KR100304600B1 - 에폭시수지혼합물 - Google Patents

에폭시수지혼합물 Download PDF

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Publication number
KR100304600B1
KR100304600B1 KR1019950703868A KR19950703868A KR100304600B1 KR 100304600 B1 KR100304600 B1 KR 100304600B1 KR 1019950703868 A KR1019950703868 A KR 1019950703868A KR 19950703868 A KR19950703868 A KR 19950703868A KR 100304600 B1 KR100304600 B1 KR 100304600B1
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KR
South Korea
Prior art keywords
epoxy resin
resin mixture
epoxy
phosphorus
acid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1019950703868A
Other languages
English (en)
Korean (ko)
Other versions
KR960701115A (ko
Inventor
볼프강 폰겐츠코브
위르겐 후버
하인리히 카피차
볼프강 로글러
한스-예르크 클라이너
Original Assignee
칼 하인쯔 호르닝어
지멘스 악티엔게젤샤프트
훽스트 악티엔게젤샤프트
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19934308184 external-priority patent/DE4308184A1/de
Application filed by 칼 하인쯔 호르닝어, 지멘스 악티엔게젤샤프트, 훽스트 악티엔게젤샤프트 filed Critical 칼 하인쯔 호르닝어
Publication of KR960701115A publication Critical patent/KR960701115A/ko
Application granted granted Critical
Publication of KR100304600B1 publication Critical patent/KR100304600B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • C08G59/1405—Polycondensates modified by chemical after-treatment with inorganic compounds
    • C08G59/1422—Polycondensates modified by chemical after-treatment with inorganic compounds containing phosphorus
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
    • C08G59/1488—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing phosphorus
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C08G59/304—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing phosphorus
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3254—Epoxy compounds containing three or more epoxy groups containing atoms other than carbon, hydrogen, oxygen or nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5046—Amines heterocyclic
    • C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
    • C08G59/508—Amines heterocyclic containing only nitrogen as a heteroatom having three nitrogen atoms in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5046—Amines heterocyclic
    • C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
    • C08G59/508—Amines heterocyclic containing only nitrogen as a heteroatom having three nitrogen atoms in the ring
    • C08G59/5086—Triazines; Melamines; Guanamines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y10T428/31518—Next to glass or quartz
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31525—Next to glass or quartz

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Inorganic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Epoxy Resins (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
  • Paints Or Removers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Organic Insulating Materials (AREA)
KR1019950703868A 1993-03-15 1994-03-10 에폭시수지혼합물 Expired - Fee Related KR100304600B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DEP4308184.3 1993-03-15
DE19934308184 DE4308184A1 (de) 1993-03-15 1993-03-15 Epoxidharzmischungen
PCT/EP1994/000750 WO1994021706A1 (de) 1993-03-15 1994-03-10 Epoxidharzmischungen

Publications (2)

Publication Number Publication Date
KR960701115A KR960701115A (ko) 1996-02-24
KR100304600B1 true KR100304600B1 (ko) 2001-11-22

Family

ID=6482839

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1019950703868A Expired - Fee Related KR100304600B1 (ko) 1993-03-15 1994-03-10 에폭시수지혼합물
KR1019950703897A Ceased KR960701118A (ko) 1993-03-15 1994-03-10 인-개질된 에폭시 수지, 이들의 제조방법 및 이들의 용도(phosphorus-modified epoxy resins, process for producing them and their use)

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1019950703897A Ceased KR960701118A (ko) 1993-03-15 1994-03-10 인-개질된 에폭시 수지, 이들의 제조방법 및 이들의 용도(phosphorus-modified epoxy resins, process for producing them and their use)

Country Status (15)

Country Link
US (1) US5648171A (enExample)
EP (2) EP0689559B1 (enExample)
JP (2) JPH08507813A (enExample)
KR (2) KR100304600B1 (enExample)
CN (2) CN1119447A (enExample)
AT (1) ATE154369T1 (enExample)
CA (2) CA2158362A1 (enExample)
CZ (2) CZ287737B6 (enExample)
DE (2) DE4340834A1 (enExample)
FI (2) FI954292A0 (enExample)
HU (2) HU213902B (enExample)
PL (2) PL175777B1 (enExample)
RU (2) RU2126426C1 (enExample)
TW (2) TW261622B (enExample)
WO (2) WO1994021706A1 (enExample)

Families Citing this family (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4308187A1 (de) * 1993-03-15 1994-09-22 Siemens Ag Epoxidharzmischungen
TW294693B (enExample) * 1994-09-09 1997-01-01 Siemens Ag
DE19613067C2 (de) * 1996-04-01 1998-12-03 Clariant Gmbh Phosphormodifizierte Epoxidharzmischungen aus Epoxidharzen, phosphorhaltigen Verbindungen und einem Härter, ein Verfahren zu deren Herstellung und ihre Verwendung
DE19613066C2 (de) * 1996-04-01 1998-09-10 Clariant Gmbh Verfahren zur Herstellung phosphormodifizierter Epoxidharze
DE19619095A1 (de) 1996-05-06 1997-11-13 Schill & Seilacher Flammfeste Epoxidharze und Flammschutzmittel für Epoxidharze
US6201074B1 (en) 1996-09-26 2001-03-13 Siemens Aktiengesellschaft Mixture of epoxy resin, epoxide group-containing P compound, P-modified epoxy resin and polyamine
US6207595B1 (en) 1998-03-02 2001-03-27 International Business Machines Corporation Laminate and method of manufacture thereof
DE19917428A1 (de) 1999-04-19 2000-10-26 Clariant Gmbh Flammwidrige phosphormodifizierte Epoxidharze
JP4535559B2 (ja) * 2000-04-04 2010-09-01 イビデン株式会社 多層プリント配線板
CN101925260A (zh) 1999-08-12 2010-12-22 Ibiden股份有限公司 多层印刷电路板
JP4530469B2 (ja) * 2000-04-04 2010-08-25 イビデン株式会社 多層プリント配線板および多層プリント配線板の製造方法
US20060099458A1 (en) * 2001-02-15 2006-05-11 Hanson Mark V 1, 4-Hydroquinone functionalized phosphinates and phosphonates
EP1363922B1 (en) 2001-02-15 2006-07-26 Great Lakes Chemical Corporation Novel hydroxyaryl phosphine oxides mixture, glycidyl ethers and epoxy compositions, composites and laminates derived therefrom
US6887950B2 (en) * 2001-02-15 2005-05-03 Pabu Services, Inc. Phosphine oxide hydroxyaryl mixtures with novolac resins for co-curing epoxy resins
JP2002275244A (ja) * 2001-03-19 2002-09-25 Dainippon Ink & Chem Inc エポキシ樹脂組成物
AT411061B (de) * 2001-11-30 2003-09-25 Solutia Austria Gmbh Wässrige härter für wässrige epoxidharzdispersionen
TWI278481B (en) * 2002-04-16 2007-04-11 Hitachi Chemical Co Ltd Thermosetting resin composition, prepreg and laminate using the same
RU2247752C1 (ru) * 2003-10-06 2005-03-10 Казанский государственный технический университет им. А.Н. Туполева (КГТУ им. А.Н. Туполева) Способ получения электроизоляционного компаунда
JP5250972B2 (ja) * 2004-02-27 2013-07-31 東レ株式会社 炭素繊維強化複合材料用エポキシ樹脂組成物、プリプレグ、一体化成形品、繊維強化複合材料板、および電気・電子機器用筐体
KR101184139B1 (ko) * 2004-03-29 2012-09-18 스미토모 베이클라이트 가부시키가이샤 수지 조성물, 수지 부착 금속박, 기재 부착 절연시트 및다층 프린트 배선판
US7078816B2 (en) 2004-03-31 2006-07-18 Endicott Interconnect Technologies, Inc. Circuitized substrate
US7270845B2 (en) * 2004-03-31 2007-09-18 Endicott Interconnect Technologies, Inc. Dielectric composition for forming dielectric layer for use in circuitized substrates
US7145221B2 (en) * 2004-03-31 2006-12-05 Endicott Interconnect Technologies, Inc. Low moisture absorptive circuitized substrate, method of making same, electrical assembly utilizing same, and information handling system utilizing same
CN103554184A (zh) 2004-05-28 2014-02-05 陶氏环球技术有限责任公司 可用于制造无卤素抗引燃聚合物的含磷化合物
GB2451233A (en) * 2007-07-21 2009-01-28 Leigh S Paints Intumescent coating composition
JP2011502206A (ja) * 2007-10-31 2011-01-20 ロード コーポレーション 油性基体への接着性の改善のための添加剤
EP2083030A1 (en) * 2008-01-15 2009-07-29 Cytec Surface Specialties Austria GmbH Water-borne epoxy resin systems
US20090258161A1 (en) * 2008-04-10 2009-10-15 Japp Robert M Circuitized substrate with P-aramid dielectric layers and method of making same
CN101591471B (zh) * 2008-05-26 2011-03-16 台燿科技股份有限公司 处理无卤素铜箔基板材料的树脂组合物
US20110065838A1 (en) * 2009-09-11 2011-03-17 Chemtura Corporation Hydroxyphenyl Phosphine Oxide Mixtures and their use as Flame Retardants for Epoxy Resins
US20110065870A1 (en) 2009-09-11 2011-03-17 Chemtura Corporation Tris(Hydroxoxyphenyl) Phosphine Oxides and their Use as Flame Retardants for Epoxy Resins
RU2422273C1 (ru) * 2009-12-10 2011-06-27 Государственное образовательное учреждение высшего профессионального образования "Тихоокеанский государственный университет" Способ формования изделий из эпоксидной смолы
EP2528971A2 (en) * 2010-01-29 2012-12-05 Dow Global Technologies LLC Compositions having phosphorus-containing compounds
CN101880507B (zh) * 2010-07-02 2013-03-13 石家庄市金达特种涂料有限公司 一种膨胀型水性防火清漆及制备方法
CN102304322B (zh) * 2011-08-31 2013-07-31 蚌埠市英路光电有限公司 一种耐热聚酯亚胺漆包线漆及其制备方法
CN102304320A (zh) * 2011-08-31 2012-01-04 蚌埠市英路光电有限公司 一种低温环保聚酯亚胺漆包线漆及其制备方法
CN102304321A (zh) * 2011-08-31 2012-01-04 蚌埠市英路光电有限公司 酚型聚酯漆包线漆及其制备方法
US9181628B2 (en) * 2011-09-14 2015-11-10 Prc-Desoto International, Inc. Coating/sealant systems, aqueous resinous dispersions, and methods of electrocoating
CN102559014B (zh) * 2011-12-14 2014-05-28 东华大学 一种电动工具转子用无溶剂滴浸漆及其制备方法
RU2573003C2 (ru) * 2013-11-28 2016-01-20 Российская Федерация, от имени которой выступает Министерство промышленности и торговли Российской Федерации (Минпромторг России) Эпоксивинилэфирная смола и огнестойкий полимерный композиционный материал на ее основе
RU2569537C1 (ru) * 2014-09-19 2015-11-27 Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Комсомольский-на-Амуре государственный технический университет" (ФГБОУ ВПО "КнАГТУ") Способ получения слоистого пластика
US9534108B2 (en) 2015-03-13 2017-01-03 Chemtura Corporation Flame retardant epoxy resins comprising phosphorus containing flame retardants
CN108191840B (zh) * 2017-12-13 2020-11-24 华南理工大学 一种含六氢三嗪结构环氧树脂预聚物及其制备方法
CN109400957B (zh) * 2018-07-19 2020-11-27 中国科学院宁波材料技术与工程研究所 一种生物碱磷酸盐阻燃剂及其制备方法
WO2020197561A1 (en) * 2019-03-28 2020-10-01 Safran Cabin Inc. Fire retardant epoxy resin
EP4045575A4 (en) * 2019-10-18 2023-11-08 Toray Industries, Inc. FLAME-RESISTANT EXPOXY RESIN COMPOSITION
JP7757957B2 (ja) * 2019-10-18 2025-10-22 東レ株式会社 難燃剤組成物、繊維強化複合材料
EP3926024A1 (de) * 2020-06-17 2021-12-22 Clariant International Ltd Phosphorhaltige flammschutzmittelmischungen, ein verfahren zu ihrer herstellung und ihre verwendung sowie epoxidharzformulierungen, die diese flammschutzmittelmischungen enthalten

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2732367A (en) * 1956-01-24 ruuivj
GB191110794A (en) * 1911-05-04 1912-04-11 John Dugmore Improvements in or relating to Studs, Solitaires, Buttons or the like.
US2766139A (en) * 1955-04-13 1956-10-09 Masonite Corp Method of producing fire resistant lignocellulose hardboard products
US3398019A (en) * 1963-02-21 1968-08-20 Monsanto Co Method for fireproofing cellulosic material
US3373135A (en) * 1964-12-01 1968-03-12 Kalk Chemische Fabrik Gmbh Shaped articles of self-extinguishing epoxy resins
US3364159A (en) * 1965-09-27 1968-01-16 Argus Chem Curing vicinal epoxy compounds and curing compositions therefor
GB1112139A (en) * 1967-01-13 1968-05-01 Shell Int Research Curable polyepoxide compositions for making flame retardant articles
US3862148A (en) * 1968-09-11 1975-01-21 Merck & Co Inc P-(-)-(cis-1,2-epoxypropyl)-isohypophosphoric acid compounds
DE2743680C2 (de) * 1977-09-28 1985-04-11 Siemens AG, 1000 Berlin und 8000 München Selbstverlöschende Verbundwerkstoffe
GB8610067D0 (en) * 1986-04-24 1986-05-29 Steetley Refractories Ltd Coated magnesium hydroxide
EP0274646B1 (de) * 1986-12-15 1992-02-05 Siemens Nixdorf Informationssysteme Aktiengesellschaft Verfahren zur Herstellung von Prepregs und deren Verwendung
EP0384939B1 (de) * 1989-03-03 1994-06-22 Siemens Aktiengesellschaft Epoxidharz-Formmassen
ATE107677T1 (de) * 1989-03-03 1994-07-15 Siemens Ag Epoxidharzmischungen.

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KR960701115A (ko) 1996-02-24
RU2126426C1 (ru) 1999-02-20
TW261622B (enExample) 1995-11-01
RU2116323C1 (ru) 1998-07-27
CN1046949C (zh) 1999-12-01
FI954292A7 (fi) 1995-09-13
US5648171A (en) 1997-07-15
HUT73868A (en) 1996-10-28
WO1994021705A1 (de) 1994-09-29
PL310630A1 (en) 1995-12-27
HUT73149A (en) 1996-06-28
ATE154369T1 (de) 1997-06-15
HU214671B (hu) 1998-04-28
JPH08507814A (ja) 1996-08-20
HU9502639D0 (en) 1995-11-28
DE4340834A1 (de) 1994-09-22
PL310629A1 (en) 1995-12-27
CN1119444A (zh) 1996-03-27
JPH08507813A (ja) 1996-08-20
CA2158366A1 (en) 1994-09-29
FI954321L (fi) 1995-09-14
PL176714B1 (pl) 1999-07-30
EP0689560A1 (de) 1996-01-03
CZ287737B6 (en) 2001-01-17
TW261623B (enExample) 1995-11-01
EP0689559B1 (de) 1997-06-11
FI954292L (fi) 1995-09-13
DE59403119D1 (de) 1997-07-17
CZ224695A3 (en) 1996-01-17
CN1119447A (zh) 1996-03-27
EP0689559A1 (de) 1996-01-03
CZ240095A3 (en) 1996-01-17
WO1994021706A1 (de) 1994-09-29
PL175777B1 (pl) 1999-02-26
FI954321A0 (fi) 1995-09-14
FI954292A0 (fi) 1995-09-13
KR960701118A (ko) 1996-02-24
FI107612B (fi) 2001-09-14
HU213902B (en) 1997-11-28
CA2158362A1 (en) 1994-09-29
HU9502671D0 (en) 1995-11-28

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