KR100573326B1 - 경화성 에폭시-기제 조성물 - Google Patents

경화성 에폭시-기제 조성물 Download PDF

Info

Publication number
KR100573326B1
KR100573326B1 KR1020007007817A KR20007007817A KR100573326B1 KR 100573326 B1 KR100573326 B1 KR 100573326B1 KR 1020007007817 A KR1020007007817 A KR 1020007007817A KR 20007007817 A KR20007007817 A KR 20007007817A KR 100573326 B1 KR100573326 B1 KR 100573326B1
Authority
KR
South Korea
Prior art keywords
alkyl
composition
epoxy
epoxy resin
acid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020007007817A
Other languages
English (en)
Korean (ko)
Other versions
KR20010034183A (ko
Inventor
번즈베리
울프슨해리
말론폴
위그햄조나단
Original Assignee
록타이트(알 앤 디) 리미티드
헨켈 록타이트 코오포레이션
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 록타이트(알 앤 디) 리미티드, 헨켈 록타이트 코오포레이션 filed Critical 록타이트(알 앤 디) 리미티드
Publication of KR20010034183A publication Critical patent/KR20010034183A/ko
Application granted granted Critical
Publication of KR100573326B1 publication Critical patent/KR100573326B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/182—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents
    • C08G59/186—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents with acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/66—Mercaptans
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
    • C08K5/37—Thiols
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/28—Non-macromolecular organic substances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
KR1020007007817A 1998-01-16 1999-01-14 경화성 에폭시-기제 조성물 Expired - Fee Related KR100573326B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
IE980028 1998-01-16
IE980028 1998-01-16
US9545898P 1998-08-06 1998-08-06
US60/095,458 1998-08-06
PCT/IE1999/000001 WO1999036484A1 (en) 1998-01-16 1999-01-14 Curable epoxy-based compositions

Publications (2)

Publication Number Publication Date
KR20010034183A KR20010034183A (ko) 2001-04-25
KR100573326B1 true KR100573326B1 (ko) 2006-04-24

Family

ID=26320151

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020007007817A Expired - Fee Related KR100573326B1 (ko) 1998-01-16 1999-01-14 경화성 에폭시-기제 조성물

Country Status (12)

Country Link
EP (1) EP1047744B1 (enExample)
JP (1) JP4394281B2 (enExample)
KR (1) KR100573326B1 (enExample)
CN (1) CN1165592C (enExample)
AU (1) AU740553B2 (enExample)
BR (1) BR9906962A (enExample)
CA (1) CA2318167A1 (enExample)
DE (1) DE69903256T2 (enExample)
IL (1) IL136344A0 (enExample)
MY (1) MY132966A (enExample)
TW (1) TWI239968B (enExample)
WO (1) WO1999036484A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100951645B1 (ko) 2007-12-28 2010-04-07 (주)디피아이 홀딩스 저온 속경화형 에폭시 경화제, 이를 포함하는 에폭시 도료조성물 및 이를 이용한 도막의 형성 방법

Families Citing this family (50)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3868179B2 (ja) * 1999-08-02 2007-01-17 住友ベークライト株式会社 液状封止樹脂組成物、半導体装置の製造方法及び半導体装置
US20030082385A1 (en) * 2001-07-13 2003-05-01 Toray Composites (America), Inc. Quick cure carbon fiber reinforced epoxy resin
IE20020293A1 (en) 2002-04-23 2003-10-29 Loctite R & D Ltd Initiator systems, polymerisable compositions, and uses thereof for bonding low surface energy substrates
US6818680B2 (en) * 2002-09-23 2004-11-16 Corning Incorporated Curable adhesive compositions
US20040101688A1 (en) * 2002-11-22 2004-05-27 Slawomir Rubinsztajn Curable epoxy compositions, methods and articles made therefrom
US7176044B2 (en) * 2002-11-25 2007-02-13 Henkel Corporation B-stageable die attach adhesives
DE102004049717A1 (de) * 2004-10-11 2006-04-13 Henkel Kgaa Alterungsbeständige Beschichtungen und Klebeverbunde
KR100613870B1 (ko) * 2005-05-04 2006-08-17 주식회사 덕수엔지니어링 흡입공기를 이용한 옥내 수도관 보수용 에폭시 수지 조성물
KR101148051B1 (ko) * 2005-12-26 2012-05-25 에스케이케미칼주식회사 에폭시 수지 조성물
JP4938539B2 (ja) * 2007-04-24 2012-05-23 凸版印刷株式会社 アルカリ現像型樹脂、フォトスペーサ用感光性樹脂組成物、及びこれを用いた液晶表示装置用基板
CN101418206B (zh) * 2007-10-22 2012-06-20 财团法人工业技术研究院 发光二极管的封装材料组成物
KR100901854B1 (ko) * 2007-11-22 2009-06-09 이아이씨티코리아 주식회사 저온 경화 열경화성 에폭시 수지 조성물 및 그 제조 방법
JP5605219B2 (ja) * 2008-03-31 2014-10-15 住友ベークライト株式会社 樹脂組成物、樹脂付キャリア材料、多層プリント配線板および半導体装置
CN103189412A (zh) * 2010-11-05 2013-07-03 汉高爱尔兰有限公司 具有改善的稳定性的环氧-硫醇组合物
EP2678156B1 (en) * 2011-02-24 2017-10-04 Isola USA Corp. Ultrathin laminates
EP2698250A4 (en) * 2011-04-11 2014-12-10 Dainippon Printing Co Ltd REINFORCING MATERIAL FOR SOLID POLYMER FUEL CELL, AND COHESIVE / ADHESIVE COMPOSITION FOR USE THEREIN
WO2013053100A1 (en) * 2011-10-11 2013-04-18 Henkel China Co. Ltd. Gel time controllable two part epoxy adhesive
CN104024364B (zh) * 2011-10-11 2017-07-25 汉高股份有限及两合公司 可控制凝胶时间的双组份环氧粘合剂
SG11201402832QA (en) * 2011-12-14 2014-10-30 Mitsui Chemicals Tohcello Inc Adhesive resin composition, laminate, and self-stripping method
EP2791144B1 (en) * 2011-12-16 2016-02-24 3M Innovative Properties Company of 3M Center Mercapto-containing bisanhydrohexitol derivatives and uses thereof
KR101328297B1 (ko) * 2011-12-22 2013-11-14 삼성전기주식회사 Ｈｄｄ 모터용 접착수지 조성물 및 이를 이용한 ｈｄｄ용 모터
CN103305132B (zh) * 2012-03-06 2015-03-25 上海佑威新材料科技有限公司 一种快速固化结构胶粘剂及其制备方法
EP2671716A1 (en) 2012-06-08 2013-12-11 Hexcel Composites SASU Low density composite materials, their production and use
PL2870190T3 (pl) 2012-07-03 2019-07-31 3M Innovative Properties Company Sposób wytwarzania hybrydowych wyrobów przylepnych o zróżnicowanej strukturze
WO2015021585A1 (en) * 2013-08-12 2015-02-19 Henkel (China) Company Limited Mechano-responsive composition
KR101509483B1 (ko) * 2013-09-26 2015-04-08 주식회사 신광화학산업 금속과 수지의 이종 재질간 고접착력이 유지되는 이중 경화형 에폭시 접착제 조성물을 이용한 금속과 수지의 접착 방법
US10221282B2 (en) 2015-03-12 2019-03-05 Namics Corporation Resin composition, adhesive agent, and sealing agent
JP6785841B2 (ja) * 2015-08-19 2020-11-18 ヘンケル アイピー アンド ホールディング ゲゼルシャフト ミット ベシュレンクテル ハフツング フラクシングアンダーフィル組成物
KR102049493B1 (ko) * 2015-11-04 2019-11-28 미쯔비시 케미컬 주식회사 경화성 조성물, 접착제, 코팅층을 갖는 물품, 섬유 강화 복합 재료, 포팅제 및 경화성 조성물 키트
US11416046B2 (en) * 2015-11-05 2022-08-16 Henkel Ag & Co. Kgaa Compositions having a matrix and encapsulated phase change materials dispersed therein, and electronic devices assembled therewith
JP6370327B2 (ja) * 2016-03-30 2018-08-08 株式会社タムラ製作所 ジェットディスペンサー用はんだ組成物
WO2018109617A1 (en) * 2016-12-13 2018-06-21 3M Innovative Properties Company Epoxy stabilization using substituted barbituric acids
US11053348B2 (en) * 2017-02-15 2021-07-06 3M Innovative Properties Company Epoxy stabilization using metal nanoparticles and nitrogen-containing catalysts, and methods
JP2020523450A (ja) * 2017-06-12 2020-08-06 スリーエム イノベイティブ プロパティズ カンパニー エポキシ／チオール樹脂組成物、方法、及びテープ
KR102344683B1 (ko) 2017-09-04 2021-12-30 삼성디스플레이 주식회사 표시 장치용 차폐 잉크층 및 그 제조 방법
CN111093842B (zh) * 2017-09-15 2023-03-10 3M创新有限公司 包含具有可固化环氧/硫醇树脂组合物的(甲基)丙烯酸酯基质的粘合剂膜、带以及方法
CN107936477B (zh) * 2017-12-02 2020-05-22 常州宝利美石墨烯有限公司 一种石墨烯/环氧树脂复合高分子材料
CN107955134B (zh) * 2017-12-02 2020-05-19 常州宝利美石墨烯有限公司 一种石墨烯在环氧树脂复合材料中的应用
CN107974043B (zh) * 2017-12-02 2020-01-14 常州宝利美石墨烯有限公司 一种石墨烯/环氧树脂复合高分子材料的制备方法
KR102703151B1 (ko) 2018-01-30 2024-09-04 나믹스 가부시끼가이샤 수지 조성물과 그 경화물, 접착제, 반도체 장치, 및 전자 부품
US11197246B2 (en) 2018-08-02 2021-12-07 At&T Intellectual Property I, L.P. Power control enhancements for multi-hop integrated access and backhaul
EP3883999A1 (en) 2018-11-19 2021-09-29 3M Innovative Properties Company Composition including a polythiol, a polyepoxide, a polymeric catalyst, and a conductive filler and methods relating to the composition
KR102188113B1 (ko) * 2019-06-04 2020-12-07 전남대학교산학협력단 나린제닌을 포함하는 열경화성 고분자 소재 및 이의 제조방법
DE102019121195A1 (de) * 2019-08-06 2021-02-11 Alzchem Trostberg Gmbh Lagerstabile Epoxidharz-Zusammensetzung
CN112752783B (zh) * 2019-08-21 2022-08-02 纳美仕有限公司 环氧树脂组合物
KR102242440B1 (ko) * 2019-11-25 2021-04-20 주식회사 케이씨씨 접착제 조성물
CN112409972A (zh) * 2020-12-02 2021-02-26 苏州瑞力博新材科技有限公司 一种以苯醌为稳定剂的低温快速固化单组分环氧电子胶
CN113088224B (zh) * 2021-02-26 2022-11-29 广东美的白色家电技术创新中心有限公司 应用于封装产品的保护组合物、功率模块及其制备方法
FR3139696B1 (fr) * 2022-09-12 2025-10-24 Commissariat Energie Atomique Structure electronique flexible
CN117736549B (zh) * 2024-02-02 2025-02-14 广东博汇新材料科技有限公司 一种高导热环氧树脂复合物的制备方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61159417A (ja) * 1984-12-29 1986-07-19 Semedain Kk 硬化性エポキシ樹脂組成物

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL6904873A (enExample) * 1968-04-29 1969-10-31
JPS5657820A (en) * 1979-10-18 1981-05-20 Semedain Kk Curable epoxy resin composition
JP2515344B2 (ja) * 1987-07-24 1996-07-10 松下電工株式会社 封止用一液性の液状エポキシ樹脂組成物
JPH0689222B2 (ja) * 1989-11-30 1994-11-09 住友ゴム工業株式会社 エポキシ樹脂組成物
JP2558013B2 (ja) * 1990-11-30 1996-11-27 株式会社トクヤマ 導電性銅ペースト組成物及びその製造方法
EP0594133B1 (en) * 1992-10-22 1998-05-06 Ajinomoto Co., Inc. Polythiol epoxy resin composition with extended working life

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61159417A (ja) * 1984-12-29 1986-07-19 Semedain Kk 硬化性エポキシ樹脂組成物

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100951645B1 (ko) 2007-12-28 2010-04-07 (주)디피아이 홀딩스 저온 속경화형 에폭시 경화제, 이를 포함하는 에폭시 도료조성물 및 이를 이용한 도막의 형성 방법

Also Published As

Publication number Publication date
MY132966A (en) 2007-10-31
IL136344A0 (en) 2001-05-20
TWI239968B (en) 2005-09-21
BR9906962A (pt) 2000-10-10
CN1288481A (zh) 2001-03-21
AU740553B2 (en) 2001-11-08
AU1981199A (en) 1999-08-02
DE69903256D1 (de) 2002-11-07
WO1999036484A1 (en) 1999-07-22
KR20010034183A (ko) 2001-04-25
JP2002509178A (ja) 2002-03-26
EP1047744A1 (en) 2000-11-02
DE69903256T2 (de) 2003-08-07
CA2318167A1 (en) 1999-07-22
CN1165592C (zh) 2004-09-08
EP1047744B1 (en) 2002-10-02
JP4394281B2 (ja) 2010-01-06

Similar Documents

Publication Publication Date Title
KR100573326B1 (ko) 경화성 에폭시-기제 조성물
KR101898742B1 (ko) 개선된 안정성을 가지는 에폭시-티올 조성물
US6653371B1 (en) One-part curable composition of polyepoxide, polythiol, latent hardener and solid organic acid
US6872762B2 (en) Epoxy resin composition with solid organic acid
JP2002509178A5 (enExample)
AU728193B2 (en) Thermosetting resin compositions useful as underfill sealants
PH27200A (en) Conductive adhesion useful for bonding a semiconductor die to a conductive support base
US6570029B2 (en) No-flow reworkable epoxy underfills for flip-chip applications
CN103098192B (zh) 电子零件用粘接剂及半导体芯片安装体的制造方法
US20030116347A1 (en) Electronic component
JP5143785B2 (ja) 電子部品接合用接着剤
JP2005350647A (ja) 液状エポキシ樹脂組成物
KR20080030581A (ko) 프리어플리케이션용 봉지 수지 조성물, 이를 이용한반도체장치 및 그 제조방법
JP2001316451A (ja) エポキシ樹脂組成物
JP7660315B2 (ja) 熱硬化性接着剤組成物及びその硬化物並びに接合体
JP5258191B2 (ja) 半導体チップ接合用接着剤
JP2017193630A (ja) 硬化性樹脂組成物
JP2008075054A (ja) 一液型エポキシ樹脂組成物
JP2014005347A (ja) 接着剤組成物及び半導体チップ実装体の製造方法
KR20020091224A (ko) 유동성 조절된 에폭시계 조성물
JP4718824B2 (ja) エポキシ系硬化性組成物及び電子部品の製造方法
MXPA00006955A (en) Curable epoxy-based compositions
JP5547931B2 (ja) 電子部品接合用接着剤
JP2015145473A (ja) 半導体接合用接着剤、半導体装置の製造方法、及び、半導体装置
JP2007016126A (ja) 熱硬化性樹脂組成物及び電子部品

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

PN2301 Change of applicant

St.27 status event code: A-3-3-R10-R13-asn-PN2301

St.27 status event code: A-3-3-R10-R11-asn-PN2301

A201 Request for examination
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R11-asn-PN2301

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R14-asn-PN2301

FPAY Annual fee payment

Payment date: 20130320

Year of fee payment: 8

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R11-asn-PN2301

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R14-asn-PN2301

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

FPAY Annual fee payment

Payment date: 20140320

Year of fee payment: 9

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 9

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R11-asn-PN2301

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R14-asn-PN2301

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R11-asn-PN2301

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R14-asn-PN2301

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R14-asn-PN2301

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R14-asn-PN2301

FPAY Annual fee payment

Payment date: 20150416

Year of fee payment: 10

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 10

FPAY Annual fee payment

Payment date: 20160408

Year of fee payment: 11

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 11

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

LAPS Lapse due to unpaid annual fee
PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20170418

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20170418