KR100532179B1 - 집적 회로 패키지를 위한 칩 규모 볼 그리드 어레이 - Google Patents

집적 회로 패키지를 위한 칩 규모 볼 그리드 어레이 Download PDF

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Publication number
KR100532179B1
KR100532179B1 KR10-1999-7004813A KR19997004813A KR100532179B1 KR 100532179 B1 KR100532179 B1 KR 100532179B1 KR 19997004813 A KR19997004813 A KR 19997004813A KR 100532179 B1 KR100532179 B1 KR 100532179B1
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layer
nonpolymer
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integrated circuit
conductive
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KR10-1999-7004813A
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Korean (ko)
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KR20000057332A (ko
Inventor
슈엘러,랜돌프,디.
가이싱어,존,디.
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미네소타 마이닝 앤드 매뉴팩춰링 캄파니
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    • H01L2924/01Chemical elements
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    • H01L2924/153Connection portion
    • H01L2924/1531Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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    • H01L2924/181Encapsulation
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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
KR10-1999-7004813A 1996-12-02 1997-04-02 집적 회로 패키지를 위한 칩 규모 볼 그리드 어레이 Expired - Fee Related KR100532179B1 (ko)

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US08/759,253 US5990545A (en) 1996-12-02 1996-12-02 Chip scale ball grid array for integrated circuit package

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Families Citing this family (92)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2891665B2 (ja) 1996-03-22 1999-05-17 株式会社日立製作所 半導体集積回路装置およびその製造方法
US20040061220A1 (en) * 1996-03-22 2004-04-01 Chuichi Miyazaki Semiconductor device and manufacturing method thereof
JP3195236B2 (ja) 1996-05-30 2001-08-06 株式会社日立製作所 接着フィルムを有する配線テープ,半導体装置及び製造方法
US6150193A (en) * 1996-10-31 2000-11-21 Amkor Technology, Inc. RF shielded device
US5981314A (en) 1996-10-31 1999-11-09 Amkor Technology, Inc. Near chip size integrated circuit package
US6962829B2 (en) * 1996-10-31 2005-11-08 Amkor Technology, Inc. Method of making near chip size integrated circuit package
TW392262B (en) * 1997-03-10 2000-06-01 Seiko Epson Corp Electric parts and semiconductor device and the manufacturing method thereof, and the assembled circuit board, and the electric device using the same
JP3301355B2 (ja) * 1997-07-30 2002-07-15 日立電線株式会社 半導体装置、半導体装置用tabテープ及びその製造方法、並びに半導体装置の製造方法
US5888850A (en) * 1997-09-29 1999-03-30 International Business Machines Corporation Method for providing a protective coating and electronic package utilizing same
US6310298B1 (en) * 1997-12-30 2001-10-30 Intel Corporation Printed circuit board substrate having solder mask-free edges
US6574858B1 (en) 1998-02-13 2003-06-10 Micron Technology, Inc. Method of manufacturing a chip package
JP3481117B2 (ja) * 1998-02-25 2003-12-22 富士通株式会社 半導体装置及びその製造方法
US6166433A (en) * 1998-03-26 2000-12-26 Fujitsu Limited Resin molded semiconductor device and method of manufacturing semiconductor package
US6265776B1 (en) * 1998-04-27 2001-07-24 Fry's Metals, Inc. Flip chip with integrated flux and underfill
US6089920A (en) 1998-05-04 2000-07-18 Micron Technology, Inc. Modular die sockets with flexible interconnects for packaging bare semiconductor die
WO2000005765A1 (de) * 1998-07-22 2000-02-03 Dyconex Patente Ag Verfahren zur herstellung von umverdrahtungssubstraten für halbleiterchippackungen
US6428641B1 (en) 1998-08-31 2002-08-06 Amkor Technology, Inc. Method for laminating circuit pattern tape on semiconductor wafer
US6479887B1 (en) 1998-08-31 2002-11-12 Amkor Technology, Inc. Circuit pattern tape for wafer-scale production of chip size semiconductor packages
JP2002527909A (ja) 1998-10-14 2002-08-27 ミネソタ マイニング アンド マニュファクチャリング カンパニー 相互接続された接地平面を有するテープボールグリッドアレイ
JP2000138262A (ja) 1998-10-31 2000-05-16 Anam Semiconductor Inc チップスケ―ル半導体パッケ―ジ及びその製造方法
JP2000138317A (ja) 1998-10-31 2000-05-16 Anam Semiconductor Inc 半導体装置及びその製造方法
TW434850B (en) * 1998-12-31 2001-05-16 World Wiser Electronics Inc Packaging equipment and method for integrated circuit
US6175160B1 (en) * 1999-01-08 2001-01-16 Intel Corporation Flip-chip having an on-chip cache memory
US6377464B1 (en) * 1999-01-29 2002-04-23 Conexant Systems, Inc. Multiple chip module with integrated RF capabilities
US6341418B1 (en) 1999-04-29 2002-01-29 International Business Machines Corporation Method for direct chip attach by solder bumps and an underfill layer
US6191483B1 (en) * 1999-05-06 2001-02-20 Philips Electronics North America Corporation Package structure for low cost and ultra thin chip scale package
JP3397725B2 (ja) * 1999-07-07 2003-04-21 沖電気工業株式会社 半導体装置、その製造方法及び半導体素子実装用テープの製造方法
JP3521325B2 (ja) * 1999-07-30 2004-04-19 シャープ株式会社 樹脂封止型半導体装置の製造方法
US6285077B1 (en) * 1999-08-19 2001-09-04 Lsi Logic Corporation Multiple layer tape ball grid array package
JP2001156212A (ja) * 1999-09-16 2001-06-08 Nec Corp 樹脂封止型半導体装置及びその製造方法
US6656765B1 (en) 2000-02-02 2003-12-02 Amkor Technology, Inc. Fabricating very thin chip size semiconductor packages
US6560108B2 (en) * 2000-02-16 2003-05-06 Hughes Electronics Corporation Chip scale packaging on CTE matched printed wiring boards
US6686652B1 (en) 2000-03-20 2004-02-03 National Semiconductor Locking lead tips and die attach pad for a leadless package apparatus and method
US6372539B1 (en) 2000-03-20 2002-04-16 National Semiconductor Corporation Leadless packaging process using a conductive substrate
US6399415B1 (en) * 2000-03-20 2002-06-04 National Semiconductor Corporation Electrical isolation in panels of leadless IC packages
US6452255B1 (en) 2000-03-20 2002-09-17 National Semiconductor, Corp. Low inductance leadless package
DE10014380A1 (de) * 2000-03-23 2001-10-04 Infineon Technologies Ag Vorrichtung zum Verpacken von elektronischen Bauteilen
US6444499B1 (en) * 2000-03-30 2002-09-03 Amkor Technology, Inc. Method for fabricating a snapable multi-package array substrate, snapable multi-package array and snapable packaged electronic components
US6320137B1 (en) 2000-04-11 2001-11-20 3M Innovative Properties Company Flexible circuit with coverplate layer and overlapping protective layer
TW466720B (en) * 2000-05-22 2001-12-01 Siliconware Precision Industries Co Ltd Semiconductor package with flash-prevention structure and manufacture method
US6501170B1 (en) 2000-06-09 2002-12-31 Micron Technology, Inc. Substrates and assemblies including pre-applied adhesion promoter
US6710456B1 (en) 2000-08-31 2004-03-23 Micron Technology, Inc. Composite interposer for BGA packages
JP4570809B2 (ja) * 2000-09-04 2010-10-27 富士通セミコンダクター株式会社 積層型半導体装置及びその製造方法
US6624005B1 (en) 2000-09-06 2003-09-23 Amkor Technology, Inc. Semiconductor memory cards and method of making same
US6809935B1 (en) 2000-10-10 2004-10-26 Megic Corporation Thermally compliant PCB substrate for the application of chip scale packages
US6552436B2 (en) * 2000-12-08 2003-04-22 Motorola, Inc. Semiconductor device having a ball grid array and method therefor
DE10064691A1 (de) * 2000-12-22 2002-07-04 Infineon Technologies Ag Elektronisches Bauteil mit einem Halbleiter-Chip und Kupferleiterbahnen auf dem Chip sowie ein Verfahren zu seiner Herstellung
US6770963B1 (en) 2001-01-04 2004-08-03 Broadcom Corporation Multi-power ring chip scale package for system level integration
DE10120408B4 (de) * 2001-04-25 2006-02-02 Infineon Technologies Ag Elektronisches Bauteil mit einem Halbleiterchip, elektronische Baugruppe aus gestapelten Halbleiterchips und Verfahren zu deren Herstellung
US7115986B2 (en) 2001-05-02 2006-10-03 Micron Technology, Inc. Flexible ball grid array chip scale packages
MY131114A (en) * 2001-06-27 2007-07-31 Shinko Electric Ind Co Wiring substrate having position information
US6793759B2 (en) * 2001-10-09 2004-09-21 Dow Corning Corporation Method for creating adhesion during fabrication of electronic devices
US6873059B2 (en) * 2001-11-13 2005-03-29 Texas Instruments Incorporated Semiconductor package with metal foil attachment film
US6664615B1 (en) * 2001-11-20 2003-12-16 National Semiconductor Corporation Method and apparatus for lead-frame based grid array IC packaging
US6657134B2 (en) 2001-11-30 2003-12-02 Honeywell International Inc. Stacked ball grid array
SG104291A1 (en) * 2001-12-08 2004-06-21 Micron Technology Inc Die package
SG104293A1 (en) 2002-01-09 2004-06-21 Micron Technology Inc Elimination of rdl using tape base flip chip on flex for die stacking
SG115459A1 (en) 2002-03-04 2005-10-28 Micron Technology Inc Flip chip packaging using recessed interposer terminals
US6975035B2 (en) 2002-03-04 2005-12-13 Micron Technology, Inc. Method and apparatus for dielectric filling of flip chip on interposer assembly
SG121707A1 (en) 2002-03-04 2006-05-26 Micron Technology Inc Method and apparatus for flip-chip packaging providing testing capability
SG115456A1 (en) 2002-03-04 2005-10-28 Micron Technology Inc Semiconductor die packages with recessed interconnecting structures and methods for assembling the same
SG115455A1 (en) 2002-03-04 2005-10-28 Micron Technology Inc Methods for assembly and packaging of flip chip configured dice with interposer
SG111935A1 (en) 2002-03-04 2005-06-29 Micron Technology Inc Interposer configured to reduce the profiles of semiconductor device assemblies and packages including the same and methods
US7437193B2 (en) * 2002-06-28 2008-10-14 Boston Scientific Neuromodulation Corporation Microstimulator employing improved recharging reporting and telemetry techniques
US20040036170A1 (en) 2002-08-20 2004-02-26 Lee Teck Kheng Double bumping of flexible substrate for first and second level interconnects
US6921975B2 (en) * 2003-04-18 2005-07-26 Freescale Semiconductor, Inc. Circuit device with at least partial packaging, exposed active surface and a voltage reference plane
US7266869B2 (en) * 2003-07-30 2007-09-11 Kyocera Corporation Method for manufacturing a piezoelectric oscillator
US20050056946A1 (en) * 2003-09-16 2005-03-17 Cookson Electronics, Inc. Electrical circuit assembly with improved shock resistance
JP3929966B2 (ja) * 2003-11-25 2007-06-13 新光電気工業株式会社 半導体装置及びその製造方法
US7075016B2 (en) * 2004-02-18 2006-07-11 Taiwan Semiconductor Manufacturing Co., Ltd. Underfilling efficiency by modifying the substrate design of flip chips
US11081370B2 (en) * 2004-03-23 2021-08-03 Amkor Technology Singapore Holding Pte. Ltd. Methods of manufacturing an encapsulated semiconductor device
DE102004020580A1 (de) * 2004-04-27 2005-11-17 Infineon Technologies Ag Verfahren zur Herstellung eines BGA-Chipmoduls und BGA-Chipmodul
US7071559B2 (en) * 2004-07-16 2006-07-04 International Business Machines Corporation Design of beol patterns to reduce the stresses on structures below chip bondpads
US8125076B2 (en) * 2004-11-12 2012-02-28 Stats Chippac Ltd. Semiconductor package system with substrate heat sink
JP4343117B2 (ja) * 2005-01-07 2009-10-14 株式会社ルネサステクノロジ 半導体装置およびその製造方法
US7968371B2 (en) * 2005-02-01 2011-06-28 Stats Chippac Ltd. Semiconductor package system with cavity substrate
US7316572B2 (en) * 2005-02-03 2008-01-08 International Business Machines Corporation Compliant electrical contacts
US20070018308A1 (en) * 2005-04-27 2007-01-25 Albert Schott Electronic component and electronic configuration
JP4548264B2 (ja) * 2005-08-01 2010-09-22 株式会社デンソー 車両用交流発電機
DE102006015222B4 (de) * 2006-03-30 2018-01-04 Robert Bosch Gmbh QFN-Gehäuse mit optimierter Anschlussflächengeometrie
US7573131B2 (en) * 2006-10-27 2009-08-11 Compass Technology Co., Ltd. Die-up integrated circuit package with grounded stiffener
US7788960B2 (en) * 2006-10-27 2010-09-07 Cummins Filtration Ip, Inc. Multi-walled tube and method of manufacture
TWI352406B (en) * 2006-11-16 2011-11-11 Nan Ya Printed Circuit Board Corp Embedded chip package with improved heat dissipati
US7944029B2 (en) * 2009-09-16 2011-05-17 Sandisk Corporation Non-volatile memory with reduced mobile ion diffusion
JP5642473B2 (ja) 2010-09-22 2014-12-17 セイコーインスツル株式会社 Bga半導体パッケージおよびその製造方法
CN104160497B (zh) * 2011-12-20 2017-10-27 英特尔公司 微电子封装和层叠微电子组件以及包括该封装和组件的计算系统
TWI544583B (zh) * 2012-04-18 2016-08-01 鴻海精密工業股份有限公司 晶片組裝結構及晶片組裝方法
TWI480989B (zh) * 2012-10-02 2015-04-11 矽品精密工業股份有限公司 半導體封裝件及其製法
US20160317068A1 (en) * 2015-04-30 2016-11-03 Verily Life Sciences Llc Electronic devices with encapsulating silicone based adhesive
US10381300B2 (en) * 2016-11-28 2019-08-13 Advanced Semiconductor Engineering, Inc. Semiconductor device package including filling mold via
CN112180128B (zh) * 2020-09-29 2023-08-01 珠海天成先进半导体科技有限公司 一种带弹性导电微凸点的互连基板和基于其的kgd插座
US11990695B2 (en) 2022-05-10 2024-05-21 Apple Inc. Method of reliably bonding solid metal piece to rigid PCB

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2439478A1 (fr) * 1978-10-19 1980-05-16 Cii Honeywell Bull Boitier plat pour dispositifs a circuits integres
US5148265A (en) * 1990-09-24 1992-09-15 Ist Associates, Inc. Semiconductor chip assemblies with fan-in leads
US5148266A (en) * 1990-09-24 1992-09-15 Ist Associates, Inc. Semiconductor chip assemblies having interposer and flexible lead
US5216278A (en) * 1990-12-04 1993-06-01 Motorola, Inc. Semiconductor device having a pad array carrier package
US5241133A (en) * 1990-12-21 1993-08-31 Motorola, Inc. Leadless pad array chip carrier
JPH05160292A (ja) * 1991-06-06 1993-06-25 Toshiba Corp 多層パッケージ
US5311059A (en) * 1992-01-24 1994-05-10 Motorola, Inc. Backplane grounding for flip-chip integrated circuit
US5214845A (en) * 1992-05-11 1993-06-01 Micron Technology, Inc. Method for producing high speed integrated circuits
US5592025A (en) * 1992-08-06 1997-01-07 Motorola, Inc. Pad array semiconductor device
US5468994A (en) * 1992-12-10 1995-11-21 Hewlett-Packard Company High pin count package for semiconductor device
US5420460A (en) * 1993-08-05 1995-05-30 Vlsi Technology, Inc. Thin cavity down ball grid array package based on wirebond technology
US5397921A (en) * 1993-09-03 1995-03-14 Advanced Semiconductor Assembly Technology Tab grid array
US5477611A (en) * 1993-09-20 1995-12-26 Tessera, Inc. Method of forming interface between die and chip carrier
US5548091A (en) * 1993-10-26 1996-08-20 Tessera, Inc. Semiconductor chip connection components with adhesives and methods for bonding to the chip
US5473512A (en) * 1993-12-16 1995-12-05 At&T Corp. Electronic device package having electronic device boonded, at a localized region thereof, to circuit board
TW258829B (enExample) * 1994-01-28 1995-10-01 Ibm
EP1213755A3 (en) * 1994-03-18 2005-05-25 Hitachi Chemical Co., Ltd. Fabrication process of semiconductor package and semiconductor package
US5741729A (en) * 1994-07-11 1998-04-21 Sun Microsystems, Inc. Ball grid array package for an integrated circuit
JP2616565B2 (ja) * 1994-09-12 1997-06-04 日本電気株式会社 電子部品組立体
US5528083A (en) * 1994-10-04 1996-06-18 Sun Microsystems, Inc. Thin film chip capacitor for electrical noise reduction in integrated circuits
JP3123638B2 (ja) * 1995-09-25 2001-01-15 株式会社三井ハイテック 半導体装置
US5674785A (en) * 1995-11-27 1997-10-07 Micron Technology, Inc. Method of producing a single piece package for semiconductor die

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US5990545A (en) 1999-11-23
KR20000057332A (ko) 2000-09-15
AU2435397A (en) 1998-06-29
WO1998025303A1 (en) 1998-06-11
ATE273564T1 (de) 2004-08-15
HK1023225A1 (en) 2000-09-01
EP0948814A1 (en) 1999-10-13
MY119341A (en) 2005-05-31
DE69730239D1 (de) 2004-09-16
CA2272434A1 (en) 1998-06-11
CN1239589A (zh) 1999-12-22
JP2001506057A (ja) 2001-05-08
EP0948814B1 (en) 2004-08-11

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