DE69903256T2 - Härtbare epoxyharzzusammensetzungen - Google Patents
Härtbare epoxyharzzusammensetzungenInfo
- Publication number
- DE69903256T2 DE69903256T2 DE69903256T DE69903256T DE69903256T2 DE 69903256 T2 DE69903256 T2 DE 69903256T2 DE 69903256 T DE69903256 T DE 69903256T DE 69903256 T DE69903256 T DE 69903256T DE 69903256 T2 DE69903256 T2 DE 69903256T2
- Authority
- DE
- Germany
- Prior art keywords
- epoxy resin
- resin compositions
- curable epoxy
- curable
- compositions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/182—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents
- C08G59/186—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents with acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/66—Mercaptans
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
- C08K5/37—Thiols
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/28—Non-macromolecular organic substances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Epoxy Resins (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IE980028 | 1998-01-16 | ||
US9545898P | 1998-08-06 | 1998-08-06 | |
PCT/IE1999/000001 WO1999036484A1 (en) | 1998-01-16 | 1999-01-14 | Curable epoxy-based compositions |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69903256D1 DE69903256D1 (de) | 2002-11-07 |
DE69903256T2 true DE69903256T2 (de) | 2003-08-07 |
Family
ID=26320151
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69903256T Expired - Fee Related DE69903256T2 (de) | 1998-01-16 | 1999-01-14 | Härtbare epoxyharzzusammensetzungen |
Country Status (12)
Country | Link |
---|---|
EP (1) | EP1047744B1 (de) |
JP (1) | JP4394281B2 (de) |
KR (1) | KR100573326B1 (de) |
CN (1) | CN1165592C (de) |
AU (1) | AU740553B2 (de) |
BR (1) | BR9906962A (de) |
CA (1) | CA2318167A1 (de) |
DE (1) | DE69903256T2 (de) |
IL (1) | IL136344A0 (de) |
MY (1) | MY132966A (de) |
TW (1) | TWI239968B (de) |
WO (1) | WO1999036484A1 (de) |
Families Citing this family (48)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3868179B2 (ja) * | 1999-08-02 | 2007-01-17 | 住友ベークライト株式会社 | 液状封止樹脂組成物、半導体装置の製造方法及び半導体装置 |
US20030082385A1 (en) * | 2001-07-13 | 2003-05-01 | Toray Composites (America), Inc. | Quick cure carbon fiber reinforced epoxy resin |
IE20020293A1 (en) | 2002-04-23 | 2003-10-29 | Loctite R & D Ltd | Initiator systems, polymerisable compositions, and uses thereof for bonding low surface energy substrates |
US6818680B2 (en) * | 2002-09-23 | 2004-11-16 | Corning Incorporated | Curable adhesive compositions |
US20040101688A1 (en) * | 2002-11-22 | 2004-05-27 | Slawomir Rubinsztajn | Curable epoxy compositions, methods and articles made therefrom |
US7176044B2 (en) * | 2002-11-25 | 2007-02-13 | Henkel Corporation | B-stageable die attach adhesives |
DE102004049717A1 (de) * | 2004-10-11 | 2006-04-13 | Henkel Kgaa | Alterungsbeständige Beschichtungen und Klebeverbunde |
KR100613870B1 (ko) * | 2005-05-04 | 2006-08-17 | 주식회사 덕수엔지니어링 | 흡입공기를 이용한 옥내 수도관 보수용 에폭시 수지 조성물 |
KR101148051B1 (ko) * | 2005-12-26 | 2012-05-25 | 에스케이케미칼주식회사 | 에폭시 수지 조성물 |
JP4938539B2 (ja) * | 2007-04-24 | 2012-05-23 | 凸版印刷株式会社 | アルカリ現像型樹脂、フォトスペーサ用感光性樹脂組成物、及びこれを用いた液晶表示装置用基板 |
CN101418206B (zh) * | 2007-10-22 | 2012-06-20 | 财团法人工业技术研究院 | 发光二极管的封装材料组成物 |
KR100901854B1 (ko) * | 2007-11-22 | 2009-06-09 | 이아이씨티코리아 주식회사 | 저온 경화 열경화성 에폭시 수지 조성물 및 그 제조 방법 |
KR100951645B1 (ko) | 2007-12-28 | 2010-04-07 | (주)디피아이 홀딩스 | 저온 속경화형 에폭시 경화제, 이를 포함하는 에폭시 도료조성물 및 이를 이용한 도막의 형성 방법 |
US20110031000A1 (en) * | 2008-03-31 | 2011-02-10 | Sumitomo Bakelite Co., Ltd. | Resin composition, carrier material with resin, multi-layered printed circuit board, and semiconductor device |
EP2635619A1 (de) * | 2010-11-05 | 2013-09-11 | Henkel Ireland Limited | Epoxid-thiol-zusammensetzungen mit verbesserter stabilität |
KR20140007448A (ko) * | 2011-02-24 | 2014-01-17 | 아이솔라 유에스에이 코프 | 초박 라미네이트 |
CN103582562B (zh) * | 2011-04-11 | 2015-10-14 | 大日本印刷株式会社 | 聚合物电解质燃料电池用增强材料及其中所使用的粘着粘接组合物 |
WO2013053100A1 (en) | 2011-10-11 | 2013-04-18 | Henkel China Co. Ltd. | Gel time controllable two part epoxy adhesive |
CN104024364B (zh) * | 2011-10-11 | 2017-07-25 | 汉高股份有限及两合公司 | 可控制凝胶时间的双组份环氧粘合剂 |
WO2013088686A1 (ja) | 2011-12-14 | 2013-06-20 | 三井化学株式会社 | 接着性樹脂組成物、積層体および自己剥離方法 |
IN2014CN04434A (de) * | 2011-12-16 | 2015-09-04 | 3M Innovative Properties Co | |
KR101328297B1 (ko) * | 2011-12-22 | 2013-11-14 | 삼성전기주식회사 | Hdd 모터용 접착수지 조성물 및 이를 이용한 hdd용 모터 |
CN103305132B (zh) * | 2012-03-06 | 2015-03-25 | 上海佑威新材料科技有限公司 | 一种快速固化结构胶粘剂及其制备方法 |
EP2671716A1 (de) | 2012-06-08 | 2013-12-11 | Hexcel Composites SASU | Verbundstoffmaterialien mit geringer Dichte, deren Herstellung und Verwendung |
JP6130502B2 (ja) | 2012-07-03 | 2017-05-17 | スリーエム イノベイティブ プロパティズ カンパニー | 構造化ハイブリッド接着剤物品の製造方法 |
CA2921246A1 (en) * | 2013-08-12 | 2015-02-19 | Henkel Ag & Co. Kgaa | Mechano-responsive epoxy composition |
KR101509483B1 (ko) * | 2013-09-26 | 2015-04-08 | 주식회사 신광화학산업 | 금속과 수지의 이종 재질간 고접착력이 유지되는 이중 경화형 에폭시 접착제 조성물을 이용한 금속과 수지의 접착 방법 |
CN107428939B (zh) | 2015-03-12 | 2019-11-22 | 纳美仕有限公司 | 树脂组合物、粘接剂和密封剂 |
WO2017031043A1 (en) * | 2015-08-19 | 2017-02-23 | Henkel IP & Holding GmbH | Fluxing underfill compositions |
CN108350147B (zh) * | 2015-11-04 | 2021-07-06 | 三菱化学株式会社 | 固化性组合物、粘合剂、具有涂层的物品、纤维强化复合材料、浇注剂以及固化性组合物套件 |
US11416046B2 (en) * | 2015-11-05 | 2022-08-16 | Henkel Ag & Co. Kgaa | Compositions having a matrix and encapsulated phase change materials dispersed therein, and electronic devices assembled therewith |
JP6370327B2 (ja) * | 2016-03-30 | 2018-08-08 | 株式会社タムラ製作所 | ジェットディスペンサー用はんだ組成物 |
US11584823B2 (en) * | 2016-12-13 | 2023-02-21 | 3M Innovative Properties Company | Epoxy stabilization using substituted barbituric acids |
WO2018151993A1 (en) * | 2017-02-15 | 2018-08-23 | 3M Innovative Properties Company | Epoxy stabilization using metal nanoparticles and nitrogen-containing catalysts, and methods |
JP2020523450A (ja) * | 2017-06-12 | 2020-08-06 | スリーエム イノベイティブ プロパティズ カンパニー | エポキシ/チオール樹脂組成物、方法、及びテープ |
KR102344683B1 (ko) | 2017-09-04 | 2021-12-30 | 삼성디스플레이 주식회사 | 표시 장치용 차폐 잉크층 및 그 제조 방법 |
KR102585184B1 (ko) * | 2017-09-15 | 2023-10-05 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 경화성 에폭시/티올 수지 조성물을 포함하는 (메트)아크릴레이트 매트릭스를 포함하는 접착제 필름, 테이프 및 방법 |
CN107936477B (zh) * | 2017-12-02 | 2020-05-22 | 常州宝利美石墨烯有限公司 | 一种石墨烯/环氧树脂复合高分子材料 |
CN107955134B (zh) * | 2017-12-02 | 2020-05-19 | 常州宝利美石墨烯有限公司 | 一种石墨烯在环氧树脂复合材料中的应用 |
CN107974043B (zh) * | 2017-12-02 | 2020-01-14 | 常州宝利美石墨烯有限公司 | 一种石墨烯/环氧树脂复合高分子材料的制备方法 |
EP3747933B1 (de) | 2018-01-30 | 2023-06-07 | Namics Corporation | Harzzusammensetzung und gehärtetes material davon, klebstoff, halbleiterbauelement und elektronische komponente |
US11197246B2 (en) | 2018-08-02 | 2021-12-07 | At&T Intellectual Property I, L.P. | Power control enhancements for multi-hop integrated access and backhaul |
KR102188113B1 (ko) * | 2019-06-04 | 2020-12-07 | 전남대학교산학협력단 | 나린제닌을 포함하는 열경화성 고분자 소재 및 이의 제조방법 |
WO2021033329A1 (ja) * | 2019-08-21 | 2021-02-25 | ナミックス株式会社 | エポキシ樹脂組成物 |
KR102242440B1 (ko) * | 2019-11-25 | 2021-04-20 | 주식회사 케이씨씨 | 접착제 조성물 |
CN112409972A (zh) * | 2020-12-02 | 2021-02-26 | 苏州瑞力博新材科技有限公司 | 一种以苯醌为稳定剂的低温快速固化单组分环氧电子胶 |
CN113088224B (zh) * | 2021-02-26 | 2022-11-29 | 广东美的白色家电技术创新中心有限公司 | 应用于封装产品的保护组合物、功率模块及其制备方法 |
FR3139696A1 (fr) * | 2022-09-12 | 2024-03-15 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Structure electronique flexible |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL6904873A (de) * | 1968-04-29 | 1969-10-31 | ||
JPS5657820A (en) * | 1979-10-18 | 1981-05-20 | Semedain Kk | Curable epoxy resin composition |
JPS61159417A (ja) * | 1984-12-29 | 1986-07-19 | Semedain Kk | 硬化性エポキシ樹脂組成物 |
JP2515344B2 (ja) * | 1987-07-24 | 1996-07-10 | 松下電工株式会社 | 封止用一液性の液状エポキシ樹脂組成物 |
JPH0689222B2 (ja) * | 1989-11-30 | 1994-11-09 | 住友ゴム工業株式会社 | エポキシ樹脂組成物 |
JP2558013B2 (ja) * | 1990-11-30 | 1996-11-27 | 株式会社トクヤマ | 導電性銅ペースト組成物及びその製造方法 |
EP0594133B1 (de) * | 1992-10-22 | 1998-05-06 | Ajinomoto Co., Inc. | Polythiol-Epoxidharz-Mischung mit längerer Verarbeitungszeit |
-
1999
- 1999-01-14 JP JP2000540193A patent/JP4394281B2/ja not_active Expired - Fee Related
- 1999-01-14 KR KR1020007007817A patent/KR100573326B1/ko not_active IP Right Cessation
- 1999-01-14 AU AU19811/99A patent/AU740553B2/en not_active Ceased
- 1999-01-14 CA CA002318167A patent/CA2318167A1/en not_active Abandoned
- 1999-01-14 BR BR9906962-8A patent/BR9906962A/pt not_active Application Discontinuation
- 1999-01-14 CN CNB998021156A patent/CN1165592C/zh not_active Expired - Fee Related
- 1999-01-14 IL IL13634499A patent/IL136344A0/xx unknown
- 1999-01-14 WO PCT/IE1999/000001 patent/WO1999036484A1/en active IP Right Grant
- 1999-01-14 DE DE69903256T patent/DE69903256T2/de not_active Expired - Fee Related
- 1999-01-14 EP EP99900626A patent/EP1047744B1/de not_active Expired - Lifetime
- 1999-01-15 MY MYPI99000181A patent/MY132966A/en unknown
- 1999-01-16 TW TW088100665A patent/TWI239968B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JP2002509178A (ja) | 2002-03-26 |
DE69903256D1 (de) | 2002-11-07 |
CN1165592C (zh) | 2004-09-08 |
CN1288481A (zh) | 2001-03-21 |
IL136344A0 (en) | 2001-05-20 |
JP4394281B2 (ja) | 2010-01-06 |
TWI239968B (en) | 2005-09-21 |
WO1999036484A1 (en) | 1999-07-22 |
EP1047744A1 (de) | 2000-11-02 |
MY132966A (en) | 2007-10-31 |
KR20010034183A (ko) | 2001-04-25 |
EP1047744B1 (de) | 2002-10-02 |
BR9906962A (pt) | 2000-10-10 |
KR100573326B1 (ko) | 2006-04-24 |
CA2318167A1 (en) | 1999-07-22 |
AU1981199A (en) | 1999-08-02 |
AU740553B2 (en) | 2001-11-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE69903256D1 (de) | Härtbare epoxyharzzusammensetzungen | |
DE59912991D1 (de) | Schlagfeste epoxidharz-zusammensetzungen | |
DE69927734D1 (de) | Härtbare Harzzusammensetzung | |
ATE277117T1 (de) | Schlagfeste epoxidharz-zusammensetzungen | |
DE60019018D1 (de) | Härtbare Harzzusammensetzung | |
DE69922073D1 (de) | Epoxidharzzusammensetzung | |
DE69922626D1 (de) | Harzzusammensetzung | |
DE69833789D1 (de) | Härtbare harzzusammensetzungen | |
DE69942430D1 (de) | Kunstharzzusammensetzung | |
DE69916514D1 (de) | Harzzusammensetzung | |
DE69921991D1 (de) | Harzzusammensetzungen | |
DE60043697D1 (de) | Härtbare harzzusammensetzungen | |
DE69912141D1 (de) | Härtbare perfluorelastomerzusammensetzung | |
DE69918698D1 (de) | Härtbare perfluorelastomerzusammensetzung | |
DE69513309T2 (de) | Epoxydharzzusammensetzung | |
DE69919221D1 (de) | Härtbare harzzusammensetzung | |
DE69908859D1 (de) | Wärmehärtbare Harzzusammensetzung | |
DE69918751D1 (de) | Fluorharzzusammensetzung | |
DE69721442D1 (de) | Härtbare Harzzusammensetzung | |
DE69926319D1 (de) | Harzzusammensetzung | |
DE69610690D1 (de) | Epoxidharzzusammensetzung | |
DE60024795D1 (de) | Härtbare harzzusammensetzung | |
DE69729464D1 (de) | Epoxidharzhärtungsmittel | |
DE69913026D1 (de) | Epoxidharzzusammensetzung | |
DE60107543D1 (de) | Wärmehärtbare harzzusammensetzung |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |