KR100455903B1 - 세정건조처리장치 - Google Patents

세정건조처리장치 Download PDF

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Publication number
KR100455903B1
KR100455903B1 KR10-1998-0022196A KR19980022196A KR100455903B1 KR 100455903 B1 KR100455903 B1 KR 100455903B1 KR 19980022196 A KR19980022196 A KR 19980022196A KR 100455903 B1 KR100455903 B1 KR 100455903B1
Authority
KR
South Korea
Prior art keywords
drying
shutter
cleaning
processing chamber
liquid
Prior art date
Application number
KR10-1998-0022196A
Other languages
English (en)
Korean (ko)
Other versions
KR19990006968A (ko
Inventor
카미카와 유지
Original Assignee
동경 엘렉트론 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP17279497A external-priority patent/JP3156074B2/ja
Priority claimed from JP18602497A external-priority patent/JP3156075B2/ja
Application filed by 동경 엘렉트론 주식회사 filed Critical 동경 엘렉트론 주식회사
Publication of KR19990006968A publication Critical patent/KR19990006968A/ko
Application granted granted Critical
Publication of KR100455903B1 publication Critical patent/KR100455903B1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
KR10-1998-0022196A 1997-06-13 1998-06-13 세정건조처리장치 KR100455903B1 (ko)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP1997-172794 1997-06-13
JP97-172794 1997-06-13
JP17279497A JP3156074B2 (ja) 1997-06-13 1997-06-13 洗浄・乾燥処理装置
JP18602497A JP3156075B2 (ja) 1997-06-27 1997-06-27 乾燥処理装置
JP97-186024 1997-06-27
JP1997-186024 1997-06-27

Publications (2)

Publication Number Publication Date
KR19990006968A KR19990006968A (ko) 1999-01-25
KR100455903B1 true KR100455903B1 (ko) 2005-01-24

Family

ID=26495030

Family Applications (1)

Application Number Title Priority Date Filing Date
KR10-1998-0022196A KR100455903B1 (ko) 1997-06-13 1998-06-13 세정건조처리장치

Country Status (4)

Country Link
US (1) US6164297A (de)
EP (1) EP0884764B1 (de)
KR (1) KR100455903B1 (de)
DE (1) DE69837364T2 (de)

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JP3837016B2 (ja) * 2000-09-28 2006-10-25 大日本スクリーン製造株式会社 基板処理方法および基板処理装置
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JP4634266B2 (ja) * 2005-09-28 2011-02-16 大日本スクリーン製造株式会社 基板処理装置
US8635784B2 (en) * 2005-10-04 2014-01-28 Applied Materials, Inc. Methods and apparatus for drying a substrate
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JP5815967B2 (ja) * 2011-03-31 2015-11-17 東京エレクトロン株式会社 基板洗浄装置及び真空処理システム
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CN113169098A (zh) 2018-12-03 2021-07-23 应用材料公司 用于马兰戈尼干燥的方法和设备
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Also Published As

Publication number Publication date
DE69837364D1 (de) 2007-05-03
EP0884764A2 (de) 1998-12-16
KR19990006968A (ko) 1999-01-25
US6164297A (en) 2000-12-26
DE69837364T2 (de) 2007-11-29
EP0884764A3 (de) 2004-01-21
EP0884764B1 (de) 2007-03-21

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