TW258829B - - Google Patents

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Publication number
TW258829B
TW258829B TW083111016A TW83111016A TW258829B TW 258829 B TW258829 B TW 258829B TW 083111016 A TW083111016 A TW 083111016A TW 83111016 A TW83111016 A TW 83111016A TW 258829 B TW258829 B TW 258829B
Authority
TW
Taiwan
Prior art keywords
thin
package
item
road
guide
Prior art date
Application number
TW083111016A
Other languages
English (en)
Chinese (zh)
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm filed Critical Ibm
Application granted granted Critical
Publication of TW258829B publication Critical patent/TW258829B/zh

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Classifications

    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
TW083111016A 1994-01-28 1994-11-26 TW258829B (enExample)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US18818594A 1994-01-28 1994-01-28

Publications (1)

Publication Number Publication Date
TW258829B true TW258829B (enExample) 1995-10-01

Family

ID=22692085

Family Applications (1)

Application Number Title Priority Date Filing Date
TW083111016A TW258829B (enExample) 1994-01-28 1994-11-26

Country Status (7)

Country Link
US (2) US5519936A (enExample)
JP (2) JP3057477B2 (enExample)
KR (1) KR0141067B1 (enExample)
CN (2) CN1107978C (enExample)
GB (1) GB2286084B (enExample)
MY (1) MY113991A (enExample)
TW (1) TW258829B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI496251B (zh) * 2011-02-25 2015-08-11 富士通股份有限公司 半導體裝置、該半導體裝置的製造方法及電子元件

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Also Published As

Publication number Publication date
JPH09330996A (ja) 1997-12-22
GB2286084B (en) 1998-01-14
CN1095201C (zh) 2002-11-27
CN1110431A (zh) 1995-10-18
CN1107978C (zh) 2003-05-07
KR0141067B1 (ko) 1998-06-01
JP3053585B2 (ja) 2000-06-19
JP3057477B2 (ja) 2000-06-26
GB2286084A (en) 1995-08-02
GB9500965D0 (en) 1995-03-08
CN1215920A (zh) 1999-05-05
US5519936A (en) 1996-05-28
HK1011499A1 (zh) 1999-07-09
MY113991A (en) 2002-07-31
KR950024311A (ko) 1995-08-21
JPH07226457A (ja) 1995-08-22
US5561323A (en) 1996-10-01

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