DE69837364D1 - Reinigungs- und Trocknungsvorrichtung von zu behandelnden Gegenständen - Google Patents

Reinigungs- und Trocknungsvorrichtung von zu behandelnden Gegenständen

Info

Publication number
DE69837364D1
DE69837364D1 DE69837364T DE69837364T DE69837364D1 DE 69837364 D1 DE69837364 D1 DE 69837364D1 DE 69837364 T DE69837364 T DE 69837364T DE 69837364 T DE69837364 T DE 69837364T DE 69837364 D1 DE69837364 D1 DE 69837364D1
Authority
DE
Germany
Prior art keywords
cleaning
treated
objects
drying device
drying
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69837364T
Other languages
English (en)
Other versions
DE69837364T2 (de
Inventor
Yuji Kamikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP17279497A external-priority patent/JP3156074B2/ja
Priority claimed from JP18602497A external-priority patent/JP3156075B2/ja
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Application granted granted Critical
Publication of DE69837364D1 publication Critical patent/DE69837364D1/de
Publication of DE69837364T2 publication Critical patent/DE69837364T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
DE69837364T 1997-06-13 1998-06-15 Reinigungs- und Trocknungsvorrichtung von zu behandelnden Gegenständen Expired - Lifetime DE69837364T2 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP17279497 1997-06-13
JP17279497A JP3156074B2 (ja) 1997-06-13 1997-06-13 洗浄・乾燥処理装置
JP18602497A JP3156075B2 (ja) 1997-06-27 1997-06-27 乾燥処理装置
JP18602497 1997-06-27

Publications (2)

Publication Number Publication Date
DE69837364D1 true DE69837364D1 (de) 2007-05-03
DE69837364T2 DE69837364T2 (de) 2007-11-29

Family

ID=26495030

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69837364T Expired - Lifetime DE69837364T2 (de) 1997-06-13 1998-06-15 Reinigungs- und Trocknungsvorrichtung von zu behandelnden Gegenständen

Country Status (4)

Country Link
US (1) US6164297A (de)
EP (1) EP0884764B1 (de)
KR (1) KR100455903B1 (de)
DE (1) DE69837364T2 (de)

Families Citing this family (61)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6050275A (en) 1996-09-27 2000-04-18 Tokyo Electron Limited Apparatus for and method of cleaning objects to be processed
JP3171807B2 (ja) 1997-01-24 2001-06-04 東京エレクトロン株式会社 洗浄装置及び洗浄方法
TW539918B (en) * 1997-05-27 2003-07-01 Tokyo Electron Ltd Removal of photoresist and photoresist residue from semiconductors using supercritical carbon dioxide process
US6334266B1 (en) * 1999-09-20 2002-01-01 S.C. Fluids, Inc. Supercritical fluid drying system and method of use
US6748960B1 (en) 1999-11-02 2004-06-15 Tokyo Electron Limited Apparatus for supercritical processing of multiple workpieces
JP2001176833A (ja) 1999-12-14 2001-06-29 Tokyo Electron Ltd 基板処理装置
US6502591B1 (en) * 2000-06-08 2003-01-07 Semitool, Inc. Surface tension effect dryer with porous vessel walls
JP3837016B2 (ja) * 2000-09-28 2006-10-25 大日本スクリーン製造株式会社 基板処理方法および基板処理装置
US6732749B2 (en) * 2000-12-22 2004-05-11 Akrion, Llc Particle barrier drain
KR100899609B1 (ko) * 2000-12-28 2009-05-27 도쿄엘렉트론가부시키가이샤 기판처리장치 및 기판처리방법
KR100440891B1 (ko) * 2001-02-01 2004-07-19 에이펫(주) 웨이퍼 건조 방법
KR100419561B1 (ko) * 2001-02-01 2004-02-19 에이펫(주) 웨이퍼 세정 및 건조 장치
US6564469B2 (en) * 2001-07-09 2003-05-20 Motorola, Inc. Device for performing surface treatment on semiconductor wafers
US20040025901A1 (en) * 2001-07-16 2004-02-12 Semitool, Inc. Stationary wafer spin/spray processor
JP2003164816A (ja) * 2001-11-29 2003-06-10 Fine Machine Kataoka Kk 洗浄装置と、そのワーク搬送方法
KR100454241B1 (ko) * 2001-12-28 2004-10-26 한국디엔에스 주식회사 웨이퍼 건조 장비
JP3939178B2 (ja) * 2002-03-25 2007-07-04 大日本スクリーン製造株式会社 高圧乾燥装置、高圧乾燥方法および基板処理装置
KR100481858B1 (ko) * 2002-07-22 2005-04-11 삼성전자주식회사 공비혼합 효과를 이용하여 반도체기판을 건조시키는 장비및 상기 장비를 사용하는 건조방법
US20040074102A1 (en) * 2002-10-21 2004-04-22 Taiwan Semiconductor Manufacturing Co., Ltd. Dryer lid for substrate dryer
US6722642B1 (en) 2002-11-06 2004-04-20 Tokyo Electron Limited High pressure compatible vacuum chuck for semiconductor wafer including lift mechanism
US6918192B2 (en) * 2002-11-07 2005-07-19 Taiwan Semiconductor Manufacturing Co., Ltd. Substrate drying system
JP2004207503A (ja) * 2002-12-25 2004-07-22 Canon Inc 処理装置
US7146994B2 (en) * 2003-03-17 2006-12-12 Novellus Systems, Inc. Active rinse shield for electrofill chemical bath and method of use
US7270137B2 (en) * 2003-04-28 2007-09-18 Tokyo Electron Limited Apparatus and method of securing a workpiece during high-pressure processing
KR100568104B1 (ko) * 2003-08-26 2006-04-05 삼성전자주식회사 반도체 기판 세정 장치 및 세정 방법
KR100636035B1 (ko) * 2003-11-08 2006-10-18 삼성전자주식회사 웨이퍼를 건조하기 위한 방법 및 장치, 그리고 웨이퍼 건조 장치를 포함하는 웨이퍼 처리 장치
KR20050068063A (ko) * 2003-12-29 2005-07-05 삼성전자주식회사 회전가능한 건조가스 노즐들을 갖는 린스/건조 장비 및이를 사용하여 반도체 웨이퍼들을 린스/건조시키는 방법
JP2006093334A (ja) * 2004-09-22 2006-04-06 Ses Co Ltd 基板処理装置
US7228645B2 (en) * 2005-01-11 2007-06-12 Xuyen Ngoc Pham Multi-zone shower head for drying single semiconductor substrate
JP2006310767A (ja) * 2005-03-28 2006-11-09 Dainippon Screen Mfg Co Ltd 基板処理装置
US7767145B2 (en) 2005-03-28 2010-08-03 Toyko Electron Limited High pressure fourier transform infrared cell
US20060219274A1 (en) * 2005-03-29 2006-10-05 Dainippon Screen Mfg. Co., Ltd. Substrate processing apparatus
US7789971B2 (en) 2005-05-13 2010-09-07 Tokyo Electron Limited Treatment of substrate using functionalizing agent in supercritical carbon dioxide
JP4535967B2 (ja) * 2005-08-19 2010-09-01 大日本スクリーン製造株式会社 基板処理装置
JP4634266B2 (ja) * 2005-09-28 2011-02-16 大日本スクリーン製造株式会社 基板処理装置
WO2007047163A2 (en) * 2005-10-04 2007-04-26 Applied Materials, Inc. Methods and apparatus for drying a substrate
DE102005058269B4 (de) * 2005-12-06 2011-12-01 Stangl Semiconductor Equipment Ag Vorrichtung zum Reinigen eines gesägten Waferblocks
KR100753959B1 (ko) * 2006-01-12 2007-08-31 에이펫(주) 기판 건조장치를 이용한 기판 건조방법
KR100816740B1 (ko) * 2006-08-30 2008-03-27 세메스 주식회사 기판 처리 장치 및 방법
US20080155852A1 (en) * 2006-12-29 2008-07-03 Olgado Donald J K Multiple substrate vapor drying systems and methods
US8033288B2 (en) * 2007-03-09 2011-10-11 Dainippon Screen Mfg. Co., Ltd. Substrate treatment apparatus
US20100307022A1 (en) * 2007-06-26 2010-12-09 Gisulfo Baccini Drying apparatus and method for silicon-based electronic circuits
JP5122265B2 (ja) * 2007-10-01 2013-01-16 東京エレクトロン株式会社 基板処理装置および基板処理方法
KR101431197B1 (ko) * 2008-01-24 2014-09-17 삼성전자주식회사 원자층 증착설비 및 그의 원자층 증착방법
US8344761B2 (en) * 2008-09-19 2013-01-01 Ikanos Communications, Inc. 3-level line driver
US8429831B2 (en) * 2009-09-04 2013-04-30 Abbott Cardiovascular Systems Inc. Drug-eluting coatings applied to medical devices by spraying and drying to remove solvent
US8011114B2 (en) * 2009-12-04 2011-09-06 Superior Investments, Inc. Vehicle dryer with butterfly inlet valve
KR101255902B1 (ko) * 2011-02-28 2013-04-17 삼성전기주식회사 기판 건조 장치 및 기판 건조 방법
JP5815967B2 (ja) * 2011-03-31 2015-11-17 東京エレクトロン株式会社 基板洗浄装置及び真空処理システム
JP5708506B2 (ja) * 2011-04-20 2015-04-30 東京エレクトロン株式会社 処理装置
DE202011110123U1 (de) * 2011-11-29 2013-02-21 Rena Gmbh Vorrichtung zum Trocknen von Substraten
JP5923300B2 (ja) * 2011-12-28 2016-05-24 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
KR101517152B1 (ko) * 2013-08-29 2015-04-30 주식회사 케이씨텍 기판 처리 장치 및 그 제어 방법
US20150090299A1 (en) * 2013-09-27 2015-04-02 Applied Materials, Inc. Processes and apparatus for cleaning, rinsing, and drying substrates
TWI630652B (zh) 2014-03-17 2018-07-21 斯克林集團公司 基板處理裝置及使用基板處理裝置之基板處理方法
JP6499414B2 (ja) 2014-09-30 2019-04-10 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
CN109196632A (zh) * 2016-06-16 2019-01-11 应用材料公司 晶片处理器门接口
WO2020117685A1 (en) * 2018-12-03 2020-06-11 Applied Materials, Inc. Methods and apparatus for marangoni drying
CN112185852B (zh) * 2020-09-21 2023-08-18 武汉光谷航天三江激光产业技术研究院有限公司 用于半导体器件封装的可搬运级联式百级洁净装置及方法
JP7475252B2 (ja) * 2020-10-02 2024-04-26 東京エレクトロン株式会社 基板処理装置、及び基板処理方法
JP2022138907A (ja) * 2021-03-11 2022-09-26 キオクシア株式会社 基板洗浄装置および基板洗浄方法

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2544423A (en) * 1948-05-15 1951-03-06 Daniel And Florence Guggenheim Liquid-sealing means between stationary and rotated parts
US4132567A (en) * 1977-10-13 1979-01-02 Fsi Corporation Apparatus for and method of cleaning and removing static charges from substrates
US4286541A (en) * 1979-07-26 1981-09-01 Fsi Corporation Applying photoresist onto silicon wafers
US4911761A (en) * 1984-05-21 1990-03-27 Cfm Technologies Research Associates Process and apparatus for drying surfaces
NL8900480A (nl) * 1989-02-27 1990-09-17 Philips Nv Werkwijze en inrichting voor het drogen van substraten na behandeling in een vloeistof.
US5222310A (en) * 1990-05-18 1993-06-29 Semitool, Inc. Single wafer processor with a frame
SE467484B (sv) * 1990-11-12 1992-07-27 Holmstrands Machinery Ab Apparat foer rengoering av verkstadsgods
JPH05234974A (ja) * 1992-02-19 1993-09-10 Ricoh Co Ltd 基板洗浄装置及び洗浄方法
US5224503A (en) * 1992-06-15 1993-07-06 Semitool, Inc. Centrifugal wafer carrier cleaning apparatus
JPH06459A (ja) * 1992-06-19 1994-01-11 T H I Syst Kk 洗浄乾燥方法とその装置
JP3347814B2 (ja) * 1993-05-17 2002-11-20 大日本スクリーン製造株式会社 基板の洗浄・乾燥処理方法並びにその処理装置
US5409310A (en) * 1993-09-30 1995-04-25 Semitool, Inc. Semiconductor processor liquid spray system with additive blending
US5863348A (en) * 1993-12-22 1999-01-26 International Business Machines Corporation Programmable method for cleaning semiconductor elements
US5431178A (en) * 1994-03-30 1995-07-11 Chiu; Hsien Hsin Centrifugal type, enclosed cleaning apparatus
DE4413077C2 (de) * 1994-04-15 1997-02-06 Steag Micro Tech Gmbh Verfahren und Vorrichtung zur chemischen Behandlung von Substraten
US5571337A (en) * 1994-11-14 1996-11-05 Yieldup International Method for cleaning and drying a semiconductor wafer
US5752532A (en) * 1995-08-17 1998-05-19 Schwenkler; Robert S. Method for the precision cleaning and drying surfaces
JPH0969509A (ja) * 1995-09-01 1997-03-11 Matsushita Electron Corp 半導体ウェーハの洗浄・エッチング・乾燥装置及びその使用方法
US6050275A (en) * 1996-09-27 2000-04-18 Tokyo Electron Limited Apparatus for and method of cleaning objects to be processed
DE19832038A1 (de) * 1997-07-17 1999-01-28 Tokyo Electron Ltd Verfahren und Einrichtung zum Reinigen und Trocknen

Also Published As

Publication number Publication date
KR19990006968A (ko) 1999-01-25
DE69837364T2 (de) 2007-11-29
EP0884764B1 (de) 2007-03-21
EP0884764A2 (de) 1998-12-16
KR100455903B1 (ko) 2005-01-24
US6164297A (en) 2000-12-26
EP0884764A3 (de) 2004-01-21

Similar Documents

Publication Publication Date Title
DE69837364D1 (de) Reinigungs- und Trocknungsvorrichtung von zu behandelnden Gegenständen
DE69838273D1 (de) Verfahren zum Reinigen und Trocknen von zu verarbeitenden Objekte
DE69803199D1 (de) Erkennung und entfernung von makroviren
DE69501493T2 (de) Entfernung von Feuchtigkeit und Passivierung von Oberflächen
DE69520296D1 (de) Oberflächenbehandlungsmittel und Oberflächenbehandlung von Halbleiter
DE69831755D1 (de) Optoakustische kontrastmittel und anwendungsverfahren
DE59813922D1 (de) Wasch- und reinigungsmittel
EE04597B1 (et) Esemete kuivpuhastuseade ja eseme kuivpuhastusmeetod
DE69721875D1 (de) Wasch- und Trocknermaschine
IT1308704B1 (it) Procedimento e dispositivo per trattare stoviglie in lavastoglie
DE69626551D1 (de) Flüssigkeiten aufnehmende Vorrichtung zum Reinigen und Trocknen von Oberflächen
DE29721320U1 (de) Waschmaschine und/oder Waschtrockner
DE69503361D1 (de) Badewanne für waschen und trocknen von kleintieren
DE59601750D1 (de) Wäschebehandlungsgerät zum Waschen und Trocknen von Wäsche
DE69629961D1 (de) Inhibierung von Exoproteinen in absorbiereden Produkten
DE69817779D1 (de) Einbringung von rauchmodifizierenden mitteln in rauchartikeln
DE69928808D1 (de) Reinigungsmittel und ihre verwendung zum entfernen von flecken von kleidung und textilien
ID18913A (id) Turunan turunan tienopiridin dan penggunaannya
KR900007493A (ko) 증기청소 및 건조방법과 장치
DE69808856T2 (de) Körperreinigungs- und Abreibungsgerät
FI980226A (fi) Kuorittavan puun käsittelymenetelmä ja laitteisto
ATA14887A (de) Teilchenfoermiges wasch- und weichmachungsmittel
DE69802300T2 (de) Behandlung von schädlichen flüssigkeiten
FR2722970B3 (fr) Appareil laveur-aspirateur perfectionne
ID19264A (id) Pro-katalisator dan pengolahan untuk membuatnya

Legal Events

Date Code Title Description
8364 No opposition during term of opposition