B2 (ja) 2013-04-10
US6172383B1 (en) 2001-01-09
JP2009224803A (ja) 2009-10-01
JP4369009B2 (ja) 2009-11-18
DE60009214T2 (de) 2005-01-27
JP2000349235A (ja) 2000-12-15

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